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WO/2023/182414A1 |
A paste containing a polysiloxane having a mercapto group (A), a compound containing a group having two or more ethylenically unsaturated bonds per molecule (B), and a radical initiator (C).
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WO/2023/182346A1 |
The present invention provides a curable resin composition for an electronic material, said composition being easy to apply to an electronic material, and imparting flame resistance to the electronic material or improving the flame resis...
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WO/2023/182459A1 |
A thermally-conductive composition according to the present invention includes a liquid polymer, a thermally-conductive filler, and a thixotropic agent, wherein a viscosity ratio (η1/η3) of a viscosity η1 measured by a rheometer at a ...
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WO/2023/182339A1 |
Provided are: a composition from which a film having high flexibility and suppressed cracking and peeling during dicing can be obtained; and a film, a laminate, and an optical member which are obtained using the same. The composition c...
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WO/2023/182138A1 |
The present invention provides an adhesive and a laminated body having the adhesive. The adhesive exhibits excellent performance in spin coating onto a wafer circuit surface or a support body (support substrate), is excellent in heat res...
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WO/2023/182347A1 |
The present invention provides a curable resin composition for an electronic material, said composition being easy to apply to an electronic material, and imparting flame resistance to the electronic material or improving the flame resis...
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WO/2023/181738A1 |
Provided is a composition that is useful for manufacturing a light-emitting element having excellent light-emitting efficiency. Further provided is a method for manufacturing a light-emitting element formed using the composition. A com...
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WO/2023/181737A1 |
Provided is a composition that is useful for manufacturing a light-emitting element having excellent light-emitting efficiency. Further provided is a method for manufacturing the light-emitting element formed using the composition. The...
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WO/2023/181736A1 |
Provided is a composition useful for manufacturing a light-emitting element having excellent light-emitting efficiency. Further provided is a method for manufacturing the light-emitting element formed using the composition. The composi...
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WO/2023/182268A1 |
The present invention provides a thermally conductive sheet which comprises a resin composition containing silicone and a thermally conductive filler, and in which the compression load value needed for 50% compression deformation is 0.65...
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WO/2023/182690A1 |
The present invention relates to a thermally conductive composite material using hexagonal boron nitride. The composite material may comprise: a polymer matrix, which is formed in the axial direction and has one side perpendicular to the...
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WO/2023/174010A1 |
Disclosed in the present invention are a spraying-free effect pigment, a preparation method therefor and an application thereof. The spraying-free effect pigment comprises the following components in parts by weight: 100 parts of effect ...
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WO/2023/175056A1 |
The present application relates to a self-healing, electrically conducting elastomer, comprising an electrically conducting phase comprising PEDOT:PSS nanofibrils, and an electrically insulating phase comprising a polyborosiloxane-based ...
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WO/2023/176789A1 |
The present invention relates to a polycarbonate-based resin composition containing an aromatic polycarbonate resin (A), inorganic particles (B), and a liquid oil component (C), in which the average particle size of the inorganic particl...
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WO/2023/174450A2 |
Disclosed are a silicone material, a silicone tube, an implant, a pharmaceutical composition, and a test method for the amount of a drug released. a raw material composition of the silicone material comprises the following components in ...
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WO/2023/172029A1 |
The present application can provide a compound, a release composition, a release layer, a release film, and an adhesive film. The present application can provide a compound that can form a release layer that can show an appropriate level...
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WO/2023/168489A1 |
The present disclosure relates to organosilicon preceramic resin compositions for forming polymer-derived ceramic materials, especially high-shrinkage polymer-derived ceramic materials. It also relates to organosilicon polymer-derived ce...
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WO/2023/171512A1 |
A composition for ultraviolet light reflection containing a filler, a base material, and a hydrosilyl compound having a hydrosilyl group.
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WO/2023/168490A1 |
The present disclosure relates to organosilicon preceramic resin compositions for forming porous polymer-derived ceramic materials. It also relates to porous organosilicon polymer-derived ceramic materials, and methods for forming porous...
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WO/2023/171353A1 |
A two-component thermally-conductive addition-curable silicone constituted of a first component and a second component, wherein, the first component contains: (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (C...
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WO/2023/169042A1 |
The present invention provides a high temperature-resistant damping thermoplastic silicone rubber material capable of being repeatedly processed, a preparation method therefor and the use thereof. The thermoplastic silicone rubber materi...
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WO/2023/171352A1 |
A thermally-conductive silicone composition containing: (A) an organopolysiloxane having an alkenyl group bonded to at least two silicon atoms in one molecule; (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to at least t...
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WO/2023/167251A1 |
The present invention provides a composition that contains component (A): a crosslinkable compound and component (B): a non-fluorine liquid-repellent compound, and that satisfies the formula: Pb-Pc>0 [in the formula, Pb is the value of t...
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WO/2023/166489A1 |
A thermoplastic composition comprising: 75 to 98 wt% of a poly(carbonate-siloxane-arylate) and optionally a poly(carbonate-arylate); a poly(carbonate-siloxane) having 30-70 wt% siloxane content, preferably 0.5 to less than 4 wt%, based o...
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WO/2023/160107A1 |
The present invention belongs to the technical field of quantum-dot diffusion plates, and particularly relates to a quantum-dot diffusion plate, and a preparation method therefor and the application thereof. The quantum-dot diffusion pla...
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WO/2023/162782A1 |
A method for producing a curable resin composition, the method comprising a step for storing a starting material composition at a temperature of 40°C to 150°C inclusive under a hermetically closed state, in which the starting material ...
