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WO/2020/090213A1 |
Provided is a heat radiating member which has excellent electrical insulation and excellent thermal conductivity. This heat radiating member is provided with: a substrate made of a composite material which includes a diamond and a metal ...
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WO/2020/091082A2 |
This white gold alloy brazing material contains 74–78 mass% Au (gold), 12–16 mass% Pd (palladium), 3–7 mass% Zn (zinc), and a combined total of 4-7 mass% Ga (gallium) and In (indium), with the remainder comprising unavoidable impur...
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WO/2020/083873A1 |
The present document discloses a glazing in the form of a window glass or vehicle glass which comprises a transparent glass substrate, and a coating, which comprises at least one functional metal Ag alloy coating layer. The alloy coating...
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WO/2020/084903A1 |
Provided is a composite member having excellent heat resistance. A composite member provided with a base plate that is formed from a composite material containing a non-metal phase and a metal phase and a metal layer that covers at least...
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WO/2020/064505A1 |
The present invention is in the field of oriented metal substrates for high temperature superconductor tapes. In particular, the present invention relates to a process for preparing metal tapes with a high degree of cube texture comprisi...
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WO/2020/065005A1 |
The present invention relates to a process for the production of metal alloy nanoparticles which catalyse the oxygen reduction reaction (ORR) for use in proton exchange membrane fuel cells (PEMFC) or electrolyser cells. In particular, th...
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WO/2020/066114A1 |
The present invention provides a sputtering target which contains Ru and boron. A sputtering target which contains Ru as a main component, while containing a composite oxide that contains boron and has a higher melting point than B2O3.
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WO/2020/061468A1 |
Platinum-nickel-based ternary or higher alloys include platinum at about 65‒80 wt.%, nickel at about 18‒27 wt.%, and about 2‒8 wt.% of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/o...
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WO/2020/044796A1 |
This sputtering target contains Cu and In as metal components, and is composed of a composite structure that comprises a metallic phase (12) and an oxide phase (11), wherein the oxide phase (11) has an area percentage within a range of 5...
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WO/2020/044305A1 |
A black gold alloy (1), galvanic bath and method for producing the black gold alloy comprising gold at from 30 to 60% by weight, palladium at from 35 to 65% by weight, iron as necessary to completely produce 100% by weight, and having a ...
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WO/2020/025448A1 |
The present invention relates to an electroplating bath for depositing a black alloy, a method for the electrochemical deposition of a black alloy on a substrate, a black alloy and an article at least partly coated with the black alloy.
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WO/2020/020528A1 |
The present invention relates to a gold alloy of at least 18 carats, comprising gold and copper and at least one metal M of the group of platinoids, said alloy having properties which cause it to change colour depending on the observatio...
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WO/2019/221257A1 |
A multilayer film 10 which comprises an Ag alloy film 11 and a transparent conductive oxide film 12 that is superposed on one surface or both surfaces of the Ag alloy film 11, and which is configured such that: the Ag alloy film 11 has a...
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WO/2019/217805A1 |
A three-dimensional bicontinuous nanoporous platinum-based (3D-BC-NP-Pt(Au)) electrode is prepared by co-electrodepositing Pt and Ag to form a Pt-Ag alloy thin film on a gold substrate, annealing the Pt-Ag alloy thin film deposited on th...
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WO/2019/207823A1 |
The present invention relates to a silver brazing material in which the essential constituent elements are silver, copper, zinc, manganese, nickel, and tin. The silver brazing material comprises 35 to 45 mass% of silver, 18 to 28 mass% o...
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WO/2019/208463A1 |
The present invention provides a sputtering target which suppresses aggregation of C particle and reduces the generation of particles. A C-containing sputtering target which contains Pt, C, and one or more elements selected from among Fe...
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WO/2019/204578A1 |
The present disclosure relates to electrodes for biosensors. An electrode is made from a stack including (A) a layer made from ruthenium metal, a ruthenium-based alloy, nickel metal, or a nickel-based alloy; and (B) a layer made from a c...
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WO/2019/201588A1 |
The invention relates to a material, which consists of a three-dimensional framework, formed from SiC and/or Si3N4, and three-dimensionally connected interspaces containing an alloy formed from gold and/or silver and silicon. A fraction ...
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WO/2019/198369A1 |
[Problem] To provide a sliding member which is provided with an overlay that enables the achievement of good fatigue resistance, while preventing ply separation. [Solution] A sliding member which is provided with an overlay that is forme...
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WO/2019/198328A1 |
The present invention uses a mounting structure which comprises: a semiconductor element that has an element electrode; a metal member; and a sintered body which bonds the semiconductor element and the metal member with each other. This ...
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WO/2019/195046A1 |
Nanoporous oxygen reduction catalyst material comprising at least 90 collectively Pt, Ni, and Ta. The nanoporous oxygen reduction catalyst material is useful, for example, in fuel cell membrane electrode assemblies.
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WO/2019/194322A1 |
The purpose of the present invention is to provide: a Pd alloy for electric and electronic devices that achieves a greater balance of specific resistance, hardness, and workability than conventional alloys; a Pd alloy material; a probe p...
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WO/2019/186480A1 |
An electrochemical catalyst comprising a metallic nanoparticle is disclosed. An electrochemical catalyst comprises; a metallic nanoparticle; a carbon support; and a tannic acid. The electrochemical catalyst is having at least 15% increas...
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WO/2019/189511A1 |
The aim of the present invention is to provide a metal powder for an electroconductive paste with which a low-resistance electrode film can be formed. One embodiment of the present invention relates to a platinum-containing or platinum-a...
