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JP2008102527A |
To provide a heat spreader which reduces the temperature difference arising in using a display device.The heat spreaders 10 for the display device, such as a plasma display panel, a light emitting diode, or a liquid crystal display inclu...
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JP4074413B2 |
The frames (501 - 504 and 511 - 514) are drawn through at crossing points (320) of the heat carrier channels (580, 581, 590, 591,592). The static mixer insert comprises two or more neighboring layers and parallel frames. The frames of ea...
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JP4052587B2 |
A method with associated equipment for feeding two gases into and out of a multi-channel monolithic structure. The two gases will normally be gases with different chemical and/or physical properties. The first gas and the second gas are ...
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JP2008501928A |
A heat exchange device comprising a fluid flow passage having a plurality of successive segments in fluid flow communication with one another, the segments being adapted to maintain a developing flow therein and thereby improve heat tran...
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JP2008501099A |
A Stirling cycle machine heat exchanger and a method for making the heat exchanger including, forming an annular ring of a solid heat conductive mass, the annular ring having a central axis and having axially opposite faces. A plurality ...
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JP2007538384A |
The present invention is a spray cooling thermal management device that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon the surface of the component. In areas of the c...
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JP2007532854A |
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions re...
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JP3998592B2 |
A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling...
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JP3996300B2 |
To enhance a thermal efficiency and to enhance a strength of a cylindrical heat exchange cylinder, by forming the heat exchange cylinder in an integral structure of an aluminum material having a plurality of holes penetrating from one en...
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JP3988887B2 |
The invention relates to a connection unit having a multi-channel heat exchanger with high-pressure channels and low-pressure channels and a connection element with a high-pressure reservoir and a low-pressure reservoir, both with a conn...
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JP3972863B2 |
In a cooling system for cooling a heating element mounted in a vehicle, a radiator is located at a position higher than a heat sink, which absorbs heat from the heating element. When the amount of heat generated from the heating element,...
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JP3947993B2 |
To provide a pressure-resisting heat exchange element for a high- pressure air conditioner. The present heat exchanger tube is designed for a heat exchanger inside the high-pressure air conditioner of an automobile, in particular. The tu...
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JP3945208B2 |
To provide a high-performance and low-cost heat exchange tube and a heat exchanger by extrusion-molding the heat exchange tube 100 improving the molding performance and disposed with multiple pores into multiple rows in the thickness dir...
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JP3903851B2 |
To improve mounting performance to a vehicle in a heat exchanger wherein a radiator and an internal heat exchanger exchanging heat of a high pressure side refrigerant and a low pressure side refrigerant are integrated. The internal heat ...
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JP2007506066A |
Geometric parameters of micro channel aspect ratios are determined for heat exchangers for gaseous fluids in which micro channels have a surface area density greater than 10000 m2/m3 in the alternate situations a) where volume is constan...
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JP3892859B2 |
To provide a support structure stably supporting a turbine nozzle made of ceramic by strongly pressing it against a nozzle support with large pressing force generated in a small space. The ceramic turbine nozzle 7 is disposed on an inlet...
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JP3869206B2 |
A microminiature laminated heat exchanger for use in a cryogenic probe, and a method of manufacture. The heat exchanger has high and low pressure flow patterns etched into oxygen free copper sheets, with the flow patterns being tortuous ...
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JP3826791B2 |
To provide a heat exchanger capable of reducing costs and improving reliability of air tightness by simplifying a connection structure between a fluid passage hole 100a in a porous flat tube 100 and header tanks 210, 220. Slits 110a, 120...
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JP2006521025A |
A module is formed in which semiconductor components are soldered to an electrically conductive heat sink. The electrically conductive heat sink is formed so that it will serve as an electrical bus in an electronic device. The chips of t...
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JP2006516068A |
A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first tempe...
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JP2006514734A |
A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold laye...
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JP2006508714A |
A method for implantation of an intervertebral implant for fusing vertebrae is disclosed. The implant may comprise a body constructed of a radiolucent material and having a thickness between a superior and an inferior face greatest at a ...
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JP2005351265A |
To provide a turbine engine shroud segment (10) including a surface exposed to high-temperature engine gas stream, a segment hanger and a shroud assembly.A segment projecting portion (26) includes segment support surfaces (28, 30) spaced...
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JP2005250441A |
To enable the separation and transfer of graphite particles without peeling off with a heat spreader which comprises a graphite film for a display device, such as a plasma display panel, a light emitting diode or liquid crystal display.T...
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JP2005229020A |
To provide a liquid-cooled system that can be easily and freely adopted in various kinds of electronic equipment, by solving the problems in starting that occurs, when adopting a centrifugal pump.In the liquid-cooled system, a CPU requir...
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JP2005229047A |
To provide a personal computer, a server, etc., called the desktop type or the notebook type, equipped with a cooling system having high cooling efficiency.In the electronic equipment with the liquid cooling system, a CPU 200 to be coole...
