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WO/2005/061184A1 |
An adhesively mounted angled clamp-like device (2, 102)for producing a compressive force or tensile force includes a frame (4, 104), at least two plungers (6, 8, 106, 108) arranged at an angle movably connected with the frame, and double...
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WO/2005/059991A1 |
Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart fr...
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WO/2005/049287A1 |
A vacuum suction head capable of being used also for a large-sized liquid crystal display panel and capable of reliably sucking an object to be sucked even the object has undulation or flexure. The suction head has a shaft, the shaft hol...
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WO/2005/046938A1 |
An adhesively mounted single-sided clamp-like device (2) for producing a compressive force or tensile force includes a body (4), a plunger (6) movably connected with the body, and a double-sided stretch releasing adhesive (8a, 8b) attach...
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WO/2005/042204A2 |
Disclosed is a clamping table (1) for workpieces (8) in a machine tool. Said clamping table (1) comprises a plurality of clamping elements (3) that are located next to each other. Each of the clamping elements (3) is provided with a tele...
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WO/2005/021211A1 |
The present invention relates to a method of holding a drill blank in an upright position by inserting it into a particle bed. The particle bed holds the drill blank in the desired orientation without any further supporting means. The pa...
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WO/2005/018870A1 |
Method and apparatus for holding a wafer having a wafer dimension during processing, the vacuum chuck comprising a concave wafer platen configured force the wafer into intimate contact with the wafer platen and provide a seal therebetwee...
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WO/2005/014229A1 |
A vacuum hold-down device comprising a base member (1) and a separate workpiece support (8) which co-operate to define a vacuum chamber. The device further comprises a venturi (15) having an inlet port (7) for connection to a source of p...
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WO/2004/108359A1 |
The invention relates to a valve (1, 2, 3, 4, 5, 6) having a pilot-operated magnetic or magnetizable pilot valve member (80) and a main valve member (70) of a vacuum system used in a wood working machine. Said wood working machine compri...
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WO/2004/106005A1 |
The present invention provides clamping apparatus (2) for holding an item (42) in a generally vertical plane, the apparaws (2) comprising two members (4, 6) for clamping about an item (42), and biasiing means (32) for biasing the two cla...
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WO/2004/103747A1 |
A method for the non-destructive removal of fixed window elements (1) from vehicles uses a cutting wire (15) that is threaded through the adhesive bonding a window element to a vehicle and that is placed in a loop around the perimeter of...
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WO/2004/103748A1 |
A method for the non-destructive removal of very small fixed window elements (40) from vehicles uses a cutting wire that is threaded through the adhesive bonding a window element to a vehicle, that is placed in a loop around the perimete...
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WO/2004/101911A1 |
A clamp (10) for clamping a door (16) has first and second clamp surfaces which define a jaw for clamping each face of the door; the surfaces being moveable with respect one to another, so as to accommodate doors of different widths; a b...
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WO/2004/096496A1 |
A jig and method thereof for manufacturing rimless spectacles that are adhered without the need for drilling or cutting, comprising a means (2) for positioning and retaining a lugged nose bridge between the inner edges of a pair of spect...
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WO/2004/094103A1 |
The invention relates to a workbench for preparing a workpiece to be machined on an especially digitally controlled machine-tool. Said workbench is characterised in that it consists of a granite top (8) which is horizontally arranged on ...
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WO/2004/073946A1 |
A first sub-table, a second sub-table, a rubber plate, and a metallic plate are structured in a layer form as a substrate- processing table. The substrate-processing table has substrate adsorption holes for sucking a substrate, penetrati...
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WO/2004/073028A2 |
A vacuum chuck for holding a semiconductor wafer during supercritical processing comprising: a substantially smooth wafer holding region for holding the semiconductor wafer; a vacuum port for applying vacuum to a portion of the wafer hol...
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WO/2004/068925A1 |
The invention relates to an attaching-positioning device for attaching objects (100), particularly electrical components to substrates, comprising a moving support (110), a gripper (140) that can linearly move in an attaching direction (...
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WO/2004/065049A1 |
A system and method are described for holding and releasing a workpiece (108) for electrochemical machining. In one embodiment, a workpiece holder (104) has a workpiece surface that couples to the workpiece when negative pressure is appl...
