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WO/2022/243093A1 |
The invention relates to an adhesive composition (2) for bonding flexible foam parts, the composition comprising: a first binder component (A) based on an acrylate polymer for producing a bond between two substrates to be bonded (4, 6); ...
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WO/2022/244557A1 |
This adhesive composition includes a (meth) acrylic-based polymer (A) as a main component thereof and also includes a crosslinking agent (B). The crosslinking agent (B) is blended in the amount of at least 5 parts by weight relative to 1...
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WO/2022/246336A1 |
Photocurable compositions are provided herein, which provide a balance of fast curing properties at exposure to radiation in the electromagnetic spectrum and impressive cure through depth.
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WO/2022/244555A1 |
An adhesive composition provided herein includes a (meth)acrylic polymer (A) as a main component, and further includes a cross-linking agent (B) having a functional group reactive with a hydroxyl group, and a polyfunctional alcohol (C). ...
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WO/2022/239785A1 |
Provided is a composition for forming a release layer comprising a polymer including a repeating unit having a photosensitive group that undergoes photo-Fries rearrangement.
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WO/2022/228846A1 |
The present invention relates to a method for producing a terminal-functional polymer by reversible addition-fragmentation chain transfer (RAFT) polymerization, a polymer obtained by this method and the use of said polymer for sealant or...
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WO/2022/230027A1 |
The present invention relates to: an energy ray-crosslinkable adhesive agent composition which contains (A) an acrylic resin that is energy ray-crosslinkable and (B) a tackifier, wherein the tackifier (B) contains (B1) a styrene resin; a...
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WO/2022/230935A1 |
The purpose of the present invention is to provide an adhesive tape that achieves both excellent adhesive power and holding power. The adhesive tape according to the present invention has an adhesive agent layer. When a small-angle X-ray...
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WO/2022/230928A1 |
A heat releasable adhesive which contains a (meth)acrylic polymer having, in a side chain and/or at an end, a kinetic covalent bond that is capable of reversibly making a dissociation and a bond by means of heating and cooling. An articl...
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WO/2022/230936A1 |
The purpose of the present invention is to provide: an adhesive tape which has both excellent adhesive power and excellent holding power; and an adhesive composition which is used for this adhesive tape. The present invention provides an...
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WO/2022/230222A1 |
A pressure-sensitive adhesive sheet (S) as this pressure-sensitive adhesive sheet changeable in color includes a pressure-sensitive adhesive layer (10). The pressure-sensitive adhesive layer (10) comprises: a polymer component having a m...
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WO/2022/230927A1 |
Provided is a polymer production method comprising a step for reacting a compound represented by general formula (II) with a raw material polymer having a structural unit represented by general formula (I). In general formula (I), L repr...
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WO/2022/224643A1 |
Provided is an acrylic adhesive composition from which an acrylic adhesive, which can exhibit excellent bonding resistance and excellent flexibility to withstand repeated bending in a wide temperature range, can be formed. This acrylic...
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WO/2022/224688A1 |
The present invention provides: an adhesive composition that has excellent moldability in various types of molding such as extrusion molding, excellent film forming properties, and excellent adhesiveness even to highly polar materials, a...
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WO/2022/219969A1 |
The present invention addresses the problem of providing: an adhesive composition that exhibits high adhesiveness with respect to a low-polarity adherend and that is capable of forming an adhesive layer and the like having excellent heat...
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WO/2022/220498A1 |
The present application may provide a pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer that is applied to a flexible device to effectively cope with repeated deformation and recovery, does not cause...
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WO/2022/221408A1 |
Methods, including a one-step synthesis method, for chemically modifying crosslinked sodium polyacrylate to form pressure sensitive adhesives are disclosed.
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WO/2022/218102A1 |
A substrate-free anti-transfer coiled material or tag having an RFID, comprising a printed layer, a composite layer, a chip, a metal antenna layer, an easily peelable thin layer, an adhesive material, and bottom paper in sequence from to...
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WO/2022/213324A1 |
Provided is a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive...
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WO/2022/215877A1 |
The present invention provides an adhesive composition having improved reliability with respect to penetrating bubbles, and a display device. The display device comprises: a display panel; a cover window disposed on the display panel; an...
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WO/2022/209153A1 |
The present invention provides a workpiece processing adhesive tape that is usable as a back grind tape able to respond to grinding and ultra-thinning of a semiconductor wafer and that is usable also as a dicing tape able to respond to c...
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WO/2022/208325A1 |
Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/°C; and an adhesive layer, including polyether ether ketone having a crystallinity ...
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WO/2022/208316A1 |
The present disclosure provides an adhesive precursor composition, comprising a polyfunctional acrylate oligomer, a reactive diluent including an acrylate monomer; a photoinitiator; and heat-expandable microspheres which are capable of e...
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WO/2022/206466A1 |
The present invention provides an adhesive sheet. The adhesive sheet of the present invention comprises a base material layer and an adhesive layer disposed on at least one surface of the base material layer, wherein the adhesive sheet i...
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WO/2022/209222A1 |
The present invention addresses the problem of providing: adhesive tape in which adhesive force with respect to an adherend can be adequately reduced and which can easily be detached and removed, without damaging or dirtying the adherend...
