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WO/2023/274820A1 |
The scope of the invention relates to flameproof polyamide molding compounds having a low phosphorus content.
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WO/2022/271338A1 |
Amine-substituted copolymers that may include an amine-substituted 2-amino-ethan-1-ol moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diam...
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WO/2022/264626A1 |
A dielectric ceramic composition according to the present invention contains a main component that has a Bi2Ti4O11 type structure and a sub-component; the main component contains at least one group A element that is selected from the gro...
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WO/2022/264991A1 |
To provide a glass-ceramic dielectric having a high dielectric constant at normal temperature, little change in capacitance from room temperature to 250°C, and a small tan δ. A glass-ceramic material characterized by containing, in mol...
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WO/2022/261015A1 |
A polymeric composition includes an ethylene-silane copolymer comprising units derived from ethylene monomer and a silane monomer, wherein the ethylene-silane copolymer has a copolymerized silane content from 0.48 mol% to 1.00 mol%, a Br...
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WO/2022/249940A1 |
Provided are: an inorganic oxide powder which makes it possible to simultaneously attain a high dielectric constant and a low dielectric loss tangent when filling with a resin material; a method for producing the same; and a resin compos...
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WO/2022/248310A1 |
The present invention relates to a crosslinkable polyolefin composition for wire and cable applications, and particularly for low voltage (LV) and medium voltage (MV) cables, to a cable comprising said compositions and to the use of said...
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WO/2022/251566A1 |
The present application discloses a thermally conductive, electrically insulating film comprising: a thermoplastic resin accounting for 15-50% of the weight of the thermally conductive, electrically insulating film, and a thermally condu...
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WO/2022/249941A1 |
Provided are an inorganic oxide powder that is capable of simultaneously achieving high dielectric constant and low dielectric loss tangent when a resin material is filled therewith, a method for producing the inorganic oxide powder, and...
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WO/2022/242026A1 |
A cross-linked polyethylene composite material, and a preparation method therefor and an application thereof, relating to the technical field of high-voltage alternating-current cable insulation. The cross-linked polyethylene composite m...
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WO/2022/239744A1 |
The purpose of the present invention is to provide: a composition for forming a dielectric ceramic, which makes it possible to produce a perovskite-type composite oxide that has a small particle diameter and is highly crystalline; and a ...
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WO/2022/239191A1 |
This insulating molded body includes a thermosetting resin mixture, wherein the thermosetting resin mixture includes a thermosetting resin and oblate spherical hollow resin beads, the oblate spherical hollow resin beads have a hollow sec...
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WO/2022/239203A1 |
This insulating varnish composition comprises: a thermosetting resin (15) which contains at least one resin that is selected from among an epoxy resin, a vinyl ester resin, and an unsaturated polyester resin that contains a high molecula...
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WO/2022/234365A1 |
Electronic telecommunication articles are described comprising a layer of fluoropolymer composition comprising: an amorphous fluoropolymer comprising at least 80, 85, or 90% by weight of polymerized units perfluorinated monomers includin...
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WO/2022/233733A1 |
The present invention is directed to a process for producing a thermally treated biaxially oriented polypropylene film and to a thermally treated biaxially oriented polypropylene film obtained by the process. The present invention furthe...
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WO/2022/234364A1 |
Electronic telecommunication articles are described comprising a layer of fluoropolymer composition comprising a fluoropolymer or fluoropolymer blend comprising at least 1 wt.% and less than 30 wt.% of polymerized units of unsaturated (p...
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WO/2022/234363A1 |
An electronic telecommunication article is described comprising a layer of fluoropolymer composition comprising an uncrosslinked fluoropolymer comprising at least 80, 85, or 90% by weight of polymerized units perfluorinated monomers incl...
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WO/2022/234358A1 |
Electronic telecommunication article is described comprising a crosslinked fluoropolymer layer. The crosslinked fluoropolymer layer comprises the reaction product of a fluoropolymer and a fluorinated curing agent. Suitable fluorinated cu...
