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WO/2003/025082A1 |
An adhesive composition for floor coverings which comprises (a) an aqueous dispersion of an acrylic resin prepared from a monomer component containing an alkyl acrylate and&sol or an alkyl methacrylate as the main component, (b) a tackif...
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WO/2003/011954A1 |
A foamed pressure sensitive adhesive article is disclosed. The article includes a polymeric mixture containing a styrenic block copolymer and a polyarylene oxide polymer. Voids are formed in the polymeric mixture by expanding polymeric m...
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WO/2003/002682A1 |
Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are partic...
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WO/2002/092709A2 |
The invention relates to a self-adhesive protective film comprising a support consisting of film and a self-adhesive substance that is applied to said support. The self-adhesive substance contains at least one copolymer consisting of eth...
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WO/2002/091433A2 |
The invention relates to a method for grinding the back sides of wafers using foils having a carrier layer known per se and a gradually polymerizable adhesive layer. The invention also relates to foils having said gradually polymerizable...
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WO/2002/086003A1 |
A thermosetting adhesive film comprising a uniform adhesive matrix containing a thermosetting resin and a curing agent therefor, and a thermoplastic resin; and a filler material dispersed in the adhesive matrix, wherein the filler materi...
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WO/2002/079337A1 |
The present invention is directed to structural bonding tapes and methods of making such tapes. The present invention further directed to articles of manufacture containing one or more components bonded together with structural bonding t...
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WO/2002/074832A1 |
The present invention relates to adducts obtainable by reaction of: A) an amine compound containing 2 or more than 2 amino groups; with B) a polylakylene glycol monoglycidyl ether of general formula (I), in which R independently of one a...
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WO/2002/072724A1 |
An automotive adhesive which comprises (a) an alkoxysilylated polymer, (b) a curing catalyst for the alkoxysilylated polymer, (c) a vinyl polymer, (d) an epoxy resin, (e) an epoxy hardener, and (f) an inorganic filler and has a viscosity...
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WO/2002/070582A1 |
Compounds of the formula I wherein Q denotes a n-valent residue of an aliphatic polyol having a weight average molecular weight m¿w? of 100 to 25000, n is an integer from 2 to 512, R¿1? is hydrogen or methyl, A denotes a m-valent aliph...
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WO/2002/062893A2 |
A curable resin composition comprising an oxyalkylene base copolymer having at least one silicone atom containing group to the silicone atom of which a hydroxyl group and/or hydrolyzable group is attached and which is cross-linked throug...
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WO/2002/062864A2 |
Disclosed is a two-part polyurethane structural adhesive and method of bonding structural components, that exhibits at least 25 minutes of open time at 32 °C in large beads and cures to high strength under ambient conditions. The adhesi...
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WO/2002/055625A1 |
A photoreactive hot-melt adhesive which, even without incorporation of a polyester which is solid at ordinary temperature thereinto, comes to have a high adhesion strength immediately after bonding, has an excellent adhesion strength aft...
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WO/2002/045763A2 |
Hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a bacteriostat. The bacteriostat is incorporated into the adhesi...
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WO/2002/044255A1 |
The joint compound of the present invention utilizes hollow resin microspheres with a mean particle size less than 75 microns and exhibiting no more than 1.5 % increase in density under high shear stress testing.
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WO/2002/036706A1 |
An adhesive which comprises a combination of: a main ingredient comprising a modified block copolymer of ethylene and vinyl acetate and an aqueous aqua containing a-methylstyrene and isobutyl acrylate as components; and a reactive reagen...
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WO/2002/034812A1 |
Compounds of formula (I) wherein Q denotes a n-valent residue of an aliphatic polyol having a weight average molecular weight m¿w? of 100 to 25000, n is an integer from 2 to 512, R¿1? is hydrogen or methyl, A denotes a m-valent aliphat...
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WO/2002/020686A2 |
A thermocurable electroconductive adhesive sheet which is able to make an electric connection having mechanical, thermal and electric stability, and low resistance, produced by a simple and easy process is provided.
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WO/2002/015259A1 |
The method of the present invention comprises the steps of: providing an IC chip having I/O pads, each having a non-solder bump such as Au or Cu stud bump or Ni\Cu\Au bump formed thereon, and a substrate having metal electrodes formed th...
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WO/2002/004570A2 |
A method for preparing hydrophilic pressure sensitive adhesive (PSA) compositions is provided, wherein the method enables preparation of adhesives having a particular, optimized degree of adhesion. That is, the hydrophilic PSA is compris...
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WO/2001/096488A2 |
An adhesive construction, characterized by excellent converting and adhesive performance, comprises a facestock, a face-side adhesive (FSA) in contact with a first surface of the facestock, and a liner-side adhesive (LSA) in contact with...
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WO/2001/090272A2 |
This invention provides the composition, preparation, and end-use of waterborne crosslinking technology based compositions prepared from water-based latexes. The invention provides a water-based latex comprising dispersed, waterborne ami...
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WO/2001/083629A1 |
A method of bonding an adherend to a substrate which comprises: applying to the adherend and/or the substrate a curable composition which comprises one or more members selected from the group consisting of (A) a polyoxyalkylene polymer h...
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WO/2001/066666A2 |
A water-sensitive hot melt adhesive composition based on sulfonated branched copolyester polymers for use with articles such as paper products, disposable nonwoven products, tapes, labels and packaging materials. The adhesive composition...
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WO/2001/059007A1 |
The invention relates to a resin composition giving lowly hygroscopic molded articles; adhesives for bonding circuit members, prepared by using the composition; and circuit boards. The composition is characterized by comprising a polyhyd...
