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JP2022064606A |
To provide a curable composition for bonding an optical component, which gives a cured product having optical transparency and excellent adhesiveness.The curable composition for bonding an optical component is a curable composition which...
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JP2022064607A |
To provide a curable composition for a vibration absorbing material, which gives a cured product having vibration absorbing ability and excellent adhesiveness.The curable composition for a vibration absorbing material is a curable compos...
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JP2022062515A |
To provide a phenolic hydroxy group-containing resin that has excellent developability even with tetramethylammonium hydroxide used as a developer and is suitable for a photosensitive resin composition with excellent colorant dispersibil...
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JP7055968B2 |
Composite granules that contain a binder and a polymeric sorbent material for capturing aldehydes such as formaldehyde are provided. Additionally, methods of making the composite granules, methods of using the composite granules to captu...
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JP7055967B2 |
Composite granules that contain a binder and a polymeric sorbent material for capturing aldehydes such as formaldehyde are provided. Additionally, methods of making the composite granules, methods of using the composite granules to captu...
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JP7056024B2 |
A resin comprising a structural unit represented by formula (I0):wherein A1, A2 and A3 each independently represent a C2-C18 divalent hydrocarbon group,R1, R2, R3 and R4 each independently represent a hydrogen atom or a C1-C6 saturated h...
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JP7054061B2 |
The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120°C or more.
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JP2022051791A |
To provide a process for preparing N,N-(di)alkylaminoalkyl(meth)acrylamide or N,N-(di)alkylaminoalkyl (meth)acrylate and the quaternary ammonium salts thereof with a low content of a compound of formula (IV), and to provide a process for...
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JP2022041917A |
To provide a resist composition from which a resist pattern having good line edge roughness (LER) can be produced.The resist composition contains a compound represented by formula (I), a resin having an acid-labile group, and an acid gen...
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JP7031576B2 |
Disclosed is a binder composition for non-aqueous secondary battery electrode which comprises: a water-soluble polymer which comprises an acid group-containing monomer unit; and water, wherein the water-soluble polymer comprises the acid...
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JP7024672B2 |
Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The hea...
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JP2022022060A |
To provide a polymer excellent in alkali solubility.The polymer includes structural units of the general formulas (1-1) and (1-2) in the figure. In the formulas, Z comprises one or more (meth)acryloyl groups; Q is H or a C1-6 alkyl group...
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JP7014195B2 |
To provide: a sealant for collectively sealing a semiconductor element-mount face and/or a semiconductor element-formed face, which can achieve a low warp; a semiconductor device arranged by use of the sealant; and a method for manufactu...
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JP7013643B2 |
To provide a thermosetting resin composition that can form a cured product having excellent heat resistance, and can be also cured at low temperature.A thermosetting resin composition contains (A) a maleimide compound having a plurality ...
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JP7011589B2 |
Provided are a maleimide resin mold, a maleimide resin composition, and a cured product thereof with less environmental exposure which have excellent workability and production efficiency, for example, in highly reliable semiconductor se...
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JP7010217B2 |
The present invention provides a compound having a low melting point and having excellent heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in ...
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JP6996777B2 |
A compound of the formula, plus devices incorporating this compound, and a method of marking such devices:wherein:A represents a phenyl group, a naphthyl group, a biphenyl group or two phenyl groups linked by a C1-C8 alkyl chain;B1 and B...
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JP2022505282A |
The present invention relates to a polymerizable mixture that can be used to form a dielectric material for preparing a passivation layer in an electronic device. The polymerizable mixture comprises a first monomer and a second monomer, ...
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JP2022505104A |
The present invention relates to a polymerizable mixture that can be used to form a dielectric material for preparing a passivation layer in an electronic device. The polymerizable mixture contains a first monomer and a second monomer, w...
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JP6983812B2 |
The present invention provides a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a mixture of two or more siloxane polymers having different dissolution rates with respe...
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JP6979746B2 |
Provided are: a methallyl group-containing resin which enables a curable resin composition to provide a cured product having excellently low moisture absorbency, excellent heat resistance and excellent dielectric characteristics, if used...
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JP6974342B2 |
This invention relates to photocurable electron deficient olefin-containing compositions, such as those containing certain 2-cyanoacrylates, 2-cyanopentadienoates, methylidene malonates, and vinylidine cyanide, and photolatent bases. Whe...
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JP6972237B2 |
A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with...
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JP6962456B2 |
In this invention, a liquid crystal alignment agent contains a polymer (P) having at least one species selected from the group consisting of partial structures represented respectively by formula (1) to formula (4). In formula (1), R1 re...
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JPWO2020105457A1 |
A transfer material containing a temporary support, an intermediate layer containing a water-soluble resin, and a positive photosensitive resin layer in this order, and the intermediate layer contains a surfactant having a fluorine atom,...
