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JP2017075397A |
To provide a heat radiation substrate that is a metal layer produced with an alloy composite body containing a metal and a diamond powder as a main ingredient, and having a linear expansion coefficient of 6.5 ppm/K or larger and 15 ppm/K...
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JP2017066436A |
To provide a method for manufacturing a nano diamond containing plating film, capable of obtaining a plating film suitable for achieving high hardness and high wear resistance, and a nano diamond containing plating film obtained by the m...
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JP6038652B2 |
An cutting element incorporates a non-magnetic and electrically conductive substrate on which a layer of polycrystalline diamond particles is sintered to the substrate. An method of forming a cutting element comprises sintering the subst...
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JP6028987B2 |
A heat dissipation substrate having a metallic layer with few defects on its surface is obtained by a process including the steps of: forming a metallic layer by plating on the surface of an alloy composite mainly composed of a powder of...
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JP5988977B2 |
Disclosed is a heat dissipating component for a semiconductor element, having a tabular body 0.4-6 mm in thickness containing 40-70 volume% of diamond particles, with the balance comprising metal of which the principal component is alumi...
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JP5953616B2 |
A tip (20) for a rotary machine tool comprising a superhard structure (12) joined to a cemented carbide substrate 14 by means of at least one intermediate layer (161, 62, 163) disposed between the superhard structure (12) and the cemente...
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JP5940244B2 |
Disclosed is an aluminum-diamond composite having both high thermal conductivity and thermal expansion coefficient close to those of semiconductor elements, which is improved in platability in the surface and surface roughness so that th...
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JP5906355B2 |
A method of making a construction comprising a polycrystalline super-hard structure joined to a side surface of an elongate substrate. The method includes: providing a vessel configured for an ultra-high pressure, high temperature furnac...
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JP5897578B2 |
A mixture for fabricating a cutting table, the cutting table, and a method of fabricating the cutting table. The mixture includes a cutting table powder and a binder. The binder includes at least one carbide formed from an element select...
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JP5896400B2 |
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JP2016507647A |
The rock cutter element has a self-supporting PCD body, the self-supporting PCD body contains two or more physical volumes within its boundaries, and adjacent physical volumes are diamond and metal. Different from each other in one or mo...
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JP5798148B2 |
An abrasive compact may include an ultra-hard phase that may include ultra-hard particles having a Knoop hardness of 5000 KHN or greater, a sinter catalyst, and a reaction phase that may include a catalyst-ceramic compound having a Knoop...
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JP5759152B2 |
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JP5755895B2 |
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JP2015507087A |
A free-standing PCD object comprises a PCD material formed of a combination of intergranular diamond grains forming a diamond network and a penetrating metal network, the PCD object being a second object or group formed of a different ma...
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JP5645048B2 |
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JP5619006B2 |
The invention relates to a hard-metal comprising at least 13 volume % of a metal carbide selected from the group consisting of TiC, VC, ZrC, NbC, MoC, HfC, TaCl WC or a combination thereof, a binder phase comprising one or more of iron-g...
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JP2014161871A |
To provide a manufacturing method of a terminal for which butt welding can be applied with high laser welding efficiency and without greatly lowering strength of the welded part and its vicinity.In a manufacturing method of a terminal 1 ...
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JP5572096B2 |
The present invention relates to a method for producing diamond-metal composites including mixing diamond particles with metal-filler particles forming a diamond/metal-filler mixture, forming a green body of the diamond/metal-filler mixt...
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JP5537004B2 |
Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles conta...
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JP5456949B2 |
The present invention relates to a method of making a PcBN cutting tool insert. The method includes the following steps: mixing raw material powders i.e. cBN and one or more of hBN(hexagonal boron nitride), TiC, TiN, Ti(C,N), WC, W, C, C...
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JP2014506298A |
The ultra-hard structure includes a body of polycrystalline ultra-hard material that includes a first region and a second region. The second region is adjacent to the exposed surface of the ultra-hard structure, the second region contain...
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JP2014506297A |
A superhard structure comprises a body of polycrystalline superhard material comprising a first region and a second region, the second region being adjacent an exposed surface of the superhard structure, the second region comprising a di...
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JP5350553B1 |
An inexpensive Cu-diamond based composite material having excellent heat conductivity and heat resistance. Conventionally, an infiltration method does not provide a Cu-diamond based composite material having high heat conductivity; an ul...
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JP2013198928A |
To solve such a problem that the distribution of grinding particles of a metal bonded grinding wheel to be produced by a centrifugal-force mixing powder method is difficult to be controlled due to fluidity or the like.Matrix metal powder...
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JP5281747B2 |
Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion b...
