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WO/2022/110270A1 |
Provided is an MEMS microphone chip. The MEMS microphone chip comprises a base having a back cavity, and a capacitor structure arranged on the base, wherein the capacitor structure comprises a vibrating diaphragm fixed to the base, and a...
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WO/2022/110397A1 |
Provided by the present application are a silicon microphone and a processing method therefor. The silicon microphone comprises a base formed with a back cavity, a diaphragm, and a back plate. Through holes are provided in the back plate...
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WO/2022/110421A1 |
The present application relates to the technical field of microphones, and in particular relate to a MEMS microphone and a working control method therefor. The MEMS microphone comprises a first MEMS microphone unit, a second MEMS microph...
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WO/2022/110420A1 |
Provided are a piezoelectric MEMS microphone, and an array thereof and a preparation method therefor. The piezoelectric MEMS microphone comprises a substrate having a back cavity, and a piezoelectric vibrating diaphragm fixed on the subs...
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WO/2022/110442A1 |
The present application provides a piezoelectric MEMS microphone, comprising at least one piezoelectric MEMS unit. The piezoelectric MEMS unit comprises: a substrate, which comprises an annular peripheral wall defining an accommodation c...
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WO/2022/104864A1 |
The utility model provides an MEMS microphone, comprising a first circuit board, a frame provided on the first circuit board, and a second circuit board provided on the frame, wherein the first circuit board, the frame and the second cir...
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WO/2022/104932A1 |
Provided is a piezoelectric microphone, comprising: a substrate having an accommodation cavity; and a cantilever beam fixed to the substrate. The cantilever beam comprises a fixed portion fixed at the substrate and a free portion extendi...
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WO/2022/105007A1 |
A MEMS microphone chip, the MEMS microphone chip comprising a substrate having a rear cavity, a diaphragm disposed on the substrate, and a back plate covering the diaphragm and having an inner cavity an an interval from the diaphragm. Th...
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WO/2022/104930A1 |
A MEMS sensor (100), and a metal lead (40) electrically connecting a MEMS chip (20) and an ASIC chip (30). The metal lead (40) comprises a first solder joint (41) provided on the MEMS chip (20), a first extension portion (43) extending f...
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WO/2022/104931A1 |
A MEMS microphone chip, comprising a substrate having a rear cavity, a diaphragm disposed at an interval from the substrate, and a back plate disposed on the side of the diaphragm away from the substrate. A cavity in communication with t...
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WO/2022/099537A1 |
Disclosed in the present invention is a microelectromechanical system (MEMS) ultrasonic transducer-based miniature loudspeaker, comprising: a single or a plurality of MEMS ultrasonic transducers, configured to send an ultrasonic pulse or...
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WO/2022/100551A1 |
The present invention provides an MEMS piezoelectric microspeaker, a microspeaker unit, and an electronic device. The MEMS piezoelectric microspeaker comprises: an MEMS piezoelectric actuator for generating a speaker sound wave; and a mi...
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WO/2022/103260A1 |
The present invention is related to a harvesting module for converting vibrations, in particular sound vibrations, into electric energy, comprising a substrate, having a surface for holding electronic components a plurality of parallel a...
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WO/2022/095152A1 |
Provided by the present invention is a piezoelectric micro-electro-mechanical system (MEMS) transducer, comprising: a substrate, said substrate having a through-cavity; a plurality of beams, each of said beams having a first end and a se...
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WO/2022/087774A1 |
Disclosed is an extendable large-scale MEMS microphone array, comprising an upper computer and at least one array sub-system which are connected in the same local area network. The array sub-system comprises a group of array plates and a...
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WO/2022/089300A1 |
Disclosed in the present application are a bone voiceprint sensor module and an electronic device. The bone voiceprint sensor module comprises: an electric control board provided with a vibration transmission channel and having a first s...
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WO/2022/088496A1 |
Provided in the present invention are an integrated packaged module manufacturing method, an integrated packaged module, and an electronic device. The integrated packaged module manufacturing method comprises the following steps: assembl...
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WO/2022/091178A1 |
[Problem] To provide an electrostatic transducer, as well as a method for manufacturing the electrostatic transducer, that is applicable to various sensors, capable of achieving a high SN ratio, and capable of increasing the flexibility ...
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WO/2022/089299A1 |
Disclosed by the present application are a bone voiceprint sensor module and an electronic device. The bone voiceprint sensor module comprises: a substrate; a first housing, wherein one end of the first housing is arranged as open, the o...
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WO/2022/092187A1 |
Provided is a semiconductor integrated circuit device capable of receiving a signal of a MEMS transducer, the semiconductor integrated circuit device including: a power supply circuit 11 for a MEMS transducer 2; an input amplifier 12 for...
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WO/2022/083592A1 |
The present application provides a MEMS chip, comprising a substrate, and a diaphragm and a back electrode which are provided on the substrate, wherein the diaphragm comprises two conductive areas which are not electrically connected to ...
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WO/2022/082465A1 |
A sound-transmitting assembly, a microphone, a windproof member, a sound-transmitting device, and a sound-transmitting method, which relate to the technical field of electronic devices. The sound-transmitting assembly specifically compri...
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WO/2022/075114A1 |
This laminate structure (10) comprises: a frame body (20) which has a first surface (20a) and a second surface (20b) which face the directions opposite to each other in the thickness direction thereof, and which has a film body (22) supp...
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WO/2022/073261A1 |
Provided is an acoustic transducer, comprising a substrate, a support member, a fixing member, a moving member, a first set of comb teeth, a second set of comb teeth, and an elastic connection member; the substrate comprises a first surf...