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JP2021161198A |
To provide an aqueous solution composition that contains a polymer obtained by polymerizing a water-soluble unsaturated carboxylic acid monomer in the presence of water-soluble sucrose allyl ether, where the composition is less likely to...
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JP2021162679A |
To provide a photosensitive resin composition which has flatness, extremely good low hygroscopicity and low gas generating property, is excellent in transparency and is also excellent in development characteristics.There is provided a ph...
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JP6941465B2 |
To provide a hydrophilizing agent which enables the formation of a coating film, said coating film having a high hydrophilicity and excellent water drop removing properties, and a method for forming a hydrophilic coating film. A hydrophi...
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JP6942718B2 |
Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or i...
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JP2021143302A |
To provide a resin composition which has a low glass area photoelastic coefficient, and can greatly reduce birefringence even when various stresses caused in molding and usage are applied thereto, and a retardation film excellent in reta...
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JP6939780B2 |
Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin...
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JP6931521B2 |
To provide a dispersant for nanocarbon capable of obtaining nanocarbon dispersed material in which the nanocarbon is minutely dispersed.A dispersant for nanocarbon comprises following component (A) and component (B). In the dispersant, a...
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JP2021523256A |
In the present application, a photopolymerizable monomer for use as a reactive diluent in a photopolymerization process based on high-temperature lithography, a method for producing a polymer using the photopolymerizable monomer, and the...
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JP6916275B2 |
Provided are an emulsifying initiator, and more specifically, an emulsifying initiator including a surfactant part, an initiator part and a vinyl monomer-derived repeating unit, the surfactant part including an organic acid-based monomer...
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JP2021116427A |
To provide: a propenyl group-containing composition which has low viscosity and can form a cured product excellent in heat resistance and long-term reliability; and a curable resin composition based on the same.The propenyl group-contain...
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JP2021116423A |
To provide a curable resin composition which has excellent compatibility and can form a cured product excellent in heat resistance and low dielectric characteristics.A curable resin composition comprises: one or more selected from the gr...
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JP6904529B1 |
To provide an aqueous resin composition containing an aluminum pigment, which has low VOC properties, is excellent in stability over time, is excellent in coating efficiency by electrodeposition coating, adhesion to an object to be coate...
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JP6905667B2 |
To provide a fumarate ester homopolymer by homopolymerization of a fumarate ester compound by irradiation with light.In a method of producing a fumarate ester homopolymer, a photopolymerizable composition containing at least a fumarate e...
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JP6900951B2 |
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JP6901785B2 |
The purposes of the present invention are: to provide a particle stabilizer which enables a multicolor coating material to be stably stored, that is, a particle stabilizer which gives color particles having excellent stability; and to pr...
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JP2021095542A |
To provide a curable composition excellent in processability and capable of forming a cured product having super heat resistance by curing.The curable composition of the present invention contains a curable compound represented by formul...
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JP2021095545A |
To provide a curable composition capable of forming a cured product having heat resistance and flexibility.The curable composition of the present invention contains a curable compound and a silicate. The curable compound is preferably a ...
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JP6881030B2 |
To provide a novel ion-conductive material having excellent ion conductivity while being a polymer.An ion-conductive material containing a -CO-O-B structure-containing polymer that is a reaction product between a carboxylic acid group-co...
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JP6870201B2 |
To provide an active energy ray-curable composition with low viscosity and excellent curability.An active energy ray-curable composition contains a compound represented by the general formula (I) in the figure. In the general formula (I)...
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JP6850447B1 |
The resin composition of the present invention contains a bismaleimide compound (A) containing a structural unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, and a compound containing...
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JP6847090B2 |
The purpose of the present invention is to provide a method for producing a resin utilizing radical polymerization, which enables the achievement of sufficient reproducibility of the molecular weight, while suppressing the amount of resi...
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JP6836622B2 |
A purpose of the present invention is to provide an aromatic-amine resin having excellent solubility in solvents and having a specific structure. Other purpose is to provide: a curable resin composition which includes a maleimide resin d...
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JP6836621B2 |
The purpose of the present invention is to provide: a maleimide resin which has a specific structure that brings about excellent heat resistance and excellent low-dielectric characteristics and which is suitable for use in encapsulating ...
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JP2021024246A |
To provide a molding material that makes it possible to form a molding or a support part in a short time and remove the molding or the support part with water.A molding material contains a 2-cyanoacrylate compound represented by formula ...
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JP2021024245A |
To provide a molding material that makes it possible to form a molding or a support part in a short time and remove the molding or the support part with water.A molding material contains a 2-cyanoacrylate compound and a water-soluble com...
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