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WO/2022/210087A1 |
A filmy adhesive (13) which is thermally curable and includes an acrylic resin (a) having a carboxy group. The filmy adhesive (13), when applied to a #2000-polished surface of a silicon wafer and thereafter peeled from the silicon wafer ...
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WO/2022/210579A1 |
The following is provided as an adhesive composition having excellent adhesiveness in a frozen state at -10°C even while decreasing the amount of petroleum-derived materials used, that forms an adhesive having excellent curved surface a...
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WO/2022/209476A1 |
Provided are: a display device adhesive, which has the capacity to absorb electromagnetic waves up to longer wavelengths of up to approximately 405 nm; and an adhesive sheet obtained using the adhesive for a display device. An embodiment...
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WO/2022/206467A1 |
The present invention provides an adhesive sheet. The adhesive sheet in the present invention comprises a substrate layer, and an adhesive layer provided on at least one surface of the substrate layer. The surface roughness of the adhesi...
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WO/2022/208815A1 |
An acrylic pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape which are excellent in terms of adhesiveness, high-temperature holding property, load resistance, and impact resistance even in application to poor...
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WO/2022/209904A1 |
The present invention relates to a complex comprising: an adhesive body having a long shape, said adhesive body excelling in adhesive strength and having good electrical conductivity in the longitudinal direction of the complex and in 36...
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WO/2022/209643A1 |
Provided is an anisotropic light-diffusing adhesive layer that achieves excellent viewing angle expansion. The anisotropic light-diffusing adhesive layer contains an adhesive and an acicular filler. The acicular filler is dispersed in th...
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WO/2022/209830A1 |
An adhesive sheet (2) is obtained by forming, into a layered configuration, an adhesive composition that contains an acrylic base polymer and a polyfunctional (meth)acrylate having four or more (meth)acryloyl groups in one molecule as a ...
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WO/2022/209152A1 |
The present invention provides adhesive tape for processing a workpiece, the adhesive tape being usable even as a back grinding tape that can handle grinding or reduction of thickness of a semiconductor wafer, and also being usable even ...
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WO/2022/210638A1 |
An objective of the present invention is to provide a pressure-sensitive adhesive tape that has excellent adhesiveness to a non-smooth surface such as paper and can be easily peeled off without damaging the adherend. The present inventio...
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WO/2022/201789A1 |
[Problem] To provide a semiconductor processing adhesive tape capable of suppressing the cracking of chips when peeling off the adhesive tape. [Solution] A semiconductor processing adhesive tape having a base material and an adhesive l...
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WO/2022/202778A1 |
A purpose of the present invention is to provide an adhesive tape capable of exerting excellent adhesive force on a rough surface. Another purpose of the present invention is to provide: a method for immobilizing an electronic device com...
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WO/2022/201613A1 |
An adhesive sheet 1 is for bonding two rigid sheets together. At least one of the two rigid sheets has a contoured surface on a side to be bonded to the other rigid sheet. The adhesive sheet is provided with: a composite adhesive layer 1...
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WO/2022/201767A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and a resin layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces, wherein the resin layer 11 contains 10 mass% or more of ...
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WO/2022/201766A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 11; and an boundary surface ablation layer 12 which is laminated on one surface of the substrate 11 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/202414A1 |
The purpose of the present invention is to provide: a protective tape that has exceptional heat resistance, and that can reliably generate a gas and easily be detached from an adherend such as a semiconductor device even when light has b...
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WO/2022/202502A1 |
An adhesive sheet for jig fixation (1) to be used in a composite sheet for protective film formation equipped with a protective film-forming film, wherein the adhesive sheet for jig fixation is configured by laminating a first adhesive a...
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WO/2022/202028A1 |
The provided optical laminate includes an optical base material and an adhesive layer disposed on the surface of the optical base material. The adhesive layer contains an adhesive composition containing a silane coupling agent. The silan...
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WO/2022/202774A1 |
A purpose of the present invention is to provide an adhesive tape which can maintain high adhesive strength at high temperatures while being easily releasable. Another purpose of the present invention is to provide: a method for fixing a...
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WO/2022/204016A1 |
Adhesives comprising an aqueous polymer dispersion, at least one cross-linker, and optional additives, are provided for film lamination. The adhesives comprise a polymer dispersion comprising at least one salt, at least one ethylenically...
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WO/2022/201765A1 |
Provided is a workpiece handling sheet 1 comprising: a substrate 12; and an boundary surface ablation layer 11 which is laminated on one surface of the substrate 12 and which can hold small workpieces and perform boundary surface ablatio...
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WO/2022/203033A1 |
Provided is an ink-jet adhesive which, when a transparent member is used as an adherent member, can inhibit a component of the adhesive from adhering to areas of the transparent member which are not intended to be bonded. This ink-jet ...
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WO/2022/201790A1 |
[Problem] To provide a pressure-sensitive (PS) adhesive tape for semiconductor processing capable of suppressing cracking of a chip when peeling the PS adhesive tape. [Solution] A PS adhesive tape for semiconductor processing that has ...
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WO/2022/204695A1 |
The invention features an aqueous adhesive composition including an alkali soluble acrylic copolymer, polyethylene imine, and a silane adhesion promoter. The aqueous adhesive compositions of this invention are stable and are particularly...
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WO/2022/202160A1 |
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...
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