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WO/2023/161753A1 |
A (meth)acrylated hyperbranched polymer consists of C, H, Si, optionally O, and optionally F atoms. The (meth)acrylated hyperbranched polymer comprises end groups, and at least some of the end groups comprise (meth)acryloyloxy groups. A ...
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WO/2023/164018A1 |
This disclosure relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having an alkenyl group in a molecule; (B) an organosiloxane oligomer having a viscosity at 25 °C of not more than 1,000 mPa·s, havin...
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WO/2023/164019A1 |
This disclosure relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having an alkenyl group in a molecule; (B) an organosiloxane oligomer having a viscosity at 25 °C of not more than 1,000 mPa·s, havin...
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WO/2023/162611A1 |
The present invention pertains to hydrophobic cellulose nanofibers which contain (A) cellulose nanofibers and (B) an isocyanate group-containing organopolysiloxane, said hydrophobic cellulose nanofibers being characterized in that the is...
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WO/2023/162323A1 |
This thermally conductive composition contains a curing polyorganosiloxane (A) and a thermally conductive inorganic filler (B), wherein: 500-5000 parts by mass of the thermally conductive inorganic filler (B) is contained relative to 100...
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WO/2023/162636A1 |
The present invention is a thermally conductive silicone composition that contains: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two sil...
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WO/2023/160423A1 |
Disclosed are a polysiloxane elastomer having high transparent conductivity and a preparation method therefor. The polysiloxane elastomer takes polysiloxane molecules as a matrix and polyethoxy molecules as conductive phases. The polysil...
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WO/2023/160907A1 |
Provided is a thermally conductive insulating silicone composition that has favorable thermal conductivity and dispensing properties, has favorable resiliency after curing, and can secure adhesion even under application of impact. Also p...
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WO/2023/156339A1 |
The present invention relates to a polycarbonate composition comprising A) from 8 wt.% to 65 wt. % of a copolycarbonate, B) from 30 wt.% to 85 wt. % of a homopolycarbonate; C) from 0.06 wt.% to 0.30 wt.% of a fluorine-containing metal or...
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WO/2023/157603A1 |
An organopolysiloxane according to the present invention, having a structural unit ratio represented by formula (1), provides a room temperature-curable composition that has excellent curability and stability even when a solvent is not u...
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WO/2023/156603A1 |
The invention relates to compositions comprising a curable polymer and at least one silane compound having at least one hydrolysable group and at least one heteroatom bridged to a silicon atom via a sp2-hybridized quaternary carbon atom,...
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WO/2023/156602A1 |
The invention relates to oligomers of silane compounds having at least one hydrolysable group and at least one heteroatom bridged to a silicon atom via a sp2-hybridized quaternary carbon atom, as defined herein, a process for preparing s...
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WO/2023/151325A1 |
The present application provides a hydrophobic porous silicone rubber and a preparation method therefor, an atomizer, and an electronic atomization device. The hydrophobic porous silicone rubber comprises the following materials in parts...
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WO/2023/153233A1 |
Provided is a thermally conductive composition that includes (A) 100 parts by mass of an organopolysiloxane that is represented by formula (1) and is a liquid at 23°C (in the formula, R is a hydrogen atom, an alkyl group, an aryl group,...
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WO/2023/153871A1 |
The present application may provide a polyorganosiloxane and a release composition enabling a release layer to be formed, the release layer capable of securing solvent resistance by maximizing bonding strength between a base film and the...
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WO/2023/152685A1 |
Novel methods for producing porous silicone compositions are disclosed. Methods of this invention provide improved processes for preparing porous silicone rubbers having low specific gravity and mainly closed cells which are suitable for...
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WO/2023/152299A1 |
The present invention relates to new aspartic acid ester-functional polysiloxanes, their use in the manufacture of curable compositions using polyisocyanate crosslinkers, in particular, in the manufacture of coating compositions, cured c...
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WO/2023/149175A1 |
A thermally conductive silicone composition comprising (A) a crosslinked silicone gel, (B) a silicone oil containing neither an aliphatic unsaturated bond nor an SiH group, (C) a thermally conductive filler having an average particle dia...
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WO/2023/147698A1 |
A curable thermally conductive composition contains: (A) an alkenyl-functional polyorganosiloxane having a viscosity in a range of 25 to 2000 millipascal*seconds; (B) a silyl-hydride functional polysiloxane crosslinker; (C) from 94 to 97...
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WO/2023/150058A2 |
A polymer composition that includes a polyarylene sulfide is disclosed. The polymer composition can be utilized in forming components of an electric vehicle, such as electrical components and/or thermal management system components.
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WO/2023/149360A1 |
The present invention provides a contamination preventing agent composition that has a sufficiently excellent contamination prevention effect and sustainability thereof. The present invention is a contamination preventing agent compositi...
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WO/2023/148005A1 |
Provided is a thermally conductive silicone composition for use as a gap filler, where the thermally conductive silicone composition exhibits excellent coating workability on a substrate and good shape retentivity after coating, is able ...
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WO/2023/145438A1 |
The present invention pertains to a thermally-conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane that includes at least one aliphatic unsaturated hydrocarbon group per molecule and tha...
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WO/2023/146172A1 |
The present invention relates to a silicone resin composition and a cured product thereof. More particularly, the present invention relates to a high-luminance silicone resin composition and a cured product thereof, the silicone resin co...
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