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WO/2022/230475A1 |
The present invention provides: a glass ceramic dielectric material which can be sintered at temperatures less than or equal to 1000°C and which has low dielectric characteristics and a high thermal expansion coefficient in a high-frequ...
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WO/2022/224994A1 |
This insulation-covered conductive wire is provided with: a conductive wire; a non-adherent, laterally wound insulation section for covering the outer periphery of the conductive wire without adhering thereto, formed by laterally winding...
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WO/2022/225012A1 |
A film-forming composition that comprises a triazine ring-containing polymer, which contains a repeating unit structure represented by formula (1) and has at least one terminal triazine ring and in which at least a part of the terminal t...
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WO/2022/224486A1 |
Provided is an insulated wire comprising a conductor and an insulating layer covering the conductor, wherein the insulating layer includes a first resin, the first resin is a polyimide, the glass transition temperature of the polyimide i...
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WO/2022/223161A1 |
A bushing (1) comprises an electrical conductor (2) and a condenser body (4) through which the electrical conductor (2) extends, wherein the condenser body (4) comprises electrically insulating layers (7) and electrically conducting laye...
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WO/2022/218465A1 |
The invention relates to a cable connection unit (1) for a connection box (10), consisting of: a cable (4), which has at least four electrical conductors (5) surrounded by a cable sheath; a cable seal (3), which radially surrounds the ca...
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WO/2022/221117A1 |
A polymeric composition includes a resin including an ethylene-based polymer and a copolymer of ethylene and an alpha olefin comonomer. The resin has a High Mw Comonomer Content of 3.2 wt% or greater based on a total weight of the resin ...
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WO/2022/220261A1 |
An insulating resin sheet according to the present invention is formed from a curable resin composition that contains a thermosetting resin, a curing agent and an insulating heat-dissipating filler having a thermal conductivity of 10 W/m...
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WO/2022/216136A1 |
Provided is an electrode composition for electrospraying. The electrode composition for electrospraying according to an embodiment of the present invention is for obtaining an electrode having an average thickness of at most 1.0 μm when...
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WO/2022/216283A1 |
A digital device includes a consumable microfluidic receptacle including a ground first sheet and a second sheet and is to receive a liquid polar droplet between the first and second sheets. The second sheet comprises a substrate definin...
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WO/2022/210019A1 |
Provided is a polyamide resin composition that has high electrical resistance in a high temperature range (around 130°C) and high heat resistance. The polyamide resin composition includes: a polyamide resin that includes a component uni...
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WO/2022/212143A1 |
A moisture-curable semiconductive formulation consisting essentially of a mixture of an ethylene/(alkenyl-functional hydrolyzable silane)/(optional olefinic hydrocarbon) copolymer and a conventional carbon black. Also discovered methods ...
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WO/2022/212137A1 |
A moisture-curable semiconductive formulation consisting essentially of a polyethylene-based polymer blend (uncured) and a conventional carbon black. The polyethylene-based polymer blend comprises a mixture of an ethylene/(alkenyl-functi...
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WO/2022/208264A1 |
A cable assembly is disclosed. The cable assembly includes an electrically conductive wire and a dielectric layer at least partially circumscribing the wire, the dielectric layer defining an internal cavity and the wire being disposed wi...
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WO/2022/200396A1 |
The present invention relates to a polypropylene composition comprising a copolymer of propylene and comonomer units selected from ethylene and alpha- olefins having from 4 to 12 carbon atoms with a total amount of comonomer units of fro...
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WO/2022/202363A1 |
This insulation film-provided flat conductive plate (1) comprises a flat conductive plate (10) which is a punched product, and an insulation film (20) at least partially film the flat conductive plate (10). The insulation film (20) is an...
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WO/2022/200395A1 |
The present invention relates to a polypropylene composition comprising (A) a copolymer of propylene and comonomer units selected from ethylene and alpha-olefins having from 4 to 12 carbon atoms with a total amount of comonomer units of ...
