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WO/2023/190601A1 |
The purpose of the present invention is to achieve both excellent dielectric properties and long-term durability. A composition comprising (A) a curable hydrocarbon-based resin, (B) a phenol-based antioxidant, (C) a thioether-based antio...
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WO/2023/190725A1 |
This invention provides a curable composition comprising component (A), a fluoropolyether-group-containing acrylic compound containing (meth)acrylic groups, hydrolyzable silane groups, and fluoropolyether groups; component (B), a fluorop...
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WO/2023/190723A1 |
The present invention provides a curable composition which contains: a fluoropolyether group-containing acrylic compound that comprises a (meth)acryl group, a hydrolyzable silane group and a fluoropolyether group (component (A)); a fluor...
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WO/2023/189496A1 |
Provided is a rubber composition that contains a copolymer represented by general formula (1) and a filler. (In general formula (1): R1 to R4 are each independently a hydrogen atom, a halogen atom, an optionally substituted hydrocarbon g...
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WO/2023/190929A1 |
An active energy ray curable polyolefin resin (A) according to the present invention exhibits high detachment strength, water resistance, and adhesion force with respect to a polyolefin base material, and is characterized by having a car...
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WO/2023/190742A1 |
The present invention provides a curable composition comprising: component (A) that is a fluoropolyether group-containing acrylic compound containing a (meth)acrylic group, a hydrolyzable silane group, and a fluoropolyether group; compon...
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WO/2023/190037A1 |
This silicone skeleton-containing compound is represented by formula (1). (In the formula, each R1 independently represents a monovalent organic group, each R2 independently represents a divalent organic group, each R3 independently repr...
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WO/2023/190766A1 |
The present invention provides a curable composition comprising: component (A) which is a fluoropolyether group-containing acrylic compound including an acrylic group, a hydrolysable silane group, and a fluoropolyether group; component (...
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WO/2023/176172A1 |
Provided are: a polyimide resin precursor that yields a polyimide resin having a low dielectric loss tangent and excelling in a chemical resistance property; a production method for the polyimide resin precursor; a photosensitive resin c...
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WO/2023/171613A1 |
A photocurable composition according to the present invention contains a curable resin component, a photopolymerization initiator and an inorganic filler. The curable resin component contains a multifunctional curable compound which has ...
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WO/2023/169028A1 |
The present invention relates to the field of medicine. Specifically provided are a hemostatic sponge and a preparation method therefor. Components for preparing the hemostatic sponge comprise, by mass, 3-30 parts of a double bond-contai...
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WO/2023/171554A1 |
Provided are: a resin composition having excellent moisture absorption heat resistance while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet;...
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WO/2023/171553A1 |
Provided are: a resin composition having a low coefficient of thermal expansion (CTE) while maintaining excellent low dielectric properties (Dk and/or Df); a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; ...
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WO/2023/170411A1 |
The invention provides an A-B block copolymer amphiphilic additive comprising a hydrophobic hydrocarbon A-block and a hydrophilic poly (alkylene oxide) B-block, wherein the B-block is end-capped with a moiety that is negatively charged o...
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WO/2023/157430A1 |
[Problem] To obtain a photocurable urethane gel-state body that: through a first-stage cure, is in a gum state and exhibits a self-molding behavior of conforming to the shape of a use surface; and through a second-stage photocure, provid...
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WO/2023/140160A1 |
The present invention provides an active energy ray-curable anti-fogging composition capable of forming a cured coating film which exhibits excellent anti-fogging properties and persistence thereof, exhibits anti-fogging properties after...
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WO/2023/119803A1 |
One aspect of the present invention pertains to a resin composition that comprises a radical polymerizable compound (A), an inorganic filler (B) containing boron nitride (B-1) and silica (B-2), and a free radical compound (C) having at l...
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WO/2023/120689A1 |
[Problem] Provided are a vinyl-modified organopolysiloxane that is useful as a raw material for a radical polymerization reaction to be used in particular in a biodegradable polymer or copolymer, and a method for producing the vinyl-modi...
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WO/2023/120089A1 |
Provided is an active energy ray curable resin composition containing a complex resin (A), an acryl (meth)acrylate resin (B), and a photopolymerization initiator (C). The active energy ray curable resin composition is characterized in th...
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WO/2023/112713A1 |
According to the present invention, a fluoropolyether group-containing acrylic compound represented by formula (1) has a low refractive index and is capable of forming a transparent composition by being compatibilized with a commonly use...
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WO/2023/106144A1 |
Provided is a urethane (meth)acrylate that, as a result of being cured, results in a cured product that is superior in terms of the stretching properties, the flexibility, and the bendability and that is also superior in terms of the sha...
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WO/2023/106145A1 |
Provided is a urethane (meth)acrylate which has a viscosity that makes the urethane (meth)acrylate have excellent handleability and which, when cured, gives cured objects having high tensile strength, excellent in terms of toughness and ...
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WO/2023/100991A1 |
A silsesquioxane derivative represented by formula (1). In formula (1), R1 and R2 each independently are a C1-10 alkylene group, a C3-10 cycloalkylene group, a C6-10 arylene group, or a C7-12 aralkylene group, R3 is a C1-6 alkyl group, R...
