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WO/2023/053961A1 |
[Problem] To provide a method for producing a polishing composition which has satisfactory filtration properties and can reduce defects on the surface of an object of interest. [Solution] Provided is a method for producing a polishing co...
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WO/2023/053735A1 |
The present invention provides: a polymer that allows the production of an article having excellent water- and oil-repellency; a method for producing the polymer; a water- and oil-repellent composition comprising the polymer; and an arti...
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WO/2023/053877A1 |
Provided are: a compound suitable for use as a photodisintegrable base for resist compositions which have satisfactory sensitivity to actinic energy, e.g., EB or EUV, have excellent resolution in lithography, and can give fine patterns r...
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WO/2023/054428A1 |
[Problem] To provide a polymer for a water-repellent, a water-repellent composition, and a water-repellent-treated product, which are fluorine-free and capable of imparting excellent water repellency to an object. [Solution] This polymer...
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WO/2023/053816A1 |
Provided is a radical-curable sealing member for fuel cells that has excellent product durability and suppresses changes in mechanical characteristics caused by heat and hydrolysis (such as reduced stretch and increased hardness caused b...
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WO/2023/054417A1 |
Provided as an extraction agent capable of selectively extracting lithium salt is a lithium salt extraction agent which is at least one compound selected from the group consisting of compounds represented by general formula (1) and compo...
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WO/2023/048168A1 |
The present invention provides a resist composition which contains a base material component (A) and a compound (D0) that is represented by general formula (d0). In the formula, Rd0 represents a fused ring group wherein an aromatic ring ...
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WO/2023/048128A1 |
This resist composition contains a base material component (A), and a compound (B0) represented by general formula (b0). In the formula, Rb0 is a fused ring group in which an aromatic ring and an alicyclic ring are fused. The alicyclic r...
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WO/2023/048298A1 |
Provided is a friction material composition for forming a friction material for a vehicle braking device equipped with a regenerative brake. The friction material composition has a copper content of 5% by mass or less in terms of copper ...
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WO/2023/048002A1 |
Provided is a reducing particle dispersion that achieves a high level of both preservative performance and oxygen reduction performance (oxygen absorbing ability), exhibits said performance in a continual manner (sustained-release) witho...
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WO/2023/048021A1 |
Provided are: a resist underlayer film-forming composition which has excellent embedding and flattening properties for stepped substrates, excellent storage stability, a low film-curing start temperature and a small amount of sublimate g...
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WO/2023/042510A1 |
This fluorine-containing elastomer composition is obtained by blending 0.2-0.9 parts by weight of quinacridone and 0.2-5 parts by weight of a bis-amidoxime compound or 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoro propane, with respect to 1...
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WO/2023/042524A1 |
This sealant material composition comprises (A) a rubber component, (B) a plasticizer, and (C) a crosslinking component. When a 1.2 mm-thick specimen comprising the sealant material composition is set on a parallel plate having a diamete...
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WO/2023/042385A1 |
Linear abrasive members (10A, 10B) are used as abrasive members for a polishing brush. The linear abrasive members (10A, 10B) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed there...
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WO/2023/042696A1 |
According to the present invention, a cured coating having exceptional water and oil repellency and abrasion resistance as well as exceptional chucking properties can be formed by using a fluoropolyether-group-containing polymer having a...
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WO/2023/042384A1 |
Linear abrasive members (10) are used as abrasive members for a polishing brush. The linear abrasive members (10) comprise inorganic long fibers and a resin which is cured after having the inorganic long fibers immersed therein. The inor...
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WO/2023/038001A1 |
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...
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WO/2023/038035A1 |
A sealing resin composition comprising an epoxy resin and a curing agent, wherein the curing agent contains an active ester compound and a phenolic compound having a hydroxyl equivalent of 150 g/eq or more.
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WO/2023/038003A1 |
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...
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WO/2023/032926A1 |
The purpose of the present invention is to provide: a laminate having improved synovial properties, wear resistance, stain resistance, liquid repellency, snow/ice sliding properties, droplet sliding properties, corrosion resistance, dura...
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WO/2023/028819A1 |
A silicone release coating dispersion has a polyorganosiloxane continuous phase and an aqueous discontinuous phase. The aqueous discontinuous phase includes water and an ionic liquid. The polyorganosiloxane continuous phase includes a hy...
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WO/2023/029564A1 |
Disclosed in the present application are a carbon/magnetic electromagnetic wave absorbing material having a sandwich structure and a preparation method therefor. an iron salt is utilized and piece-shaped iron(II, III) oxide is prepared; ...
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WO/2023/032585A1 |
Provided is an aerosol composition for cleaning which is capable of stably ejecting a cleaning ingredient. Also provided is a noncombustible cleaner for components which is capable of stably ejecting a cleaning ingredient. The aerosol co...
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WO/2023/032716A1 |
Provided is a polishing composition which has an excellent ability to eliminate bulging around an HLM, and which can improve polishing rate. The polishing composition comprises abrasive grains, a basic compound, and water. In addition, t...
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WO/2023/032930A1 |
This polishing liquid contains cerium oxide abrasive grains and ammonium salt, and has a pH of at least 9.00. This polishing method uses the polishing liquid to polish a member to be polished that contains copper. This component manufact...