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WO/2022/067945A1 |
The present invention provides an MEMS microphone, comprising a circuit board, a housing covering the circuit board to form an accommodation cavity, and an ASIC chip and an MEMS chip provided in the accommodation cavity; the circuit boar...
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WO/2022/067897A1 |
Provided are an ultrasonic microphone and a mobile terminal. The ultrasonic microphone comprises: a first substrate (1), at least one second substrate (2) disposed on the first substrate (1) and having a hollow portion (21), and a metal ...
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WO/2022/067975A1 |
The present invention provides an MEMS loudspeaker, comprising: an MEMS sound production unit comprising a substrate having a top surface and a bottom surface opposite to each other; a vibration sounding assembly comprising a diaphragm a...
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WO/2022/067981A1 |
A MEMS sound producing apparatus (100), comprising: a base (1) comprising an upper surface (11) and a lower surface (12) and provided with an acoustic chamber (13), the acoustic chamber (13) comprising an upper opening (131) and a lower ...
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WO/2022/061979A1 |
Provided is a bone conduction microphone. The bone conduction microphone comprises a circuit board assembly, a vibration assembly fixed to the circuit board assembly, a MEMS chip electrically connected to the circuit board assembly and p...
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WO/2022/062107A1 |
The present invention provides a sound production device and electronic equipment. The sound production device comprises: a first substrate provided with a first through hole in the center, a diaphragm arranged above the first substrate,...
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WO/2022/062001A1 |
Provided in the present utility model are a bone conduction microphone and a mobile terminal. The microphone comprises a first base plate, a second base plate, a cover plate, a backing plate, a first diaphragm, and a housing, which are s...
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WO/2022/062002A1 |
The present utility model provides a bone conduction microphone. The bone conduction microphone comprises a housing, a circuit board covering the housing to enclose an accommodating space, and an MEMS chip and an ASIC chip accommodated i...
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WO/2022/062986A1 |
Disclosed by the present application are a microelectromechanical structure, electronic cigarette switch, and electronic cigarette, said microelectromechanical structure comprising a substrate, having a cavity; a vibrating membrane, loca...
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WO/2022/062006A1 |
The present invention provides a condenser microphone and a manufacturing method therefor. The condenser microphone comprises a base having a back cavity, a backboard fixed on the base, and a vibrating diaphragm electrode arranged opposi...
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WO/2022/057198A1 |
Embodiments of the present application provide a silicon based microphone apparatus and an electronic device. The silicon based microphone apparatus comprises: a circuit board provided with at least one sound inlet hole; a shielding cove...
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WO/2022/056610A1 |
The present invention relates generally to the field of electret capsule, and more particularly to a circuit configuration of an impedance converter integrated in an electret capsule such as for use in condenser microphones. The electret...
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WO/2022/057197A1 |
Provided in the embodiments of the present application are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises: a circuit board, provided with at least two sound inlets; a shielding c...
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WO/2022/055206A1 |
The present invention relates to a MEMS microphone backplate having an acoustic hole structure for improving acoustic characteristics. A MEMS microphone backplate having an acoustic hole structure for improving acoustic characteristics a...
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WO/2022/053165A1 |
A MEMS component comprises a substrate with a substrate plane, a mass element which has an inoperative position and is designed to execute a deflection out of the inoperative position parallel to the substrate plane and in a fluid which ...
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WO/2022/048382A1 |
Disclosed in the present application is an MEMS structure, comprising: a substrate having a cavity; a first electrode layer which is suspended in the cavity; a first portion of a piezoelectric layer formed above the first electrode layer...
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WO/2022/049944A1 |
A first connection part (130a) connects a first tip part (122a) and a second tip part (122b) to each other. The first connection part (130a) is surrounded by: a dividing slit (142) which connects the center (122ac) of the first tip part ...
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WO/2022/044632A1 |
This sensor device comprises a conductive base substrate 11 that serves as a first electrode part kept at a reference potential, a membrane 15 that is provided so as to face the base substrate 11 and serves as a second electrode part tha...
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WO/2022/042309A1 |
Disclosed are a package housing, a waterproof air pressure sensor, and an electronic device. The package housing comprises a protective part, a solder paste welding part, a base plate, and a housing body having two ends thereof open; the...
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WO/2022/042308A1 |
Disclosed are an MEMS microphone and an electronic device. The MEMS microphone comprises a housing and a sensor chip provided in the housing. The housing comprises a bottom plate, a top plate opposite to the bottom plate, an enclosure pl...
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WO/2022/039875A1 |
A system includes a microphone unit coupled to a roof of an autonomous vehicle. The microphone unit includes a microphone board having a first opening. The microphone unit also includes a first microphone positioned over the first openin...
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WO/2022/039596A1 |
A micro-electro mechanical systems, MEMS, -based microphone (1) for detecting sound signals. The MEMS-based microphone (1) comprises a body (2), a resonator (3) and a cavity provided in the body (2), the resonator (3) covering at least a...
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WO/2022/039874A1 |
A system includes multiple microphone arrays positioned at different locations on a roof of an autonomous vehicle. Each microphone array includes two or more microphones, internal clocks of each microphone array are synchronized by a pro...
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WO/2022/036961A1 |
A full-band MEMS microphone having sound beams and sound tunnels, the microphone comprising a sensor, a sound cavity and a circuit board. The sensor comprises a vibrating diaphragm and a silicon back pole plate, a sound beam assembly is ...
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WO/2022/024654A1 |
The present invention achieves a substrate shape that can ensure a required substrate thickness, while also achieving good audio characteristics. A package (400) that has a microphone element (3) installed therein, and includes a substra...
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WO/2022/012042A1 |
Embodiments of the present application provide a sound collection device, a sound processing apparatus and method, a device, and a storage medium. The sound collection device comprises a housing and a silicon-based microphone device loca...
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