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WO/2020/234119A1 |
A cutting machine (1, 101), preferably a contour-cutting machine for cutting expanded resins, fibers or fabrics, which comprises a tensioning system (8, 108) for tensioning a cutting element (3, 103), which is configured to exert at leas...
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WO/2020/230423A1 |
A workpiece cutting method according to the present invention is for simultaneously cutting a workpiece, by a wire saw, at a plurality of portions arranged axially by infeeding the workpiece held by a workpiece holding means with respect...
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WO/2020/225127A1 |
This sacrificial support (10) for cutting out a part, preferably of silicon, with abrasive wire is made of a biodegradable polymer material (11) which is soluble in a solvent. The process for cutting out a part with abrasive wire employi...
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WO/2020/225000A1 |
The present invention relates to a method for controlling the operation of an auxiliary device in a working system which comprises at least one main tool device and the auxiliary device. The operating state of the main tool device is det...
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WO/2020/223989A1 |
The present invention relates to the technical field of precise machining tools, and discloses a cutting tool and a tool bit structure thereof. The tool bit structure comprises a connecting part and a cutting edge part arranged at a fron...
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WO/2020/220066A1 |
A tool holder assembly (200) includes a mounting block (210), a tool support member (230), and a fixed orientation cutting tool (250). The mounting block (210) has a first cavity (218) extending into the mounting block (210). The tool su...
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WO/2020/221133A1 |
A multi-wire cutting device and an automatic slot-change mechanism (29) applied thereto. The automatic slot-change mechanism (29) comprises: a cutting wheel (290) comprising a first wire slot and a second wire slot which are used for win...
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WO/2020/221132A1 |
Disclosed are a multi-station squaring apparatus and a cutting method therefor. The multi-station squaring apparatus comprises at least two silicon rod bearing tables (21) for bearing vertically-arranged silicon single crystal rods, wher...
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WO/2020/221134A1 |
A silicon rod opening device and a side skin unloading apparatus (28) applied to a silicon rod opening device: the silicon rod opening device comprises silicon rod carrying platforms (21) and a wire cutting apparatus, the wire cutting ap...
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WO/2020/217910A1 |
This glass plate production device 1 comprises a cutting chamber 3 and a cutting mechanism 6 for cutting and separating an unwanted part 4a from a glass plate 4 in a vertical orientation inside the cutting chamber 3, the glass plate prod...
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WO/2020/214870A1 |
An apparatus for manufacturing a glass laminate includes a table configured to have a substrate-glass overhang structure laid thereon, the substrate-glass overhang structure comprising a substrate and glass attached to the substrate and ...
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WO/2020/209774A1 |
A drill column end section assembly for a drill stand, comprising an end section (110) and a feed unit stopping element (120) arranged movable between a first position and a second position, wherein the stopping element (120), when in th...
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WO/2020/210105A1 |
A shaped article can include a substrate formed from a glass material, a glass ceramic material, or a combination thereof and a cavity formed in the substrate. A sidewall of the cavity can have a random textured surface with a surface ro...
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WO/2020/200868A1 |
A tool guide (1) has a mounting (5), a lifting mechanism (7), and a chassis (9). The mounting (5) is designed to fix a hand-held machine tool (6) and is mounted on the lifting mechanism (7), and the lifting mechanism (7) has a propulsion...
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WO/2020/193418A1 |
The invention relates to a hole saw, particularly for sawing a circular hole in a plaster board or similar paper-coated panel, comprising a circular cylindrical main body (2); sawtooth arrangement (12) disposed on a first end face (10) o...
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WO/2020/197931A1 |
Dust suppression agents and methods of use, e.g., to reduce operator exposure to particulate matter released during machining of a material, are described. The method may include providing a retained dust suppression agent proximate to a...
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WO/2020/192197A1 |
A clamping and boosting apparatus for a stone machine spindle box and a saw blade, comprising a stone machine spindle (1), a saw blade (2) on the spindle (1), and a clamping nut (3), wherein a hydraulic clamping booster is provided on th...
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WO/2020/189526A1 |
In this invention, first, a scribe line (110) is formed, by means of a laser, on a first surface (102) of a nitride ceramic base material (100). Then, the nitride ceramic base material (100) is split along the scribe line (110). The scri...
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WO/2020/187524A1 |
The invention relates to a method (30) for machining, in particular severing, at least one concrete part (1), in particular at least one extruded profiled element for producing a precast concrete product (28), such as a hollow-core slab....
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WO/2020/181304A1 |
A milling tool for removing material, in particular insulating material (6), comprising a fastening portion (7), which can be connected to a machine tool or a handheld tool, and a milling body (8), which is connected to the fastening por...
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WO/2020/177667A1 |
A preparation method for a monocrystalline silicon wafer. A monocrystalline silicon rod can be cut to be a strip-shaped right-angle monocrystalline silicon wafer and a monocrystalline silicon quasi square wafer or the monocrystalline sil...
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WO/2020/179057A1 |
Provided are semiconductor chip manufacturing devices (10, 20, 30, 40) which fabricate a plurality of LD chips by dividing up a semiconductor wafer (5) which is installed in a housing (2) filled with liquids (1a, 1b, 1c), has partition l...
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WO/2020/176023A1 |
The present disclosure relates to a tool holding arrangement (1, 1', 1'') comprising a rotatable shaft (2, 2', 2'') which is at least connectable to a tool driving power source (3) and comprises a first shaft thread (4, 4'). The tool hol...
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WO/2020/169351A1 |
The invention relates to a hollow core drill device (1) for generating a drill hole, wherein the hollow core drill device (1) comprises a display (4) with which a quality of a cleaning of the drill hole can be displayed. The invention al...