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WO/2019/181823A1 |
Provided is an Fe-Pt-oxide-BN sintered body for high-density sputtering targets, which is capable of suppressing the generation of particles during sputtering. An Fe-Pt-oxide-BN sintered body for sputtering targets, which is configured s...
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WO/2019/181649A1 |
[Problem] To provide an electrical contact powder, electrical contact material, electrical contact, and method for producing an electrical contact powder which make it possible to balance a reduction in cost with the retention of electri...
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WO/2019/178706A1 |
A method for producing silver-zinc oxide (Ag-ZnO) alloy powders with a fine and homogeneous distribution of oxide precipitates in the silver (Ag) matrix, comprising processing silver-zinc (Ag-Zn) solid solution powders in a mill at tempe...
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WO/2019/175826A1 |
A discoloration resistant Gold alloy for jewelry characterized in that it comprises in weight: - Gold, in the amount comprised between 755%o and 770%o, - Copper, in the amount comprised between 165%o and 183%o, - Silver, in the amount co...
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WO/2019/176891A1 |
The present invention pertains to a DC high voltage relay having a rated voltage of at least 48 V, the DC high voltage relay comprising at least one contact pair composed of a movable contact and a fixed contact, wherein the contact forc...
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WO/2019/175834A1 |
A Gold alloy for jewelry, comprising: - Gold: in the amount comprised between 780%o and 840%o in weight; - Copper: in the amount comprised between 125%o and 167%o in weight; - Silver: in the amount comprised between 15%o and 54%o in weig...
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WO/2019/168081A1 |
This shape-memory alloy comprises an Au-Cu-Al alloy containing 20-40 at% of Cu and 15-30 at% of Al, with the remainder being Au and unavoidable impurities, and has a Vickers hardness of at most 360 Hv. The Au-Cu-Al alloy is able to exhib...
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WO/2019/163745A1 |
The present invention is characterized in having a composition that consists of In and/or Sn in a range of 0.1 mass% to 1.5 mass% total and the balance Ag and unavoidable impurities and in that the arithmetic average surface roughness Ra...
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WO/2019/158481A1 |
The present invention relates to an alloy comprising: - 75% to 77.5% gold, - 10% to 24.0% copper, - 0.1% to 10.0% silver, - 0.1% to 1.1% palladium, - 0.1% to 2.0% tin, - 2% or less titanium, - 0.2% or less of at least one element selecte...
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WO/2019/159858A1 |
The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from...
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WO/2019/151130A1 |
Provided is a bonding wire that has high bonding reliability over a long period of time and that makes it possible to suppress the generation of cracks and Kirkendall's voids in the bonding portion between the bonding wire and an electro...
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WO/2019/145434A1 |
The invention relates to a pivoting pin of a regulator of a clockmaking mechanical movement consisting of a material comprising, in weight percentage: between 25% and 55% of palladium; between 25% and 55% of silver; between 10% and 30% o...
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WO/2019/142849A1 |
According to the present invention, a stranded wire of a platinum-based material is coated with gold or gold alloy and subjected to a wire-drawing process by using dies containing carbon. A fine wire thus prepared is covered with gold or...
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WO/2019/130511A1 |
Provided is an alloy with superior overall balance and a higher hardness than before, and which exhibits good contact resistance stability (oxidation resistance) and plastic workability while maintaining a low level of resistivity compar...
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WO/2019/131744A1 |
The present invention provides an anisotropic nanostructure that is expressed by formula RuxM1-x (in the formula, 0.6 ≤ x ≤ 0.999, and M represents at least one kind selected from the group consisting of Ir, Rh, Pt, Pd, and Au), the ...
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WO/2019/124201A1 |
Spark-plug electrodes (13, 14) according to the present invention are respectively provided with, at discharge parts (13a, 14a) thereof, electrode members (15, 16) that are formed by adding, to an Ir-Rh alloy, Ta and/or Nb in a total amo...
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WO/2019/117041A1 |
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...
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WO/2019/084581A1 |
The invention relates to a material having a first phase containing > 60 wt.% silver sulphide, > 2 wt.% copper sulphide and, optionally, gold.
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WO/2019/082932A1 |
The present invention provides a method for manufacturing a thermoelectric conversion module having: a thermoelectric semiconductor portion in which a plurality of p-type semiconductors and n-type semiconductors are alternately arranged;...
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WO/2019/084141A1 |
An Fe-Co-Al alloy magnetic thin film contains, in terms of atomic ratio, 20% to 30% Co and 1.5% to 2.5% Al. The Fe-Co-Al alloy magnetic thin film has a crystallographic orientation such that the (100) plane is parallel to a substrate sur...
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WO/2019/072240A1 |
A preparation method for a superfine high dispersion silver-tungsten electrical contact material: premixing spherical foam tungsten powder and an activated element, mixing with a part of silver powder to prepare a framework powder, formi...
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WO/2019/039298A1 |
The present invention is an artifact-free superelastic alloy which is made of an Au-Cu-Al alloy, is composed of 20 to 40 atomic percent of Cu, 15 to 25 atomic percent of Al, and the balance Au, and has a volume magnetic susceptibility of...
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WO/2019/025795A1 |
The present invention relates generally to components prepared by additive manufacturing (AM) methods, along with methods of preparing such components by AM. More especially, there is provided a process for the production of a component ...
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WO/2019/022133A1 |
[Problem] To provide a ceramic circuit board that has high bonding ability and superior thermal cycle resistance. [Solution] According to the present invention, a circuit pattern is provided on a ceramic substrate via a brazing layer, an...
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WO/2019/022193A1 |
This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, a...
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WO/2019/022039A1 |
Provided are a method for synthesizing a copper-silver alloy, whereby a copper-silver alloy can easily be synthesized at low temperature and in a short time, a method for forming a conduction part, and a copper-silver alloy and a conduct...
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