| Document |
Document Title |
|
WO/2020/094474A1 |
In an embodiment, a device includes a first high density interface in a first dilution fridge stage configured to receive a first set of transmission lines. In an embodiment, a device includes a second high density interface in a second ...
|
|
WO/2020/091943A1 |
A method is provided of forming a superconductor device interconnect structure. The method comprises forming a first dielectric layer overlying a substrate and forming a superconducting interconnect element in the first dielectric layer....
|
|
WO/2020/091425A1 |
The present invention relates to: a monocrystalline thin film having excellent crystal orientation; a method for manufacturing same; and a semiconductor device, a battery device, a superconducting wire, and a superconducting product, eac...
|
|
WO/2020/090259A1 |
The present invention addresses a problem of providing an MgB2 wire material having a small allowable bending radius, a superconducting coil using the same, and an MRI without lowering a critical current value and a critical current dens...
|
|
WO/2020/083840A1 |
A bulk superconductor device is disclosed, comprising a single grain RE-BCO element incorporating reinforcing fibres. The single grain (RE)BCO element comprises RE-211 pinning sites disposed in a RE-123 matrix and further comprises Ag. T...
|
|
WO/2020/086998A1 |
A superconductor tape and method for fabricating same are disclosed. Embodiments are directed to a superconductor tape including a substrate and a buffer stack. In one embodiment, the buffer stack includes: an Ion Beam-Assisted Depositio...
|
|
WO/2020/077416A1 |
This disclosure relates to fabrication of step edges to fabricate Josephson junctions. A method comprises forming a layer of resist over the surface. The layer of resist comprises openings to expose a selected area of the surface, thereb...
|
|
WO/2020/075150A1 |
This superconducting compound quantum computing circuit comprises: a circuit board in which a wiring pattern of circuit elements, which includes quantum bits and observation electrodes for observing the states of the quantum bits, and a ...
|
|
WO/2020/074492A1 |
The invention specifies a superconducting strip conductor (1) comprising - a strip-like substrate (3) with two main surfaces (31a, 31b) and - at least one planar superconducting layer (5) which is applied to a first main surface (31a) of...
|
|
WO/2020/069861A1 |
The invention relates to a superconducting current limiter device (1) having - a superconducting coil element (3), - a cryostat (5), within which the superconducting coil element (3) is arranged, - at least one power feed (7a, 7b) for co...
|
|
WO/2020/069623A1 |
A qubit circuit and a method for topological protection of a qubit circuit are described. The circuit comprises a plurality of physical superconducting qubits and a plurality of coupling devices interleaved between pairs of the physical ...
|
|
WO/2020/068201A1 |
The various embodiments described herein include methods, devices, and systems for fabricating and operating superconducting circuitry. In one aspect, an amplification circuit includes: (1) a superconducting component; (2) an amplifier c...
|
|
WO/2020/068762A1 |
A qubit includes a superconducting loop interrupted by a plurality of magnetic flux tunneling elements, such as DC SQUIDs, leaving superconducting islands between the elements. An effective transverse magnetic moment is formed by magneti...
|
|
WO/2020/064505A1 |
The present invention is in the field of oriented metal substrates for high temperature superconductor tapes. In particular, the present invention relates to a process for preparing metal tapes with a high degree of cube texture comprisi...
|
|
WO/2020/061268A1 |
The various embodiments described herein include methods, devices, and circuits for reducing or minimizing current crowding effects in manufactured superconductors. In some embodiments, a superconducting circuit includes: (1) a first com...
|
|
WO/2020/058370A1 |
Devices and methods that can facilitate hybrid under-bump metallization components are provided. According to an embodiment, a device comprises an under-bump metallization component (124B) that comprises a superconducting interconnect co...
|
|
WO/2020/048931A1 |
A method for forming a magnesium diboride construction includes providing a mass of grains of magnesium diboride, placing the grains into a canister to form a pre-sinter assembly and sealing the canister. The pre-sinter assembly is then ...
|
|
WO/2020/049019A1 |
The present invention is in the field of processes for the production of nanoparticles. It relates to a process for the preparation of nanoparticles comprising exposing a solution to microwave irradiation, wherein the solution contains (...
|
|
WO/2020/049279A1 |
According to a first aspect, there is provide an HTS current lead. The HTS current lead comprises an HTS cable comprising a plurality of HTS tapes; a braided sleeve around the HTS cable; and a stabiliser material impregnating the HTS cab...
|
|
WO/2020/048842A1 |
Techniques regarding parallel gradiometric SQUIDs and the manufacturing thereof are provided. An apparatus disclosed herein comprises a first pattern of superconducting material (104) located on a substrate (106). Also, the apparatus com...
|
|
WO/2020/043951A1 |
The invention relates to a device for magnetic measurements and/or magnetic imaging such as an MRI device or a hybrid MEG-MRI device. The device comprises an array of one or more detectors for the magnetic signal (103) and one or more co...
|
|
WO/2020/040910A1 |
A superconducting structure (10) includes a first superconducting device (12) having a plurality of first superconducting contact pads (16) disposed on a top side of a first superconducting device, a second superconducting device (22) ha...
|
|
WO/2020/038909A1 |
The invention relates to a rotor (5) for an electrical machine (2). Said rotor comprises a rotor housing (7), a winding carrier (9) arranged therein, at least one first axial connecting element (8a, 8b) mechanically interconnecting the w...
|
|
WO/2020/035672A1 |
A superconducting quantum computing circuit package (1). The package contains a substrate (2) on which a circuit is formed, the circuit including a plurality of circuit elements. The substrate (2) includes holes (8) arranged between the ...
