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WO/2023/286697A1 |
The present invention provides: a lead frame material which exhibits excellent adhesion to a resin even in the cases where the lead frame material is used in a high-temperature high-humidity environment for a long period of time, and whi...
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WO/2023/286604A1 |
According to the present invention, a control unit outputs control signals so as to control a plating-solution supply unit and an energizing unit and thus perform a first electrolytic plating treatment by electrifying a treatment surface...
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WO/2023/284918A2 |
The present invention relates to methods (100, 200) and devices (1, 1a) for enriching a substrate (2) with an alkali metal (3), in particular lithium, and to the use of a substrate (2) enriched in this way as an electrode in a battery, a...
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WO/2023/284431A1 |
The present invention relates to the field of special processing. Disclosed are a method and apparatus for implementing localized electrodeposition induced by using laser irradiation on the back of a thin-walled part. In the method, a pa...
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WO/2023/286692A1 |
According to the present invention, a protective film (50) is formed so as to cover a part of a surface electrode (40) and to extend beyond the surface electrode toward the outer edge of a semiconductor substrate (10); and the protective...
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WO/2023/281759A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.
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WO/2023/280263A1 |
Disclosed are a near-perfect light absorber and a universal preparation method therefor. The light absorber consists of a polymer film and a light dissipation layer; the polymer film and the light dissipation layer both have conical stru...
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WO/2023/281778A1 |
This surface-treated copper foil comprises a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of change in Sk given by formula (1) for the surface-treatment layer is 0.180-0.600 µm....
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WO/2023/282386A1 |
A strain measuring sensor according to the present invention may comprise: a substrate layer formed of a flexible material; and a conductive thin-film layer provided on a surface of the substrate layer and having at least any one pattern...
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WO/2023/281777A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sk rate of change, represented by formula (1) below, of 23....
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WO/2023/281776A1 |
A surface-treated copper foil that has a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The amount of Vmp change, represented by formula (1), in the surface-treatment layer is 0.0010–0.0110...
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WO/2023/281775A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Spk change amount represented by formula (1) below of 0.02 to 0.24 µm. ...
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WO/2023/281774A1 |
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has a change ratio of Vmc of ...
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WO/2023/281773A1 |
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has an Sku of 2.50 to 4.50 an...
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WO/2023/276507A1 |
Provided are a silver-plated material having improved wear resistance compared to the past while maintaining a high hardness, and a method for manufacturing the silver-plated material. The present invention is a method for performing ele...
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WO/2023/272492A1 |
A vapor chamber having high heat absorption properties, comprising a substrate layer. The vapor chamber further comprises a protective layer; the protective layer is adhered and solidified on the outer surface of the substrate layer, is ...
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WO/2023/276324A1 |
A composite material, wherein an oxygen-containing silver-based coating layer comprising silver is formed on a blank formed from copper or copper alloy, and oxygen is present in the proximity of the surface said layer.
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WO/2023/278833A1 |
Platinum-based alloys comprising a second element are generally described. In some embodiments, the platinum-based alloy may comprise a third element.
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WO/2023/275215A1 |
The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a n...
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WO/2022/271568A1 |
Metal may be electroplated on a semiconductor substrate in an electroplating chamber with a micro inert anode array positioned proximate to the semiconductor substrate having one or more die. The micro inert anode array includes a plural...
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WO/2022/271390A1 |
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. re...
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WO/2022/266529A1 |
Processes for producing coated surfaces and coatings are described. The processes can be used to produce a surface coating comprising an alloy layer. The produced alloy layer can include molybdenum or tungsten in combination with one or ...
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WO/2022/263681A2 |
The invention relates to a decorative plastic component having a coating for representing colored, corrosion-stable metal layers, comprising a substrate consisting of a plastic (a), on which a first layer (c) is deposited and on which a ...
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WO/2022/258216A1 |
The present invention relates to a system of at least two distribution body elements for a chemical and/or electric surface treatment of a substrate, a modular distribution body comprising such a system and a manufacturing method for at ...
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WO/2022/258680A1 |
The present invention relates to a method for electrodepositing a dark chromium layer on a substrate, a respective electroplating bath for depositing such a dark chromium layer, and a respective substrate comprising said dark chromium la...
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WO/2022/257749A1 |
Disclosed in the present invention are a pre-coated steel plate for hot forming and a preparation method therefor, and a hot-formed steel member and an application thereof. In the pre-coated steel plate and the preparation method therefo...
