| Document |
Document Title |
|
JP4216828B2 |
A system employing a resonating device (20) and a controller (31) implements a method involving an establishment by the controller of open-loop oscillations of the resonating device (20) at a resonating frequency of the resonating device...
|
|
JP2008545987A |
Rate sensor having a plurality of generally planar masses, a drive axis in the planes of the masses, an input axis perpendicular to the drive axis, and sense axes perpendicular to the drive axis and the input axis. The masses are driven ...
|
|
JP2008545988A |
Rate sensor having a plurality of generally planar masses, a drive axis in the plane of each of the masses, an input axis perpendicular to the drive axes, and sense axes perpendicular to the drive axes and the input axis. The masses are ...
|
|
JP2008286795A |
To mount a structural packaging assembly for supporting multi-functional optical chip or the like to a gyroscopic unit.An example assembly includes a housing mounted to a mounting plate. The chip is located in the housing, which in turn ...
|
|
JP2008542788A |
Rate sensor having a plurality of generally planar masses, a drive axis in the planes of the masses, an input axis perpendicular to the drive axis, and sense axes perpendicular to the drive axis and the input axis. The masses are driven ...
|
|
JP2008281555A |
To efficiently and effectively remove noise and/or second harmonic from rate input of gyro.Systems and methods for reducing driver noise in a Micro Electro-Mechanical Systems (MEMS) gyroscope system are disclosed. An example system inclu...
|
|
JP2008539435A |
A control system for a mechanical oscillator having a sinusoidal drive signal with a frequency that is a fractional multiple of a frequency of a signal of the mechanical oscillator. The drive signal may be in phase and in registration wi...
|
|
JP4154245B2 |
A sensor array, in particular a micromechanical sensor array, and methods for manufacturing the sensor array are provided, which sensor array includes a sensor section for supplying certain sensor signals, and a cover section provided on...
|
|
JP2008134244A |
To provide a device and method monitoring angular velocity in effective interval until proof mass reaches natural resonance frequency of the vibration in order to supply further rapid input to an inertial measurement unit.A signal proces...
|
|
JP2008134243A |
To provide a system and method for determining acceleration along a motor axis of a MEMS gyroscope.The system and method for determining acceleration along the motor axis of the MEMS gyroscope includes a processor. The processor includes...
|
|
JP2008513800A |
The present invention relates to measuring devices for use in physical measuring, and in particular to capacitive sensors. In the sensor according to the invention, the shape of the stationary electrode (3), (4), (12), (17-20), (27-28) i...
|
|
JP2008509820A |
According to aspects of the invention, the process is based on a bonded, etch-back insulator silicon (hereafter referred to as BESOI) method. The BESOI method includes silicon (SOI) wafers on insulators, and silicon (SOI) wafers on insul...
|
|
JP2008074392A |
To provide a method for controlling a driving state of an automobile.A method of controlling the handling of a vehicle is provided, and the method calls for at least the vehicle weight (G) and the instantaneous location of the center of ...
|
|
JP2008507714A |
Cross-monitoring sensor system and method in which a plurality of sensors each having a sensing element, circuitry for processing signals from the sensing element, an output interface for delivering processed signals, and an auxiliary in...
|
|
JP2008507713A |
Angular rate sensor and method in which the parameters of a circuit which provides drive signals and processes signals from a sensing element are configured electronically by a programmable memory. Being configured in this manner, the ci...
|
|
JP2008505315A |
Devices and methods for reducing rate bias errors and scale factor errors in a MEMS gyroscope are disclosed. A MEMS actuator device in accordance with an illustrative embodiment of the present invention can include at least one substrate...
|
|
JP4046790B2 |
The yawing motion, the float angle, the longitudinal velocity of the vehicle, the front wheel steering angle, and optionally the rear wheel steering angle are determined. When certain driving conditions are present, at least the variable...
|
|
JP2008014928A |
To provide a new inertial measurement unit capable of shortening or eliminating the calibration time.This inertia measurement unit 10 comprises a first subassembly having one or more inertia sensors, a second subassembly having support e...
|
|
JP2008501981A |
The present invention provides a MEMS vibratory type inertial sensor that has some level of built in test to help improve the reliability by helping to identify erroneous or misleading data provided by the inertial sensor. In one illustr...
|
|
JP2008008884A |
To provide an MEMS device and a method using one or more electrodes coupled to a time-varying rebalancing voltage.In one embodiment of the present invention, MEMS inertial sensors 10, 142 include one or more of proof masses 12, 14, 172, ...
|
|
JP2007309936A |
To provide a static electricity MEMS drive device with lowest position sensitivity. The Micro Electro Mechanic System (MEMS) closed loop inertial device 38 includes a vertical comb drive device which shows improved performance under vibr...
|
|
JP4014640B2 |
A magnetohydrodynamic sensor having an annular or circular sense channel containing a conductive liquid proof mass. A radial flow is introduced into the annular channel which, in response to rotation of the device, produces a coriolis fo...
|
|
JP2007530918A |
There is a sensor element (24) for an electronic sensor device (20). The sensor element (24) may have a substrate (43), a pair of proof masses (34a, 34b), a set of drive beams (44), and at least one base beam (46). The pair of proof mass...
|
|
JP2007218905A |
To provide a structure and method for frequency shift in the rotational higher harmonics in the MEMD device. The illustrative MEMS device can include a substrate, a sensing electrode attached to the substrate, and a proof mass abutting a...
