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WO/2023/146590A1 |
A semiconductor processing chamber may process wafers by submerging the wafers in a liquid. To determine when the liquid is free of disturbances or contaminants and thus ready to receive the next wafer, a camera may be positioned to capt...
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WO/2023/146592A1 |
Electroplating methods and systems are described that include adding a metal-ion-containing starting solution to a catholyte to increase a metal ion concentration in the catholyte to a first metal ion concentration. The methods and syste...
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WO/2023/143797A1 |
The disclosure relates to a system for a chemical and/or electrolytic surface treatment of a substrate comprises a catholyte chamber, an anolyte chamber, a distribution body, and a catholyte outlet. The distribution body is arranged in t...
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WO/2023/141723A1 |
Provided is a method for dislodging material from a surface of an electrode. The surface of the electrode is generally covered by a liquid electrolyte. The method comprises forcing a mass of gas onto a surface of the liquid electrolyte, ...
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WO/2023/123908A1 |
Disclosed in the present application is an electroplating device, comprising a spray and suction assembly. The spray and suction assembly comprises a pump, and a suction pipe and a spray pipe, which are connected to the pump and provided...
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WO/2023/117126A1 |
The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.
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WO/2023/119347A1 |
Provided is a technology with which it is possible to inhibit deformation of a film disposed inside of a plating tank. This maintenance method for a plating device includes: returning an anolyte in an anodic chamber to an anolyte tank ...
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WO/2023/114337A1 |
Described herein are methods of applying metals to substrates, where the methods include contacting the substrate with an aqueous metal plating composition comprising polyammonium bisulfate ("PABS") and a dissolved metal or salt thereof....
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WO/2023/109465A1 |
Disclosed in the present invention is a method for cleaning an electroplating device. When the electroplating device is cleaned, a partition plate is used for replacing an ionic membrane framework to isolate a cathode cavity from an anod...
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WO/2023/102703A1 |
The present application relates to the technical field of mobile equipment, and provides a mobile device and an electroplating bath. The mobile device comprises a supporting frame, a top seat, a base, and a mobile module. A pole seat is ...
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WO/2023/105561A1 |
Provided is a technology that enables the removal of air bubbles that have adhered to holes of an ion resistor. A plating method comprises: stirring a plating liquid by driving a paddle disposed above an ion resistor in a state in whic...
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WO/2023/102737A1 |
The present application relates to the technical field of moving apparatuses and discloses a moving device and an electroplating bath. The moving device comprises a supporting frame, top seats, bottom seats and linkage modules, wherein p...
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WO/2023/101764A1 |
Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved...
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WO/2023/079684A1 |
The present invention facilitates maintenance of a component disposed at the bottom of a face-down type plating device. The plating device is equipped with: a plating tank for holding a plating solution; a substrate holder that holds a...
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WO/2023/079636A1 |
Provided is a plating module comprising: a plating vessel which is so configured as to accommodate a plating solution therein; a substrate holder which is so configured as to hold a substrate with a plating surface of the substrate downw...
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WO/2023/067649A1 |
The present invention provides a technique that is capable of preventing the degradation in the plating quality of a substrate caused by air bubbles that remain on the entire area of a lower surface of a film. The plating method compri...
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WO/2023/067650A1 |
One purpose of the present invention is to provide technology for suppressing the degradation of a seed layer of a substrate. Provided is a plating method comprising: a step in which a substrate is held by a substrate holder, and, in a...
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WO/2023/059872A1 |
A method of acid mist suppression in copper electrowinning is described. In various embodiments, at least one liquid licorice root extract, powdered licorice root extract, or reconstituted licorice extract is added in an amount sufficien...
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WO/2023/046876A1 |
The present invention refers to a method for determining the height of a foam blanket on an electroplating composition utilizing a radar signal, as well as a respective use.
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WO/2023/045328A1 |
The present invention relates to a method for purifying an iron-chromium electrolyte, and the iron-chromium electrolyte thereby obtained. The method for purifying the iron-chromium electrolyte can simply and effectively remove harmful me...
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WO/2023/043666A1 |
Exemplary electroplating systems may include a vessel. The systems may include a paddle disposed within the vessel. The paddle may be characterized by a first surface and a second surface. The first surface of the paddle maybe include a ...
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WO/2023/040465A1 |
Disclosed is an electroplating apparatus, comprising a process chamber, a paddle board and a driving mechanism. The driving mechanism is used to drive the paddle board to move back and forth, so that the paddle board stirs an electroplat...
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WO/2023/037495A1 |
Provided is a technique capable of preventing a large amount of a rinse liquid to be included in a plating liquid in a plating tank. A plating device 1000 comprises a rinse module 40 capable of performing a rinse treatment. The rinse m...
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WO/2023/034695A1 |
Examples are disclosed that relate to diagnosing a condition of a wafer processing tool using a machine learning classifier. One example provides an electrodeposition tool comprising a cup. The cup comprises a wafer interface. The wafer ...
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WO/2023/032191A1 |
One purpose of the present invention is to reduce the time during which a substrate holder is lifted while also reducing the amount of excess plating solution which is taken from a plating tank. A method for plating a substrate, said m...