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WO/2001/046327A2 |
An adhesive composition that contains cyanoacrylate monomers and cyclic or alkyl- or phenyl-terminated linear polydimethylsiloxane is particularly useful in applications requiring flexibility and elasticity. A method of removing, reducin...
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WO/2001/042166A1 |
This disclosure provides a concrete product having a retroreflective surface with uniform and sharp edge which is produced easily with shortened time without using a special equipment or process as well as chemicals which need special at...
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WO/2001/036512A1 |
The invention concerns a radiation and/or electron beam polymerisable and/or crosslinkable adhesive for bonding two opposite plastic surfaces comprising: 1 to 99 wt. % of at least an organic and/or polymerisable silicone and/or at least ...
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WO/2001/032797A1 |
A pressure sensitive adhesive tape is provided having a silicone-free release layer, said tape comprising (1) at least one backing layer; (2) at least one pressure sensitive adhesive layer, and (3) at least one silicone-free release laye...
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WO/2001/030934A1 |
A reactive hot-melt adhesive composition characterized by comprising a cationically polymerizable compound having one or more cyclic ether groups, e.g., epoxy groups, on the average per molecule, a phthalic diester compound represented b...
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WO/2001/030930A1 |
The invention concerns an anti-adherent silicone/adhesive complex comprising at least a silicone coating applied on a first support and an adhesive coating applied on a second support. The invention is characterised in that the silicone ...
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WO/2001/023012A1 |
A composition comprising a superabsorbent polymer and a hydroxy-functionalized polyether.
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WO/2001/019895A1 |
The present invention relates to UV-curable compositions, the process for preparing the compositions and to the use of the curable compositions. The compositions contain: a) at least one oxetane compound; b) at least one polyfunctional c...
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WO/2000/078884A1 |
A wet-stick pressure-sensitive adhesive is provided wherein the pressure-sensitive adhesive comprises: at least one copolymerized monoethylenically unsaturated (meth)acrylic acid ester monomer, wherein the (meth)acrylic acid ester monome...
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WO/2000/077066A2 |
The invention relates to the process for the preparation of liquid reaction products of cycloaliphatic epoxides with mono- or multifunctional hydroxy compounds. The process comprises reacting a polyfunctional cycloaliphatic epoxy resin w...
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WO/2000/075255A2 |
A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste.
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WO/2000/075210A1 |
Adhesive compositions of the invention are useful as pressure-sensitive-adhesives and heat-activatable adhesives. Advantageously, adhesive compositions of the invention comprise polymers that are polyurea-based. Adhesive compositions of ...
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WO/2000/074074A1 |
The present invention relates to water-borne ceramer compositions capable of being cured to form antistatic, abrasion resistant ceramers. The ceramer compositions comprise water having dispersed or dissolved therein a plurality of colloi...
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WO/2000/060002A1 |
The invention generally relates to novel compositions comprising (i) at least one substantially random interpolymer containing (a) ethylene; (b) one or more aromatic vinylidene monomers or hindered aliphatic or cycloaliphatic vinylidene ...
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WO/2000/056828A1 |
A wet stick pressure sensitive adhesive comprising the solventless polymerization product of: a) about 30 to about 70 parts by weight of an (meth)acrylate ester monomer wherein the (meth)acrylate ester monomer, when homopolymerized, has ...
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WO/2000/046319A1 |
A bioadhesive composition formed by polymerising a homogeneous aqueous reaction mixture comprising from about 5 % to about 50 %, by weight of the reaction mixture, of at least one ionic water soluble monomer, from about 10 % to about 50 ...
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WO/2000/046318A1 |
The present invention relates to a pressure sensitive adhesive tape comprising at least one pressure sensitive adhesive layer that is capable of being cured upon exposure to actinic radiation or electron beam radiation and comprises: (i)...
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WO/2000/045866A1 |
The present invention relates to disposable human waste managem ent devices such as faecal and urine management devices (10) which are provided with adhesives for attachment of the device to the skin. In particular the present invention ...
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WO/2000/043461A1 |
The invention relates to new rewettable adhesive systems containing colloidal dispersion mixtures obtained by copolymerisation of at least one water-soluble monomer with at least one non-water-soluble comonomer in the presence of a micel...
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WO/2000/042115A1 |
To provide a photo curable resin composition comprising (A) a cationically polymerizable organic compound, (B) a cationic photopolymerization initiator, (C) a polyol having two or more hydroxyl groups in the molecule, and (D) an organoti...
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WO/2000/037534A1 |
A one-component, moisture-curable adhesive composition is provided for securing insulation to a roof deck. The adhesive comprises a silylated polymer and an extender. The adhesive composition may also include a plasticizer, a moisture sc...
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WO/2000/037533A1 |
The cure-through rate of one-part silylated polymer adhesive/sealant compositions is improved by the addition of a small but effective amount of an alcohol-free hydrophilic solvent. The composition is particularly suitable for packaging ...
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WO/2000/034404A1 |
The invention relates to an adhesive which contains magnetic nanoparticles, to a method for producing said adhesive and to the use of an adhesive containing nanoparticles.
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WO/2000/026319A1 |
Hot-melt adhesive compositions comprising a hydroxy-functionalized polyether which is not the reaction product of a dicarboxylic acid with a diglycidyl ether, optionally in combination with a compatible tackifier, a compatible plasticize...
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WO/2000/026310A1 |
A binder resin for application to polyolefin resins which is excellent in gasohole resistance, adhesion, weatherability, etc.; and a primer composition, coating composition, ink composition, and adhesive composition. The binder resin com...
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