|
|
WO/2020/027972A1 |
Non-destructive read out (NDRO) circuits are provided for use in reciprocal quantum logic (RQL) superconducting systems. Each NDRO circuit includes a "body" circuit that provides a single or multi-state sub-critical bias current to one o...
|
|
WO/2020/025610A1 |
Symmetrical qubits with reduced far-field radiation are provided. In one example, a qubit device (100) includes a first group (110) of superconducting capacitor pads positioned about a defined location of the qubit device, wherein the fi...
|
|
WO/2020/008076A1 |
The present disclosure further relates to nanostructures, in particular hybrid superconductor-semiconductor nanostructures with patterned growth of various layers for use in nanoscale electronic devices, such as hybrid superconductor-sem...
|
|
WO/2020/003579A1 |
Provided is a superconducting magnet (100) comprising a superconducting coil (110), a coolant vessel (120), a radiation shield (140), a first pipe (150), a second pipe (160), a refrigerator (165), and a connection pipe (170). The refrige...
|
|
WO/2020/005534A1 |
One example includes a magnetic flux source system that includes a tunable current element (50). The tunable current element includes a SQUID (52) inductively coupled to a first control line (54) that conducts a first control current tha...
|
|
WO/2019/238600A1 |
Techniques related to vertical silicon-on-metal superconducting quantum interference devices and method of fabricating the same are provided. Also provided are associated flux control and biasing circuitry. A superconductor structure (50...
|
|
WO/2019/239650A1 |
Provided are novel cooling system for a superconducting electromagnet, and a superconducting electromagnet device in which the cooling system is used. The superconducting electromagnet device according to the present invention comprises ...
|
|
WO/2019/229923A1 |
A superconductive magnet (100) comprises a superconductive coil (110), a refrigerant container (120), a radiation shield (130), a vacuum container (140), a first pipe (150), a freezer (153), a partition (156), a second pipe (160), a thir...
|
|
WO/2019/224830A1 |
A fault current limiter unit is disclosed, the fault current limiter unit comprises a ceramic substrate and superconducting layer located on the substrate. The substrate is selected from high diffusivity ceramic substrates such as sapphi...
|
|
WO/2019/224133A1 |
Techniques related to a three-dimensional integration for qubits on crystalline dielectric and method of fabricating the same are provided. A superconductor structure comprises a first wafer (102) comprising a first crystalline silicon l...
|
|
WO/2019/224155A1 |
Techniques related to a three-dimensional integration for qubits on multiple height crystalline dielectric and method of fabricating the same are provided. A superconductor structure comprises a first buried layer (302) that comprises fi...
|
|
WO/2019/220129A1 |
A magnetic hologram is provided, comprising a plurality of sheets (10) of one or more superconducting materials arranged in a stack, wherein each of the plurality of sheets of superconducting material comprises a respective array of non-...
|
|
WO/2019/219835A1 |
The invention relates to a superconducting current limiter comprising at least one superconductor-type conductor (3) wound up to form a coil (2) extending in a single plane and connecting a first electrical connection terminal to a secon...
|
|
WO/2019/214943A1 |
The subject disclosure relates generally to a method of implementing magnetic shielding walls with specific respective dimensions to reduce crosstalk between transmission lines in wire-bonds for supercomputing chipsets. In one embodiment...
|
|
WO/2019/217102A1 |
Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the...
|
|
WO/2019/198402A1 |
The present invention provides a manufacturing method of a superconducting thin film wire which improves crystallinity and properties of a thin film of a compound comprising elements with very different vapor pressures. The manufacturing...
|
|
WO/2019/195015A1 |
In an example, a system (100) comprises a first optical device (110), a second optical device (120), and an optical modulator (130). The first optical device (110), in a non-cryogenic environment (111), receives a light signal, outputs t...
|
|
WO/2019/179731A1 |
A chip surface base device structure (300) comprises a first superconducting material (112) physically coupled to a crystalline substrate (206A, 206B), wherein the crystalline substrate is physically coupled to a second superconducting m...
|
|
WO/2019/179733A1 |
A chip surface base device structure (200) comprises a superconducting material (214A) located on a first side of a substrate (106A, 106B), and a second superconducting material located (104) on a second side of the substrate and stacked...
|
|
WO/2019/180267A1 |
The present disclosure relates to a method for manufacturing of specially designed substrates for growth of nanostructures and patterned growth on said nanostructures. The present disclosure further relates to nanostructures, in particul...
|
|
WO/2019/181200A1 |
A superconductive cable (1) comprises a superconductive cable core (2) and a corrugated pipe (21) that accommodates the superconductive cable core (2). The superconductive cable core (2) has a corrugated pipe (11), a superconductive cond...
|
|
WO/2019/179732A1 |
A chip surface base device structure (1100) comprises a substrate (206A, 206B) comprising crystalline silicon that is coupled with a first superconducting layer (104), wherein the first superconducting layer is coupled with a second subs...
|
|
WO/2019/176557A1 |
Provided is a superconducting coil device which is able to reduce the production cost in comparison to conventional superconducting coil devices. A superconducting coil device (100) according to the present invention is provided with a b...
|
|
WO/2019/172343A1 |
The present invention facilitates bending and installing, for example, a stacked conductor superconducting cable. When bending a superconducting cable having a stacked structure in which a plurality of stages of tape wires are stacked, a...
|
|
WO/2019/173593A1 |
In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb-Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.
|
|
WO/2019/160869A1 |
The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a superconducting component includes: (1) a superconductor having a plurality of alternating narrow an...
|