|
|
JP2007519925A |
Micromachined vibratory gyroscope and method in which the vibrating masses are coupled electronically, e.g. by electronically adjusting the resonance frequency of one or more of the masses so that all of the masses have the same resonanc...
|
|
JP2007163471A |
To provide a shield for use of an inertial measurement unit (IMU), including an inner ring with an external surface and an outer ring with an internal surface in one embodiment.The inner ring of the shield includes a recess, and the oute...
|
|
JP2007121304A |
To decrease a fault error in a position alignment in a microelectronic machine system.The method comprises: a manufacturing step of a first silicon wafer segment 110 comprising one pair of accelerometers 120-1, 120-2 which are arranged t...
|
|
JP2007069343A |
To provide a method to manufacture a micromechanical mass spring system including a mass element and a spring.A substrate is provided and etched so as to demarcate a section in which the spring is formed. A surface layer is formed on the...
|
|
JP2007504476A |
An inertial sensor system has a base, an inertial sensor, and an isolator mount. The isolator mount fastens the inertial sensor to the base, and the isolator mount includes a bolt and first and second vibration absorbing members. The bol...
|
|
JP2006525132A |
A proof mass ( 11 ) for a MEMS device is provided herein. The proof mass comprises a base ( 13 ) comprising a semiconductor material, and at least one appendage ( 15 ) adjoined to said base by way of a stem ( 21 ). The appendage ( 15 ) c...
|
|
JP2006521688A |
A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base p...
|
|
JP2006215016A |
To provide a sensor having both functions of a gyroscope and an accelerometer.The sensor includes a pair of mass bodies, an anchor, a pair of support beams, driving systems, and a displacement measuring device. A pair of the mass bodies ...
|
|
JP2006518673A |
A packaged microchip has an isolator that minimizes stress transmission from its package to its microchip. To that end, the packaged microchip includes a stress sensitive microchip having a bottom surface with a bottom surface area, and ...
|
|
JP2006503306A |
A method for extracting components from signals in an electronic sensor (50) having a sensing element (52). The sensing element (52) generates a first signal (60) and a second signal (62). The method comprises the steps of: receiving the...
|
|
JP2005538551A |
A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. ...
|
|
JP3713019B2 |
A gyroscope which comprises: a driving fixed electrode (26) being fixed; a driving displacement electrode (24) being opposite to the driving fixed electrode, and being able to be displaced in a first direction; an inertial mass (23) bein...
|
|
JP2005289347A |
To provide a method for evaluating a dangerous lateral acceleration value of a vehicle as early as possible.The evaluated value of the lateral acceleration is useful for preventing falling of the vehicle particularly in the dangerous tra...
|
|
JP2005249784A |
To attain a large oscillation amplitude without resonance, in a four-degrees-of-freedom nonresonant micromachined gyroscope, using dynamical amplification both in a 2-degree-of-freedom drive-directional oscillator and a 2-degree-of-freed...
|
|
JP2005516221A |
Devices fabricated on a wafer are encapsulated by forming a pattern of bond rings on a cap wafer and aligning and bonding the two wafers together, under thermo-compression, so that an operational part (22) of each device (20) is surround...
|
|
JP2004525352A |
A method of producing a semiconductor component, e.g., a multilayer semiconductor component, and a semiconductor component produced by this method, where the semiconductor component has, e.g., a mobile mass, i.e., an oscillator structure...
|
|
JP3544979B2 |
A micromachined push-pull accelerometer formed with dual vibrating beam transducers in one plane of a silicon substrate includes a pair of proof masses or pendulums supported by flexures formed in a plane adjacent a surface of the silico...
|
|
JP2004520177A |
A method of making a micro electromechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on a first substrate or wafer; and at least one contact structure and a mating structure are define...
|
|
JP2004516194A |
A brake regulating system particularly suitable for stabilizing the motion of a commercial vehicle is described, in which a control unit outputs, as a function of a number of input variables, a predefined manipulated variable for the bra...
|
|
JP2004506203A |
A micromechanical component includes a substrate and a movable structure situated on the surface of the substrate. The movable structure is movable parallel to the surface of the substrate. The structure is surrounded by a frame having a...
|
|
JP2003531359A |
Gyroscope has inner drive gimbals (2) comprising C-shaped frames and intermeshed with comb-shaped drive electrodes (5). The outer sensor gimbals (1) are controlled by a tuning electrode (6). An electrostatic drive and a capacitance varia...
|
|
JP2003510192A |
The method of the present invention provides a process for manufacturing MEMS devices having more precisely defined mechanical and/or electromechanical members. The method of the present invention begins by providing a partially sacrific...
|
|
JP2003510194A |
A micro machined structure includes one or more temporary bridges for temporarily coupling the micro machined structure to a support structure.
|
|
JP2003509669A |
A structure and arrangement for improving the accuracy and efficiency of an angular rate sensing gyroscope is herein disclosed. Voltage pick-off conductors are applied to an area of the surface of a resonating element of an angular rate ...
|
|
JP2003501663A |
A device for determining the frequency and/or the amplitude of a vibrating structure includes a vibrating element (2) and a pair of position sensors (10, 11) for the determination of the deflection of the vibrating element (2). The posit...
|
|
JP2003004481A |
To provide a compact and inexpensive device for detecting three- dimensional movements.Electrodes (70 and 72) are arranged in three-dimensionally and freely moved a needle (50) and generates capacitance in-between with electrodes (80 and...
|
