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WO/2023/032986A1 |
The purpose of the present invention is to provide a silica which has a low dielectric loss tangent and excellent uniform dispersibility in a resin, while achieving high safety. The present invention relates to a material for forming a f...
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WO/2023/028288A1 |
Colloidal nanoparticle dispersions, wherein said nanoparticles are selected from the group consisting of silica, alumina or silica aluminate nanoparticles and wherein said nanoparticles are surface-functionalized with an organosilane hav...
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WO/2023/026615A1 |
Provided is a thermally conductive composition comprising a filler and a polymer component, wherein the filler includes at least one surface-treated filler selected from the group consisting of the following fillers (A) and (B). Filler...
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WO/2023/024661A1 |
Provided in the present application are an antibacterial agent, and an antibacterial polysulfone composite material and a preparation method therefor, which belong to the technical field of high polymer materials. The antibacterial agent...
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WO/2023/024939A1 |
Disclosed in the present invention are a microfoam polypropylene composition, and a preparation method therefor and an application thereof. The microfoam polypropylene composition consists of a polypropylene composite material and a foam...
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WO/2023/026817A1 |
The present disclosure relates to a thermosetting resin composition including a first resin which is a thermosetting resin, and compound particles. The compound particles contain a second resin and an inorganic filler, and the amount of ...
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WO/2023/020338A1 |
Disclosed in the present invention is a preparation method for a polylactic acid plant dye color master batch. The method comprises: using a plant dye as a coloring agent, and first, dyeing a low-molecular-weight polylactic acid by using...
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WO/2023/015812A1 |
According to the present invention, modified graphene/chitosan is intercalated to montmorillonite to prepare a new modified antibacterial agent; and then the antibacterial agent and other processing aids such as a TPU material, a nylon e...
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WO/2023/016316A1 |
Provided is a method for manufacturing a semiconductor packaging material and a substrate material, comprising: providing a spherical or amorphous polysiloxane; performing heat treatment under a non-oxidizing gas or vacuum to obtain heat...
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WO/2023/018616A1 |
Described is a treated inorganic particle having an organic treatment layer, which can provide crystallization benefits to polymer resins. The treated inorganic particle has a mean particle size of about 0.1-10 µm, and the organic treat...
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WO/2023/016242A1 |
The present invention provides a fluorine-containing resin-based resin composition and an application thereof. The fluorine-containing resin-based resin composition comprises, in parts by weight, 20-70 parts of polytetrafluoroethylene em...
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WO/2023/017738A1 |
Provided are: a latex composition for dip molding, the latex composition including a polymer, inorganic particles, and a silane coupling agent, wherein the inorganic particles are alumina or titanium oxide having, on the surface thereof,...
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WO/2023/013626A1 |
This surface-treated inorganic filling material is obtained by treating an inorganic filling material (A) with: polyrotaxane (B), in which a cyclic molecule is modified with a graft chain having at least a reactive functional group; and ...
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WO/2023/010495A1 |
The present invention relates to a conductive flame-retardant polyvinyl chloride composite material and an application thereof. The composite material comprises the following components in parts by weight: 70 parts of a polyvinyl chlorid...
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WO/2023/014996A1 |
The present disclosure provides systems and methods for producing composite materials. The methods may comprise feeding to an extruder one or more components which may comprise a first component comprising a fiber and a second component ...
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WO/2023/014936A1 |
The present disclosure relates to masterbatch compositions comprising a base polymer and carbon black and carbon nanotubes as filler that can be used to prepare an article with improved electrical or mechanical performance relative to a ...
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WO/2023/008951A1 |
The present invention relates to a heat-resistant lightweight resin for manufacturing a high-output and high-capacity lightweight cable, a method for manufacturing same, and a cable manufactured from same.
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WO/2023/008042A1 |
[Problem] Under the above-mentioned situations, the present invention addresses the problem of providing: a liquid-addition-curable fluorosilicone composition which has a small compression permanent strain value after curing by heating, ...
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WO/2023/008281A1 |
This resin composition comprises: a fluorescent body having a core-shell structure which includes a core part composed of a crystal phase of an inorganic compound having an elemental composition represented by formula (A) MxMgaAlyOzNw [i...
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WO/2023/007894A1 |
A thermally conductive resin composition which contains an epoxy resin and a thermally conductive powder, wherein: the thermally conductive powder contains aluminum nitride, which has a silicon-containing oxide coating film on the surfac...
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WO/2023/001506A1 |
A composite material comprising carbon nanotubes is described, wherein said composite material does not comprise any carbon nanotube aggregates having a smallest dimension larger than 1 mm. The efficiency of dispersion and anchoring as w...
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WO/2023/000608A1 |
Disclosed are a high-impregnation long glass fiber reinforced polypropylene composite material and a preparation method therefor. Said material is composed of the following raw materials in parts by weight: 43.2-63.2 parts of polypropyle...
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WO/2023/003071A1 |
A packaging container having antibacterial and antiseptic effects, according to the present invention, comprises a natural antibacterial material, wherein the natural antibacterial material is not mixed with a normal polymer resin but ra...
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WO/2023/003257A1 |
The present invention relates to a polyphenylene sulfide composite resin and a molded product using same and, more specifically, a polyphenylene sulfide composite resin and a molded product using same, wherein the resin has excellent pro...