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JP3112376U |
A skived-fin annular heat sink is manufactured via a skived-fin technology and includes at least one bottom board and a plurality of fins. The at least one bottom board is bended to form a closed-shaped. The fins are extended outwardly f...
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JP2005197625A |
To provide a compound multiflow heat dispersion device which is constituted of a plurality of heat dispersion units with a wide-ranging path.The compound multiflow heat dispersion device 100 is constituted of a plurality of heat dispersi...
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JP2005516779A |
An assembly for changing the temperature of ultrahigh-pressure fluid as it flows through ultrahigh-pressure tubing includes several thermally conductive blocks. Each block has a first bore through which the ultrahigh-pressure tubing pass...
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JP2005127611A |
To provide a heat exchanger capable of reducing the number of components and improving its assembling workability.This heat exchanger 1 performs the heat exchange between a refrigerant of high temperature and high pressure and a refriger...
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JP2005123194A |
To prevent cracks and breakages in a panel unit due to stress application by heat generation of a plasma display.A method for applying heat spreaders to a plurality of plasma display panels includes a step of providing a plurality of hea...
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JP2005122181A |
To provide a heat spreader for an emissive display device, such as a plasma display panel or a light-emitting diode.The heat spreader for the emissive display device, such as the plasma display panel or a light-emitting diode, includes a...
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JP2005079483A |
To provide a highly efficient thermal diffusion structure for miniaturization of electronic components in an electronic apparatus and higher functionality thereof.A liquid sealing portion 20 is provided on a cover on the side of an elect...
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JP2004529311A |
A heat exchanger comprising a plurality of first conduits (5) for a first fluid and a plurality of second conduits (6) for a second fluid. The first conduits (5) and the second conduits (6) are embedded in a heat conductive solid matrix ...
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JP2004506095A |
The present invention is beryllium-aluminum composed of beryllium (A) or similar grains, uniformly dispersed in aluminum (B) or a similar metal matrix, with a size of about 1 to about 20 microns. It relates to a composite or similar, the...
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JP2004506092A |
The invention concerns a method for making heat-exchanging devices used in particular in the field of electronics, telecommunications, aeronautics and/or space exploration. For example, it may consist of heat exchangers for onboard elect...
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JP2004003817A |
To provide a fluid temperature regulating device provided with a heat transfer plate which retains resistance against corrosive fluid, and mechanical strength and durability under the repeating environment of a temperature cycle accordin...
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JP2003294381A |
To improve heat conduction between a heat sink and a heating device.The heat sink includes at least one heat sink fin 306 with an opening 602. The opening 602 is sized to fit a thermal device 304 when the thermal device 304 is at a first...
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JP2003106784A |
To provide a heat exchanger including a first coolant passage and a second coolant passage formed on a long shape main body part, for exchanging heat of a fluid flowing in the first coolant passage and a fluid flowing in the second coola...
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JP2003508893A |
A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, spr...
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JP2003028589A |
To provide a novel and improved side-piece structure.Fins 36 extend in the range between the ends of straight runs 12-20. Each end 45 extending from an outwardly facing side 42 of the straight run 12 and an outwardly facing side 44 of th...
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JP2003021476A |
To reduce the number of part items and costs.A tubular member 1 which is provided with a water channel 2 at the center and a plurality of refrigerant channels 3, etc., each having a circular cross section smaller than that of the channel...
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JP3347742B2 |
A chuck body mounts a substrate within a vacuum chamber. Contiguous portions of the substrate and the chuck body form a heat-transfer interface. An intermediate sealing structure seals the chuck body to the substrate independently of any...
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JP3250668B2 |
PCT No. PCT/FR92/01243 Sec. 371 Date Jun. 29, 1994 Sec. 102(e) Date Jun. 29, 1994 PCT Filed Dec. 30, 1992 PCT Pub. No. WO93/13636 PCT Pub. Date Jul. 8, 1993A sealed passage is formed in a part of refractory composite material by insertin...
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JP2002500438A |
A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, spr...
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JP2001091103A |
To provide an inner heat exchanger capable of being relatively easily fabricated and requiring a structural space with relatively less increase under a predetermined heat exchange property in an air conditioning apparatus. The air condit...
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JP2001082892A |
To stick a packing along an outer periphery of a tank without dividing the packing in a packing sticking apparatus for a heat exchanger for sticking the packing along the outer periphery of a tank of the heat exchanger such as a heater c...
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JP2000517108A |
The apparatus includes a housing having a cavity, the cavity sized to enclose an electronic component. The housing includes a first layer having a first aperture and a second layer having a second aperture. The second aperture is in comm...
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JP2000514252A |
According to an aspect of the present invention, the foregoing needs are addressed by an apparatus for cooling a heat source (10), including a carrier plate (19) having a channel (28, 38) therein. The channel has an inlet end (30) and an...
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JP3085438B2 |
The cooling module includes a base plate, a number of thermally conductive plates affixed to the base plate and arranged parallel to each other, for defining fluid flow path. A circuit module carrier is coupled to an opposite side of the...
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