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WO/2022/258621A1 |
The present invention relates to a method for adjusting the brightness L* of an electroplated chromium layer, in particular of a dark electroplated chromium layer. The method includes an aqueous trivalent chromium electroplating bath com...
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WO/2022/255420A1 |
Provided is a roughened copper foil simultaneously achieving excellent transmission characteristics and high peel strength when used in a copper-clad laminated board or a printed wiring board. This roughened copper foil has a roughened s...
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WO/2022/253114A1 |
The present invention belongs to the technical field of signal transmission, and particularly relates to a method for preparing a bright high-conductivity graphene/copper composite material. In view of the technical problem of bright hig...
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WO/2022/255687A1 |
The present specification relates to a multilayer metal thin film and a manufacturing method therefor, the multilayer metal thin film comprising: a first plating layer; a metal layer formed on the upper surface of the first plating layer...
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WO/2022/253385A1 |
The invention relates to a method for producing very precisely located broadband absorbers for structured 2D and 3D surfaces. The aim of the present invention is to specify a method for producing very precisely located broadband absorber...
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WO/2022/255421A1 |
Provided is a roughened copper foil having excellent transmission characteristics and circuit linearity and capable of achieving high peel strength when used in a copper clad laminate or a printed wiring board. This roughened copper foil...
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WO/2022/255422A1 |
Provided is a roughened copper foil which, when used in a copper-clad laminate board or a printed circuit board, is capable of attaining both excellent transmission properties and high peel strength. This roughened copper foil has a roug...
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WO/2022/255335A1 |
Provided is a surface-treated copper foil having excellent humidity resistance and discoloration resistance. The surface-treated copper foil includes a copper foil substrate (1) and a silane coupling agent layer (3) that is provided to a...
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WO/2022/244828A1 |
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and a high shear strength in the processing of a copper-clad laminate or in the production of a printed wiring board. This roughened cop...
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WO/2022/244827A1 |
Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high shear strength in processing of a copper-clad laminate or manufacturing of a printed wiring board. This roughened copper foil h...
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WO/2022/244772A1 |
According to the present invention, a base steel sheet containing 0.50-3.00 mass% of Si is subjected to Fe-based electroplating by using an Fe-based electroplating solution containing Fe ions and transition metal ions other than Fe ions ...
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WO/2022/244826A1 |
Provided is a roughened copper foil capable of realizing both excellent transmission properties and high shear strength, in the processing of a copper-clad laminate or the production of a printed wiring board. This roughened copper foil ...
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WO/2022/243568A1 |
A rack for accommodating a plastic part to be coated with metal, the rack being covered by a plastic material and the plastic material covering the rack comprising polyvinyl chloride and at least one plasticizer, the at least one plastic...
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WO/2022/238010A1 |
The present invention relates to a method, and respective use, for treating a non-metallic substrate for subsequent metallization, the method comprising step (A), optional step (B), and step (C), wherein step (C) comprises a contacting w...
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WO/2022/237648A1 |
The present application provides a housing, a terminal device, and a preparation method for the housing. The housing comprises a magnesium-based metal base. A first aluminum-based metal layer and a second aluminum-based metal layer are r...
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WO/2022/241088A1 |
Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applie...
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WO/2022/235219A1 |
A round wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 ...
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WO/2022/235064A1 |
The present invention provides a metal structure manufactured using an anodic oxide film and a method for manufacturing same.
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WO/2022/229373A1 |
The present invention refers to an electroplating composition for depositing a chromium or chromium alloy layer on a substrate, said composition comprising (i) trivalent chromium ions, (ii) at least one complexing agent for the trivalent...
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WO/2022/231922A1 |
An atmospheric plasma treatment station is integrated in a semiconductor process tool. The atmospheric plasma treatment station directly interfaces with a deposition chamber of the semiconductor process tool without adding to the footpri...
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WO/2022/229175A1 |
The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically c...
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WO/2022/231009A1 |
[Problem] To provide a surface treated steel foil which is for a current collector and which has hydrogen barrier properties suitable for a battery using a hydrogen occluding alloy. [Solution] This surface treated steel foil is for a cur...
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WO/2022/231008A1 |
[Problem] To provide a surface-treated steel foil for current collectors, the surface-treated steel foil having suitable hydrogen barrier properties. [Solution] A surface-treated steel foil for current collectors, the surface-treated ste...
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WO/2022/231007A1 |
[Problem] To provide a surface-treated steel foil endowed with hydrogen barrier properties suitable for a bipolar battery. [Solution] A surface-treated steel foil having a first surface and a second surface positioned on the opposite sid...
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