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WO/2023/287262A1 |
The present invention relates to a preparation method of a super absorbent polymer. More specifically, the present invention relates to a preparation method of a super absorbent polymer, in which performed is a multi-step foaming process...
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WO/2023/287539A1 |
The present invention is a process for preparing one or more paints by flowing and merging pre-paints from pre-paint storage tanks into a mixing chamber and into a paint container
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WO/2023/286923A1 |
The present application provides an antistatic resin composition comprising: a thermoplastic resin comprising a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer, and thermoplastic polyurethane (TPU...
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WO/2023/286924A1 |
The present application provides an antistatic resin composition comprising a thermoplastic resin and a conductive filler, which comprises carbon nanotubes, wherein the conductive filler is included in an amount of 1-20 wt% on the basis ...
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WO/2023/284201A1 |
An emulsion, an emulsion gel electrolyte, an aerogel, a preparation method therefor, and the use thereof, which belong to the technical field of energy devices. The emulsion is an oil-in-water emulsion, wherein the oil phase is a decane ...
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WO/2023/286703A1 |
Provided is a resin sheet containing: polypropylene which contains smectic crystals; and a pearl interference pigment.
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WO/2023/281215A1 |
The invention relates to 1) a crosslinkable adhesive composition comprising: at least one polymer (A) comprising a hydrolysable alkoxysilane group; at least one tackifying resin (B); at least one fumed silica (C), preferably hydrophic; a...
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WO/2023/282590A1 |
The present invention provides: a heat dissipation composite composition comprising at least one phase change material, an epoxy resin, a curing agent, and a heat dissipation filler; a heat dissipation composite in which high latent heat...
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WO/2023/282174A1 |
This curable composition contains a polymerizable monomer, an aluminum chelate compound, a silanol compound, and a quaternary boron onium salt.
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WO/2023/279984A1 |
Disclosed in the present invention are a PBT/PC alloy with stable mechanical properties and a preparation method therefor. The PBT/PC alloy of the present invention comprises the following components in parts by weight: 50-80 parts of a ...
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WO/2023/281216A1 |
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hyd...
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WO/2023/272569A1 |
A bioplastic for manufacturing a degradable film, and a preparation method therefor. The technical solution is: making a PBAT precursor liquid raw material be adsorbed in micropores of a porous inorganic filler for esterification and pol...
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WO/2023/273192A1 |
Disclosed in the present application are a modified silica filler and a preparation method therefor. The preparation method comprises: providing a silane coupling agent and a silica powder at a set mass ratio; adding the silane coupling ...
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WO/2023/277034A1 |
A copolymer emulsion which is contained in a composition for fiber binding for the production of a resin-impregnated fiber by binding a plurality of fibers during the production of a fiber-reinforced thermoplastic resin composite materia...
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WO/2023/276946A1 |
Provided is a composition that includes particles of a tetrafluoroethylene polymer, hollow particles, and particles of a prescribed inorganic compound in prescribed proportions and that is capable of forming a molded article having excep...
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WO/2022/270316A1 |
A resin composition with a stable viscosity life; a resin sheet that uses said resin composition; a circuit substrate; and a semiconductor chip package are provided. In this resin composition, which contains (A) a curable resin and (B)...
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WO/2022/269249A1 |
The present invention relates to an additive composition for a polymer substrate and a method of making the same. The additive composition comprises a carrier material, an oxygen scavenger, and either an antimicrobial substance or a food...
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WO/2022/270807A1 |
The present application relates to a fiber reinforced composite. Specifically, the present application relates to: a fiber reinforced composite comprising a polyamide-based resin and aramid staple fiber; and articles comprising same.
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WO/2022/266641A1 |
The present invention relates to a composition suitable for manufacturing of sheet molding compounds, a method for preparing said composition, a method for making an article using said composition, an article with said composition, a mob...
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WO/2022/263375A1 |
This invention involves a coated flaky metal effect pigment comprising a metal effect flake as substrate coated by the following consecutive coating sequences: a) optionally a discontinuous or a continuous layer of Mo-oxide, b1) an inorg...
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WO/2022/260205A1 |
The present invention relates to a biodegradable sheet having antiviral properties, a method for manufacturing same, and a use thereof. The present invention may provide a biodegradable sheet in which particles of an inorganic antiviral ...
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WO/2022/260919A1 |
A thermally conductive composition includes a non-silicone polymer resin curable in place along a thermal dissipation pathway. The composition exhibits a low density for particular use in weight-sensitive applications that require a ther...
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WO/2022/260206A1 |
The present invention relates to a biodegradable egg tray having antiviral performance. The present invention relates to an egg tray including: a base plate having one or more concave egg tray recesses arranged to accommodate eggs; and a...
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WO/2022/255415A1 |
The present invention is characterized by including: a step for preparing a dispersion by mixing a silicon-based porous material into an aqueous solvent in which cellulose nanofibers have been dispersed; a step for fabricating a dried bo...
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WO/2022/250456A1 |
The present invention relates to a heat-resistant resin for manufacturing a high-output and high-capacity cable, a method for manufacturing the resin, and a cable manufactured from the resin.
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WO/2022/249653A1 |
Provided are: a resin composition especially suited to food packaging containers and tableware, the resin composition eluting little under acidic conditions irrespective of a thermoplastic resin being highly filled with calcium carbonate...
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