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WO/2020/170144A1 |
Resining plant (10) for stone slabs which provides the movement of slab supports (100) comprising, in succession, - a station (11, 20, 26, 41) for loading (14) the slabs on respective said supports (100), - a resining station (17), on wh...
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WO/2020/171766A1 |
A handheld cut-off saw (300) for cutting concrete and stone, the handheld cut-off saw comprising a drive arrangement (100, 200, 600, 800) for driving a circular cutting tool (110), the drive arrangement comprising: a belt drive portion (...
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WO/2020/167875A1 |
A power tool assembly includes a hand-held power tool. A dust collector is coupled to and supported by the power tool. The dust collector includes a motor, a suction fan driven by the motor, and a dust container. A vacuum drill bit is al...
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WO/2020/166259A1 |
The present invention relates to a method of cutting a workpiece with a wire saw, wherein: a wire guide has a plurality of grooves formed on the outer surface at a predetermined pitch along a rotation direction; the cross-sectional shape...
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WO/2020/165684A1 |
The subject of the invention is a multi-function table for mechanical processing of boards, especially tile boards, consisting of a bowl and at least one rail, characterized by the fact, that it consists of a guide rail (20) and at least...
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WO/2020/168360A1 |
Various dust collection apparatuses are disclosed. In a first example, a dust collection apparatus includes a vacuum source configured to provide a negative pressure, and a multistage filter configured to collect airborne dust drawn by t...
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WO/2020/160586A1 |
Disclosed is an apparatus, system and method for cleaning a brick that has a forward end, a rear end and mortar adhered to one or more faces thereof. The brick can be arranged in an axial direction extending from the rear end to the forw...
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WO/2020/161988A1 |
This work machine unit is provided with a support member which is attached to an end effector connection part of a work machine, a work device which is attached to one end of the support member, and a linear guide which is provided on th...
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WO/2020/161462A1 |
A laser system for modification of a sample to form a modified region at a target location within the sample, the target location being disposed below a surface of the sample, the laser system comprising: a laser light source configured ...
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WO/2020/161371A1 |
The invention relates to a rotary blade assembly that can be used in tile-cutting machines, which has an annular blade (1) mounted on a bearing (2) comprising an inner race (21), and outer race (22) and ball bearings (23). A first side o...
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WO/2020/151262A1 |
A multi-line cutting method, a multi-line cutting apparatus and use thereof, a semiconductor material and a power device. The multi-line cutting method comprises the following steps: configuring a line spool (20) for winding cutting line...
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WO/2020/151929A1 |
The invention relates to an application tool, in particular a chisel or a drill bit, having a tool head, having a shank region in which a main body is arranged, wherein the main body has a first hardness, and having a coating that has a ...
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WO/2020/150601A1 |
A grinder head for high pressure mobile cleaning of roadways. The grinder head combines a rotating spinner member having polycrystalline diamond cutting tips which work in combination with ultra-high pressurized fluid for removing roadwa...
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WO/2020/149125A1 |
The present invention is a workpiece cutting method for simultaneously cutting a workpiece at multiple sites by winding a fixed abrasive grain wire on multiple grooved rollers to form a wire row and, while reciprocating the same, feeding...
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WO/2020/133731A1 |
Provided is a coarsened bare diamond wire saw, comprising a base line (1), a metal coating (2) and diamond particles (3) embedded in the metal coating, the surfaces of the diamond particles being subjected to coarsening. The embedded dep...
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WO/2020/137713A1 |
Provided is a cutting method, for example, which uses a wire tool and with which it is possible to cut a workpiece more efficiently than before without degrading machining quality. This cutting method is a cutting method for cutting a wo...
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WO/2020/129569A1 |
A laser machining method that comprises a first step in which laser light is shined into a semiconductor object from the surface of the semiconductor object to form a modified region inside the semiconductor object along a virtual plane ...
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WO/2020/126091A1 |
The invention relates to a machining segment (41), which is composed of a first matrix material (44) and first hard material particles (45), the first hard material particles (45) being arranged in the first matrix material (44) accordin...
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WO/2020/130053A1 |
A laser machining method for cutting a semiconductor target along a virtual plane that is inside the semiconductor target and faces the surface of the semiconductor target, said method comprising: a first step for preparing the semicondu...
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WO/2020/130108A1 |
A laser machining method for cutting a semiconductor wafer along a virtual plane that is inside the semiconductor wafer and faces the surface of the semiconductor wafer, said method comprising: a first step for forming a plurality of mod...
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WO/2020/130054A1 |
JP19/049700 Provided is a laser processing method for cutting a semiconductor object along a virtual plane facing a semiconductor object surface inside the semiconductor object, the method comprising: a first step for forming a plurality...
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WO/2020/129907A1 |
This manufacturing method for a glass plate is provided with: a molding step for molding a glass ribbon G in a molding zone 11; a transportation step for transporting the glass ribbon G; and a detection step for measuring the temperature...
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WO/2020/130055A1 |
Provided is a laser processing method for cutting a semiconductor object along a virtual plane facing a semiconductor object surface inside the semiconductor object, the method comprising: a first step for forming a plurality of first mo...
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WO/2020/131163A1 |
An apparatus including a controller, and at least two cutting head assemblies. The controller typically includes a computer processor, and a computer memory, having a computer program stored therein. The controller automatically controls...
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WO/2020/129913A1 |
This semiconductor object heating device comprises: a heating unit for heating a semiconductor object having, on the interior thereof, a modified region including a plurality of modified spots, a plurality of cracks respectively extendin...
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WO/2020/130109A1 |
A laser machining method comprising: a first step in which the inside of a semiconductor object containing gallium is irradiated with laser light from the surface of the semiconductor object, thereby forming, along a virtual plane on the...
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