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WO/2023/032027A1 |
Provided is a polishing solution for polishing a resin-containing member of interest, the polishing solution comprising abrasive grains containing cerium oxide and an ether compound having a hydroxy group. Also provided is a polishing me...
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WO/2023/033064A1 |
Provided is a refractive index adjustment agent for adjusting the refractive index of adhesives, wherein this refractive index adjustment agent for adhesives is an organic compound comprising a structure having at least two substituents ...
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WO/2023/032715A1 |
Provided is a polishing composition which can achieve both maintenance of a polishing rate and an HLM periphery protrusion elimination ability. This polishing composition contains grains, a basic compound, a salt of a sulfur-containing a...
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WO/2023/032714A1 |
Provided is a polishing composition capable of achieving both maintenance of a polishing rate and elimination of bulging of the periphery of a hard laser mark (HLM), the polishing composition comprising abrasive grains, a basic compound,...
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WO/2023/032745A1 |
Provided are: a novel organopolysiloxane compound represented by general formula (1); a room temperature-curable organopolysiloxane composition which contains said compound and a hydrolyzable organosilane compound having a cycloalkenyl o...
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WO/2023/032817A1 |
The present invention provides a surface treatment agent comprising a fluoropolyether group-containing silane compound having a fluoropolyether group and a silyl group, wherein the Si-bonding group that bonds to a Si atom of the silyl gr...
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WO/2023/032929A1 |
This polishing solution is for polishing a resin-containing polishing target member and contains an ether compound having a hydroxy group, and abrasive grains containing cerium oxide. This polishing method is for polishing a resin-contai...
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WO/2023/032534A1 |
Provided are: an allyl ether compound that yields a cured product excellent in terms of low dielectric properties, high heat resistance, and the like; a resin composition thereof; and a cured product obtained from the resin composition.ã...
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WO/2023/032028A1 |
The present invention provides a polishing solution that contains an ammonium salt and abrasive grains containing cerium oxide, and that has a pH of 9.00 or greater. The present invention provides a polishing method for polishing, using ...
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WO/2023/033146A1 |
The purpose of the present invention is to provide a novel substrate with a film formed thereon, in which a high-density film is formed on at least a part of a metal surface present on a substrate. Provided is a substrate with a film for...
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WO/2023/032928A1 |
Provided is a polishing liquid for polishing a member to be polished, said polishing liquid containing abrasive grains which include a cerium oxide, wherein the member to be polished contains a resin and particles which include a silicon...
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WO/2023/034962A1 |
Articles and methods regarding abrasive articles that include antimicrobial properties and improved abrasive performance and comprise a first fiber element comprising a woven or non-woven material; and a second fiber element comprising m...
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WO/2023/034131A1 |
The present disclosure provides a polishing composition that includes at least one first amine, at least one second amine, and other components such as azoles. The first amine has a low molecular weight, for example 120 g/mol or less. Th...
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WO/2023/026814A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium or molybdenum, while maintaining a stabl...
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WO/2023/027188A1 |
Provided are: a solvent composition that contains monochlorotrifluoropropene and a perfluoroolefin having a boiling point of 30-120°C at normal pressure; a cleaning agent that contains the solvent composition; a cleaning method in which...
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WO/2023/027315A1 |
A detonation synthesis nanodiamond abrasive material has an atomic percentage of oxygen of 0% to 12.5%, and an atomic percentage of carbon of 87.5% to 100% on the surface of nanodiamond, and the nanodiamond is formed by detonation.
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WO/2023/027189A1 |
An azeotropic composition, a pseudoazeotropic composition and a composition which have little adverse effect on the global environment and are unlikely to undergo compositional changes even if subjected to repeated evaporation and conden...
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WO/2023/026752A1 |
This method 1 for manufacturing a seal body comprises: a belt-shaped body formation step provided with a cross-linking agent addition step S1 for adding a cross-linking agent 3 to a compound 2 containing a halogen-group-containing monome...
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WO/2023/027167A1 |
The present disclosure provides a multilayer body for display devices, the multilayer body comprising a polyimide base material and a functional layer that is arranged on one surface of the polyimide base material and contains an ultravi...
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WO/2023/028197A1 |
A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, anionic particles dispersed in the liquid carrier, an anionic polymer or surfactant, and a cationic polymer.
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WO/2023/027157A1 |
Provided is an infrared curable ink composition which contains infrared absorbing particles and a thermosetting resin, wherein the infrared absorbing particles contain particles of a composite tungsten oxide that is represented by genera...
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WO/2023/026813A1 |
Provided is a chemical mechanical polishing composition capable of chemically mechanically polishing a ruthenium- or molybdenum-containing semiconductor substrate while maintaining a stable polishing rate and suppressing the corrosion of...
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WO/2023/026876A1 |
The present invention provides a surface treatment agent which contains a fluoropolyether group-containing silane compound and a lower fluoroalkyl alcohol, and in which the contained amount of the lower fluoroalkyl alcohol is 30 parts by...
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WO/2023/026778A1 |
The present invention provides a chemical mechanical polishing composition with which it is possible to suppress ruthenium corrosion and also perform chemical mechanical polishing of a semiconductor substrate containing ruthenium while m...
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WO/2023/026779A1 |
The present invention provides a composition for chemical mechanical polishing, the composition being capable of chemically mechanically polishing a semiconductor substrate that contains ruthenium, while maintaining a stable polishing ra...
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