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WO/2023/013054A1 |
A production method for a fastener chain (1) or fastener stringers (2a, 2b) comprising: a step for applying a voltage between at least one anode (20) and at least one cathode (10) at least partially immersed in an electrolyte solution in...
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WO/2023/013363A1 |
A workpiece holding jig (30) comprises: a holding unit (320) that holds a workpiece such that the front surface and rear surface thereof are vertical; two power supply receiving units (340A, 340B) that are insulated from each other, and ...
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WO/2023/000904A1 |
The present application relates to the technical field of surface treatments, and in particular to an electroplating device. The electroplating device is used to deliver a substrate in a length direction of the substrate, and forms a pla...
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WO/2023/286604A1 |
According to the present invention, a control unit outputs control signals so as to control a plating-solution supply unit and an energizing unit and thus perform a first electrolytic plating treatment by electrifying a treatment surface...
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WO/2023/284918A2 |
The present invention relates to methods (100, 200) and devices (1, 1a) for enriching a substrate (2) with an alkali metal (3), in particular lithium, and to the use of a substrate (2) enriched in this way as an electrode in a battery, a...
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WO/2023/284431A1 |
The present invention relates to the field of special processing. Disclosed are a method and apparatus for implementing localized electrodeposition induced by using laser irradiation on the back of a thin-walled part. In the method, a pa...
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WO/2022/271568A1 |
Metal may be electroplated on a semiconductor substrate in an electroplating chamber with a micro inert anode array positioned proximate to the semiconductor substrate having one or more die. The micro inert anode array includes a plural...
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WO/2022/264739A1 |
An additive for composite plating solutions according to the present invention is characterized by containing non-conductive fine particles, nickel ions and water. This additive for composite plating solutions is in the form of a liquid ...
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WO/2022/264354A1 |
A plating device comprising: a plating tank; a diaphragm vertically partitioning the plating tank; an anode disposed in an anode chamber partitioned below the diaphragm; a substrate holder disposed above the anode chamber and holding a s...
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WO/2022/258216A1 |
The present invention relates to a system of at least two distribution body elements for a chemical and/or electric surface treatment of a substrate, a modular distribution body comprising such a system and a manufacturing method for at ...
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WO/2022/260735A1 |
Techniques including methods and apparatuses for selective measurement and monitoring of halide concentrations in processing solutions for iron triad metals and their alloys are provided. Methods include monitoring of a halide ion, for e...
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WO/2022/257640A1 |
Disclosed in an embodiment of the present invention is an electroplating device, comprising an electroplating tank, a clamp, a positioning cylinder and an anode, wherein the positioning cylinder is located in the electroplating tank; the...
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WO/2022/258621A1 |
The present invention relates to a method for adjusting the brightness L* of an electroplated chromium layer, in particular of a dark electroplated chromium layer. The method includes an aqueous trivalent chromium electroplating bath com...
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WO/2022/254690A1 |
Provided is a plating device whereby the uniformity of a plating film formed on a substrate can be enhanced. This plating device comprises: a plating tank; a substrate holder for retaining a substrate; an anode disposed in the plating ...
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WO/2022/246598A1 |
Provided in the present disclosure are an electrolyte for a metal nickel coating, and an application thereof. The electrolyte for a metal nickel coating comprises: an aqueous solution of an additive, Ni2+ ions, and borate ions; wherein t...
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WO/2022/241088A1 |
Hysteretic current-voltage mediated void-free superconformal and bottom-up filling of recessed features includes providing an electrodeposition composition with a hysteretic cyclic voltammogram; providing the substrate controlling applie...
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WO/2022/229175A1 |
The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically c...
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WO/2022/221498A1 |
A concentration of a dissolved gas can be controlled by following an electroplating solution through a contactor, controlling a pressure within the contactor, and thereby maintaining the concentration of the dissolved gas in the electrop...
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WO/2022/203095A1 |
The present invention relates to a method for effectively removing ferric ions contained in an iron electroplating solution. The method for removing ferric ions contained in a sulfate-based iron electroplating solution comprises a step o...
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WO/2022/199168A1 |
The present invention relates to a filtration mechanism, and an apparatus for producing a conductive material. The filtration mechanism comprises a filtration body, a lid body and a bearing member, wherein the filtration body comprises a...
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WO/2022/196318A1 |
Provided are a production method for a textured plated steel sheet and a production device for a textured plated steel sheet that make it possible to suppress product defects resulting from the film thickness deficiency and poor appearan...
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WO/2022/195756A1 |
Provided is a feature making it possible to wash a contact member with a simple structure. In the present invention, a plating device 1000 is provided with a plating tank, a substrate holder 20, a rotary mechanism, a lifting/lowering m...
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WO/2022/189017A1 |
The disclosure relates to a distribution system (1) for a process fluid (28) for a chemical and/or electrolytic surface treatment of a substrate (4), comprising: a distribution body (3), and a substrate holder (2), wherein the substrate ...
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WO/2022/186324A1 |
The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectang...
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WO/2022/185523A1 |
Provided is a method for adjusting a plating module equipped with a substrate holder for holding a substrate, an anode disposed facing the substrate holder, and a plate that serves as a resistor and that is disposed between the substrate...
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