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WO/2023/100843A1 |
[Problem] To provide a curable resin composition capable of forming solder resists which combine long-lasting low glossiness and resultant long-term freedom from solder adhesion with withstand voltage on a high level. [Solution] A curabl...
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WO/2023/099995A1 |
Free-radically polymerizable compounds having a poly(diakylsiloxane) segment and at least one acryl group are disclosed. Compositions including the same, polymerized compounds, methods of making and articles including the same are also d...
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WO/2023/088330A1 |
Disclosed in the present application are a biological valve material, and a preparation method therefor and a use thereof. The preparation method comprises: S100, linking a first carbon-carbon double bond by means of a chemical reaction ...
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WO/2023/089976A1 |
The purpose of the present invention is to provide a curable resin which can be excellent in terms of heat resistance (high glass transition temperature) and dielectric characteristics (low-dielectric characteristics), a composition of t...
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WO/2023/090363A1 |
A resin composition including a maleimide resin (A) obtained by reacting one or more tetracarboxylic dianhydrides (a1), diamines (a2), and maleic anhydride (a3), wherein the tetracarboxylic dianhydrides (a1) include at least one compound...
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WO/2023/090351A1 |
Provided is a resin composition that contains: (A) at least one type selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of said maleimide resins, (B) a poly(phenylene ...
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WO/2023/077699A1 |
Disclosed in the present invention is a pH-responsive hydrogel biocarrier. The pH-responsive hydrogel biocarrier is prepared by irradiating sodium hyaluronate and methacrylic anhydride by using 365 nm ultraviolet laser in the presence of...
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WO/2023/074804A1 |
[Problem] To provide a UV-curable organopolysiloxane whose cured product (cured film) has sufficient mechanical strength, has good transparency, and is designable so as to have a desired refractive index, and which has high UV curability...
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WO/2023/074429A1 |
The present invention provides a heat-curable resin composition capable of giving cured objects which have reduced moduli and improved flexibility and are less apt to have impaired heat resistance. The heat-curable resin composition comp...
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WO/2023/067443A1 |
A graft copolymer includes a hydrocarbon backbone having a phenylene ether oligomer grafted therefrom. The graft copolymer can be particularly useful in curable compositions, thermoset compositions, and articles formed therefrom.
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WO/2023/058383A1 |
Provided are: rubber particles having high degradability and containing a polyorgano-siloxane structure; composite particles; and manufacturing methods for these particles.　The rubber particles are made of a polymer containing a struct...
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WO/2023/054085A1 |
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...
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WO/2023/053749A1 |
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high t...
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WO/2023/053782A1 |
The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin compositi...
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WO/2023/048228A1 |
Provided is a compound represented by general formula (1). In general formula (1), P1 represents a polymer structure comprising a sub-structure represented by general formula (2). In general formula (2), n is 1 or greater; when n1 is 1, ...
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WO/2023/032866A1 |
This curable composition comprises piezoelectric particles and a compound represented by formula (1). In formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group, and R13 represents a divalent group having ...
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WO/2023/027060A1 |
The present invention can provide a resin composition containing a phenylene ether resin and a petrolium resin. The phenylene ether resin is represented by general formula (1) [in general formula (1), X represents a unit including an aro...
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WO/2023/026829A1 |
Provided are: a resin composition which, before moisture absorption (initial state) and after moisture absorption, is low in both permittivity and dielectric loss tangent and which is high in metal-foil peel strength; and a cured object,...
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WO/2023/017746A1 |
[Problem] To provide: a hot melt silicone composition that can be cured at a wide temperature range from low to high temperatures in accordance with a sealing process and the heat resistance of a resin member, can achieve suitable curabi...
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WO/2023/008367A1 |
The purpose of the present invention is to provide an ester bond-containing polycarboxylic acid (salt) having excellent biodegradability and an excellent rate of change in alkaline degradation, a method for producing the same, and a dete...
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WO/2023/286714A1 |
The present invention provides: a polymer that has excellent heat resistance and dielectric properties, that can dissolve in an organic solvent at a high concentration, and that has excellent compatibility with other thermoplastic resins...
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WO/2023/284618A1 |
The present invention provides a resin composition comprising an isocyanate component, a reactive component, and a free radical initiator. In the reactive component, the sum of the average number of acrylate double bonds and active hydro...
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WO/2022/270467A1 |
The purpose of the present invention is to provide a novel hydrazide compound. It is additionally the purpose of the present invention to provide: a curable resin composition that contains the hydrazide compound and that exhibits excepti...
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WO/2022/270462A1 |
The purpose of the present invention is to provide a sealing agent for liquid crystal display elements that has excellent adhesiveness and moisture permeation prevention properties in addition to excellent properties with regard to the a...
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WO/2022/270442A1 |
The present invention provides a composition containing a compound represented by the following formula (1) (where symbols are as described in the description).
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WO/2022/259893A1 |
Provided are: a curable resin composition comprising a polymer (S) having at least one structural unit that is selected from the group consisting of structural units (a) which include a fluorine atom and structural units (b) which includ...
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WO/2022/257317A1 |
The present invention provides a polyurethane resin and a preparation method therefor. The preparation method for the polyurethane resin comprises mixing a first component and a second component to prepare the polyurethane resin, wherein...
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