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JP2013517384A |
A method for making a superhard tip for a rotary machine tool, the method including contacting at least one sintered polycrystalline superhard structure (22, 24) to a carrier body (30) comprising cemented carbide to form a pre- compact a...
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JP2013513031A |
A PCD structure comprising a first region in a residual compressive stress state and a second region in a residual tensile stress state adjacent to the first region, wherein the first and second regions are separate. A PCD structure form...
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JP5175933B2 |
The invention is for a polycrystalfine diamond composite material comprising intergrown diamond particles and a binder phase, the binder phase comprising a tin-based intermetallic or ternary carbide compound formed with a metallic solven...
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JP2013504688A |
A polycrystalline diamond (PCD) composite molded element with a PCD structure bonded to a cemented carbide substrate, with at least a peripheral region of the substrate of at least about 0.1 micron and at most about 0.7 micron of average...
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JP5133057B2 |
The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface...
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JP5129956B2 |
A composite material consists of a plurality of cores dispersed in a matrix. The cores are formed of ultra-hard material, or the components for making an ultra-hard material. The matrix is formed of the components for making an ultra-har...
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JP5096195B2 |
The present invention relates to a method for manufacturing a diamond composite from diamond particles, comprising the steps of forming a work piece, heating the work piece and controlling the heating temperature and heating time so that...
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JP5087776B2 |
The present invention relates to a method of producing a composite diamond body from powders of diamond particles and powders forming a binder phase comprising cobalt powder having mainly a fcc-structure and a grain size (FSSS) of 0.2-2....
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JP5076044B2 |
Provided are a composite wear-resistant member which can be manufactured with a lowered sintering temperature, and thus can prevent the carbonization of a material around super hard particles such as diamond; and a method for manufacturi...
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JP5047016B2 |
The present invention relates to a method for manufacturing a diamond-silicon carbide-silicon composite from diamond particles, comprising the steps of forming a work piece, heating the work piece and controlling the heating temperature ...
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JP5010945B2 |
To provide a nanodiamond particulate-metal coprecipitated film in which nanodiamond particulates are dispersed onto crystal grain boundaries in a thin film layer, and having excellent hydrogen embrittlement resistance and corrosion resis...
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JP2012158783A |
To provide an aluminum-diamond composite which has high heat conductivity and thermal expansion coefficient close to that of a semiconductor device in combination, and whose surface roughness is improved so as to be suitable for being us...
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JP2012519232A |
The invention relates to a superhard element (10) comprising a polycrystalline superhard structure (20) joined at an interface to a hard-metal body (30) comprising metal carbide grains bonded together by a metal binder, the polycrystalli...
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JP4995565B2 |
The invention relates to a heat sink comprising a diamond-containing composite material. In addition to a diamond content of 40-90% by volume, the composite material further comprises from 0.005 to 12% by volume of a silicon-carbon compo...
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JP2012517531A |
The present invention relates to polycrystalline diamond (PCD) comprising diamond in granular form, the diamond grains forming a bonded skeletal mass having a network of internal surfaces, the internal surfaces defining interstices or in...
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JP2012121765A |
To provide a diamond-containing composite metal having a coefficient of thermal expansion suitable for a semiconductor material and a high heat conductivity.The diamond-containing composite metal includes a metal and a diamond fine parti...
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JP4910016B2 |
A composite wear-resistant member and a method of manufacturing the same. The method includes setting an appropriate sintering temperature from 900° C. to 1080° C. by adjusting a ratio of phosphor in a material, wherein the material co...
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JP3174409U |
Disclosed herein is a diamond-containing blade, including: a blade body having at proximal end a connection part to be fitted into a gripper; and an edge longitudinally formed along one side of the blade body, wherein the blade is manufa...
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JP4901207B2 |
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JP2012506493A |
The invention relates to a PCD composite compact element comprising a PCD structure integrally bonded at an interface to a cemented carbide substrate; the PCD structure comprising coherently bonded diamond grains having a mean size no gr...
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JP4880447B2 |
The invention relates to a heat sink comprising a diamond-containing composite material. In addition to a diamond content of 40-90% by volume, the composite material further comprises from 0.005 to 12% by volume of a silicon-carbon compo...
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JP2011241464A |
To provide a diamond-containing super-hard composite material which has a sufficiently high density and uniform structure and is produced without using an ultra-high pressure vessel.The super-hard composite material having a relative den...
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JP2011149248A |
To provide a rock bit capable of reducing a surface pressure from a pit wall and suppressing the occurrence of vibrations.According to a first embodiment, the rock bit includes a bit body having a journal, a cone capable of rotating rela...
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JP2011522961A |
The present invention relates to tungsten rhenium compounds and composites and to methods of forming the same. Tungsten and rhenium powders are mixed together and sintered at high temperature and high pressure to form a unique compound. ...
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