| Document |
Document Title |
|
WO/2023/229670A1 |
A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer and a chemical tank that provides liquid to the processing station during a deposition process. The chemical ta...
|
|
WO/2023/225279A1 |
Systems and methods for beneficially affecting the surface morphology of electrically conductive materials using electrochemistry are described. The systems and methods for beneficially affecting the surface morphology of electrically co...
|
|
WO/2023/214449A1 |
Provided is a technology with which the effects of air bubbles and the like can be minimized in the plating of minute vias and trenches, and with which a plurality of plating treatments can be handled with a single plating device. This p...
|
|
WO/2023/207349A1 |
The present invention belongs to the technical field of photovoltaic device manufacturing. Disclosed are a manufacturing method and apparatus for an electronic component. The method comprises: placing a semiconductor device in a cathode ...
|
|
WO/2023/203409A1 |
The present invention relates to a piece of equipment (10) for the galvanic surface treatment of an object (O). The equipment (10) comprises: a galvanic treatment tank (20) suited to receive an electrolytic substance (S) for the galvanic...
|
|
WO/2023/203231A1 |
A method of facilitating electrolytically depositing chromium onto a metal substrate from an electrolyte including an ionic form of chromium and one or more organic additives in an electrodeposition vessel by applying a current through t...
|
|
WO/2023/203720A1 |
The present invention provides a technology that makes it possible to prevent the deterioration in plating quality of a substrate due to the formation of air bubbles coming from an anode. A plating module 400 includes: a plating tank 1...
|
|
WO/2023/203824A1 |
The present invention proposes a method with which it is possible to manufacture a steel sheet having a beautiful plating layer without a quality defect such as a plating defect or a pickup caused, in particular, by a distortion in the s...
|
|
WO/2023/196285A1 |
Electroplating methods may include providing an initial anolyte to a first compartment of an electrochemical cell. The methods may include providing an initial catholyte to a second compartment of the electrochemical cell. The initial ca...
|
|
WO/2023/196254A1 |
Disclosed herein is an aluminum-ether-based composition that can serve a dual role as either an electrolyte for use in batteries and/or as an electroplating bath for ambient temperature aluminum deposition. The aluminum-ether-based compo...
|
|
WO/2023/196284A1 |
Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemica...
|
|
WO/2023/188371A1 |
According to the present invention, a plating device comprises a plating tank for holding a plating liquid, an anode that is arranged inside the plating tank and has a plurality of through holes, a substrate holder that holds a substrate...
|
|
WO/2023/182375A1 |
A surface treatment jig according to the present invention is connected to an exterior body of an accumulator including a bottom, a shell, and a port, to carry out surface treatment in a state of supporting the exterior body and comprise...
|
|
WO/2023/181133A1 |
Provided is a method for manufacturing an electrode which has a specific surface area of at least 1×104 cm-1 and has a surface in which voids occupy 5-20% by area percentage as observed by SEM, wherein a raw material powder having an av...
|
|
WO/2023/179733A1 |
A copper removing device for a conductive band. The copper removing device comprises: a copper deplating tank and a conductive band transmission mechanism, wherein the copper deplating tank is used for accommodating a copper deplating so...
|
|
WO/2023/179748A1 |
Disclosed are a cell electroplating method and apparatus, wherein: a flexible conductive piece is attached to a mask opening on a cell surface to be electroplated, so that the conductive piece forms a direct or indirect electrical connec...
|
|
WO/2023/176979A1 |
This electrochemical cell comprises an element unit, a metal body, and an oxide coating material. The metal body contains chromium and is electrically connected to the element unit. The oxide coating material covers the surface of the me...
|
|
WO/2023/174255A1 |
An electroplating clamp, and an assembly line capable of vertical rack electroplating and horizontal rotating electroplating, which relate to the technical field of electroplating clamps. The electroplating clamp comprises a support plat...
|
|
WO/2023/172854A1 |
An electroplating apparatus comprises an anode chamber flow loop. The anode chamber flow loop comprises an anode chamber that contains an anolyte solution and an anode. A flow meter doses anolyte solution components into the anode chambe...
|
|
WO/2023/168210A1 |
Examples are disclosed herein that relate to characterizing a plating gap between an anode structure and a cathode in an electrodeposition tool. One example provides a fixture for characterizing a spacing of a plating gap of an electrode...
|
|
WO/2023/167009A1 |
Provided are an apparatus and a method for trivalent chromium plating for a cylinder, with which it is possible to perform trivalent chromium plating using a trivalent chromium plating solution, with good and uniform deposition and excel...
|
|
WO/2023/159785A1 |
The present invention relates to a conductive apparatus for a coating and a coating machine. The conductive apparatus for a coating comprises a rack and two conductive mechanisms. The rack is provided with a plating tank which contains a...
|
|
WO/2023/160642A1 |
The present application relates to a conductive device (100) for film plating and a film plating machine (300). The conductive device (100) for film plating comprises a frame (110) and two conductive mechanisms (120). The frame (110) is ...
|
|
WO/2023/157329A1 |
Provided are a mask member for partial plating and a technique related thereto. The mask member comprises: a drum-type jig 11 including a jig opening disposition region 17 which includes a jig opening 13 for communicating a side surface ...
|
|
WO/2023/157105A1 |
The present invention proposes a plating apparatus and the like that can improve uniformity of plated films formed on substrates. The plating apparatus comprises: a plating tank; a substrate holder for holding a substrate; and an anode...
