Title:
CUTTING METHOD FOR WAFER FOR MESA SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JPH065702
Kind Code:
A
Abstract:
PURPOSE: To achieve that a part inside each mesa groove in a wafer pasted on a wafer sheet is cut sharply, by means of a rotary blade, down to a metal layer formed on the rear of the wafer without lowering the life of the blade.
CONSTITUTION: A part inside each mesa groove 2 is cut, by means of a first thick blade C1, down to a part in which the first blade does not reach the rear of a wafer A. Then, the part is cut, by means of a second thin blade C2 down to a deep part in which the second blade exceeds a metal layer former on the rear of the wafer A and reaches a wafer sheet B on its rear side.
Inventors:
AKIYAMA MASAYOSHI
Application Number:
JP16142892A
Publication Date:
January 14, 1994
Filing Date:
June 19, 1992
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
B28D5/00; H01L21/301; H01L21/78; (IPC1-7): H01L21/78; B28D5/00
Attorney, Agent or Firm:
Akio Ishii (2 outside)