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WO/2022/202703A1 |
Provided is a low-viscosity diester compound that is capable of, when combined with a crosslinkable resin, providing a resin composition exhibiting high flowability. This diester compound is represented by formula (X). (In the formula: X...
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WO/2022/196711A1 |
Provided is a polyamide resin composition that has a high electrical resistance in a high temperature region (around 130°C) while having a high heat resistance. This polyamide resin composition comprises polyamide resin that contains a ...
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WO/2022/194897A1 |
A semiconductive polymer composition comprising: (a) an ethylene C1-2-alkyl (meth)acrylate copolymer having an MFR2 of 4.5 g/10min or more and a C1-2-alkyl (meth)acrylate content of at least 9.0 wt% based on the total weight of the ethyl...
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WO/2022/196143A1 |
An insulation layer forming-composition comprising boehmite, a binder, and an organic solvent, wherein when a thermogravimetric analysis is peformed on the boehmite and measurement is conducted at a temperature elevation rate of 10°C/mi...
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WO/2022/194898A1 |
A semiconductive polymer composition comprising: (a) an ethylene alkyl (meth) acrylate copolymer; (b) 15 to 48 wt% carbon black having an iodine adsorption number of 85 to 140 mg/g (ASTM D 1510-19a), an oil absorption number of 90 to 110...
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WO/2022/190600A1 |
Provided is an insulating resin composition excelling in embeddability in metal wiring patterns, semiconductor IC, etc., even when highly filled with an inorganic filler. The insulating resin composition comprises an epoxy resin (A), a m...
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WO/2022/186191A1 |
[Problem] To provide hexagonal boron nitride agglomerated particles and a hexagonal boron nitride powder, each of which can impart extremely high dielectric strength and heat conductivity to a resin composition produced by filling the he...
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WO/2022/186825A1 |
Processes for processing bio-sourced oil to produce bio-sourced oil dielectric fluids can be carried out using an apparatus mounted on a mobile transport platform system having a total footprint of no more than about 30 m2. The processes...
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WO/2022/186824A1 |
Processes for processing bio-sourced oil to produce bio-sourced oil dielectric fluids can be carried out using an apparatus mounted on a mobile transport platform system having a total footprint of no more than about 30 m2. The processes...
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WO/2022/185910A1 |
Provided is a two-component curable polyurethane resin composition that exhibits excellent compatibility, adhesion, and low dielectric properties. A two-component curable polyurethane resin composition according to an embodiment of the...
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WO/2022/181240A1 |
Provided is a copolymer that contains tetrafluoroethylene units and perfluoro(propyl vinyl ether) units, the perfluoro(propyl vinyl ether) unit content being 3.5–4.2 mass% relative to the total monomer units, the melt flow rate of the ...
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WO/2022/181233A1 |
Provided is a copolymer that contains tetrafluoroethylene units and perfluoro(propyl vinyl ether) units, the perfluoro(propyl vinyl ether) unit content being 2.8–3.9 mass% relative to the total monomer units, the melt flow rate of the ...
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WO/2022/181241A1 |
Provided is a copolymer that contains tetrafluoroethylene units and perfluoro(propyl vinyl ether) units, the perfluoro(propyl vinyl ether) unit content being 3.9–5.5 mass% relative to the total monomer units, the melt flow rate of the ...
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WO/2022/180939A1 |
A resin composition which comprises a base resin including a polyolefin, a styrene-based elastomer including styrene units, and a copolymer comprising styrene units and maleic anhydride units, wherein the content of the copolymer is 0.5 ...
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WO/2022/181246A1 |
Provided is a copolymer that contains tetrafluoroethylene units and perfluoro(propyl vinyl ether) units, the perfluoro(propyl vinyl ether) unit content being 4.6–5.2 mass% relative to the total monomer units, the melt flow rate of the ...
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