|
|
WO/2023/148950A1 |
The present invention provides a plating apparatus having a shielding member, wherein the uniformity of the plating film thickness distribution is improved by arranging a resistor close to a surface to be plated of a substrate. A plati...
|
|
WO/2023/146591A1 |
Exemplary methods of semiconductor processing may include performing an electroplating operation on a semiconductor substrate in an electroplating bath within a vessel of an electroplating system. The methods may include removing the sem...
|
|
WO/2023/145049A1 |
The present invention enables specific parts of a substrate to be shielded at a desired timing and improves uniformity in plating film thickness. In this invention, a plating module includes: a plating bath 410 for accommodating a plat...
|
|
WO/2023/143842A1 |
The disclosure relates to a substrate holder (S1) for holding a substrate (1) in a chemical and/or electrolytic surface treatment of the substrate (1), a substrate handling system comprising a substrate holder (S1) and an immersion scann...
|
|
WO/2023/146590A1 |
A semiconductor processing chamber may process wafers by submerging the wafers in a liquid. To determine when the liquid is free of disturbances or contaminants and thus ready to receive the next wafer, a camera may be positioned to capt...
|
|
WO/2023/146592A1 |
Electroplating methods and systems are described that include adding a metal-ion-containing starting solution to a catholyte to increase a metal ion concentration in the catholyte to a first metal ion concentration. The methods and syste...
|
|
WO/2023/143968A1 |
An electrode, and use and a preparation method thereof. The electrode includes a metal substrate and a catalytic layer. The electrode includes at least one of the following features: i) the substrate is a corrosion inhibitor-containing t...
|
|
WO/2023/147391A2 |
The instant disclosure describes example techniques for bonding multiple metal structures prior or subsequent to application of a protective coating (e.g., an electro- coating or e-coating) to the structures. In certain aspects, the stru...
|
|
WO/2023/143797A1 |
The disclosure relates to a system for a chemical and/or electrolytic surface treatment of a substrate comprises a catholyte chamber, an anolyte chamber, a distribution body, and a catholyte outlet. The distribution body is arranged in t...
|
|
WO/2023/147577A2 |
A head unit for electrochemical treatment of a surface including a handle having an output tube and a vacuum tube. The output tube and the vacuum tube configured to couple the handle to a portable cart. The head unit including a body cou...
|
|
WO/2023/123912A1 |
Disclosed by the present application is an electroplating apparatus; a spray pipe in said electroplating apparatus is configured to spray a plating bath into a first hole to be plated so that positive pressure is generated in the area be...
|
|
WO/2023/129359A1 |
Disclosed herein is an electrolyzer comprising a horizontal cathode located below a suspended anode for purposes of performing electrolysis on metal-bearing mixtures or solutions. The horizontal cathode may comprise the bottom surface of...
|
|
WO/2023/126333A1 |
A device for gripping a workpiece (2) and electrically contacting at least one surface of the workpiece (2) comprises a first member (9;44;82;120;155) extending between a first end (12;47;85;123;158) and a second end (13;48;86;124;159) a...
|
|
WO/2023/123908A1 |
Disclosed in the present application is an electroplating device, comprising a spray and suction assembly. The spray and suction assembly comprises a pump, and a suction pipe and a spray pipe, which are connected to the pump and provided...
|
|
WO/2023/116337A1 |
Disclosed in the present invention are a liquid storage device and an electroplating apparatus. The liquid storage device comprises a liquid storage tank body; the liquid storage tank body comprises a plurality of working circulation liq...
|
|
WO/2023/117126A1 |
The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.
|
|
WO/2023/119347A1 |
Provided is a technology with which it is possible to inhibit deformation of a film disposed inside of a plating tank. This maintenance method for a plating device includes: returning an anolyte in an anodic chamber to an anolyte tank ...
|
|
WO/2023/109459A1 |
Disclosed in the present invention is an electroplating device, comprising a process chamber, a substrate holding device, a first cover body, a second cover body, a gas supply part, and an air discharge part. An electroplating solution i...
|
|
WO/2023/109465A1 |
Disclosed in the present invention is a method for cleaning an electroplating device. When the electroplating device is cleaned, a partition plate is used for replacing an ionic membrane framework to isolate a cathode cavity from an anod...
|
|
WO/2023/108197A1 |
An electrochemical treatment electrode configured to contact an internal surface of metallic article with an electrochemical treatment fluid, the electrode comprising: a flexible conducting body; and a plurality of flexible elements conn...
|
|
WO/2023/103280A1 |
The present disclosure relates to the technical field of solar photovoltaics, and provides an electroplating carrier and an electroplating device. The electroplating carrier is used for clamping a solar cell, and comprises a carrier plat...
|
|
WO/2023/102703A1 |
The present application relates to the technical field of mobile equipment, and provides a mobile device and an electroplating bath. The mobile device comprises a supporting frame, a top seat, a base, and a mobile module. A pole seat is ...
|
|
WO/2023/102737A1 |
The present application relates to the technical field of moving apparatuses and discloses a moving device and an electroplating bath. The moving device comprises a supporting frame, top seats, bottom seats and linkage modules, wherein p...
|
|
WO/2023/106914A1 |
The invention provides a system for electrolytic treatment of vertically oriented substrates, comprising - an elongated bath for electrolytic liquid, - a conveyor for conveying substrates to be treated electrolytically, vertically orient...
|
|
WO/2023/100381A1 |
The purpose of the present invention is to provide a method for electroplating by using an anode that can be produced relatively easily without requiring any ancillary equipment or anolyte management and without requiring an expensive me...
|