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WO/2004/050516A1 |
A device for working material plates (1), such as glass sheets, comprises a supporting device (25, 26, 29) for the material plate (1) and a tool (12, 18) for working the material plates (1). The supporting device (25, 26, 29) has support...
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WO/2004/044953A2 |
A vacuum chuck fir holding a semiconductor wafer during high pressure processing comprises a wafer platen, first through third lift pins, and an actuator mechanism. The wafer platen comprises a smooth surface, first through third lift pi...
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WO/2004/033149A1 |
A glass pane machining device (1) capable of disposing suction cups at positions most suitable for suckingly fixing a glass pane according to the shape of the glass pane, comprising a grinding means (7) for grinding the peripheral edges ...
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WO/2004/012940A1 |
A windscreen heater is used for heating a windscreen prior to and/or during resin repair. The heated windscreen promotes the flow of resin to repair the windscreen. The device is mounted to the windscreen and has a port enabling viewing ...
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WO/2004/011191A1 |
The present invention is concerned with an apparatus (2) and a method., for holding in position adjacent facing ends of tube sections for preferably joining them by welding. The apparatus has an elongated element (8) insertable between t...
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WO/2004/011953A1 |
A chuck (Figure 7) using a suction force for holding a semiconductor wafer is provided. The chuck includes a chuck plate (40') and may further include a manifold plate (96), and a seal plate (42). The chuck plate includes a first contact...
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WO/2003/106109A1 |
A portable clamp device having a base plate upon which a first clamp member is mounted, said clamp device also includes a second opposing clamp member the movement of which is actuated by movement of a lever arm such that once pressure o...
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WO/2003/103904A1 |
A compact vacuum system capable of effectively performing both vacuum sucking and air supply. A general purpose vacuum pump (12) is provided in a vacuum system (10). On the exhaust side of the vacuum pump (12), a positive pressure-side t...
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WO/2003/101671A1 |
A hand-held suction device for handling a substantially planar workpiece (1), comprising a handle (2), a vacuum source (3), one or more suction members operatively linked to the vacuum source (7, 8), and a guide means comprising one or m...
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WO/2003/099520A1 |
The present invention is a cabinet installation device that comprises a base (12), a support (18), a lifting and lowering assembly (18). Extending upward from the base (12) is a guide assembly (24). The guide (24) aids during the lifting...
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WO/2003/095149A2 |
A clamp (10) holding an object such as a door (36). The clamp comprises a body (12) shaped to define a recess (14) for receiving a portion of the object, and a wedge which is movable within the recess in order to clamp the object, betwee...
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WO/2003/093693A1 |
The invention relates to a suction-cup device comprising a cup-shaped supporting body (1) and a suction membrane (2) that lies in the cup opening of the supporting body (1). A pull rod (3), whose free end (3') penetrates a central openin...
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WO/2003/090236A1 |
The invention provides a magnetic strip (10) that comprises a series of magnet (14), a flexible material strip (12) locating and at least in part enclosing each surface of each magnet to define a longitudinal flexible arrangement capable...
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WO/2003/078921A2 |
The invention relates to a gauge for controlling the form of shaped sections which are long, curved and/or shaped, such as wires or tubes having straight parts and curved parts. Said gauge comprises a base (4) and brackets (12) such that...
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WO/2003/072964A1 |
A vacuum support includes a vacuum plate having a top surface and a bottom surface, the vacuum plate having a mechanical stop extending from the bottom surface; an elastomeric seal extending along a periphery of the bottom surface, the v...
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WO/2003/072308A1 |
Disclosed is a jig assembly for reproducing a key from an original key. The jig assembly has a jig including a processing section, which is processed identical to the shape of the original key, first and second fixing sections for fixing...
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WO/2003/037563A1 |
Method of determining the position of at least one supporting pin for supporting a side (15) of a substrate (14) in a com ponent placement machine. In a first step of the method, the supporting side (15) of the substrate is made at least...
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WO/2003/028954A2 |
A handler for applying a vacuum holding force to an object is provided. The handler generally includes a body having a plurality of levels of openings including a holding surface level and a suction surface level, and optionally one or m...
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WO/2003/022514A1 |
A magnetic pallet (1) for anchorage of a ferromagnetic part to be taken for machining to a machine tool with horizontal tool axis, said magnetic pallet (1) comprising a base plate (3), a vertical parallelepiped shoulder (5) extending fro...
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WO/2003/022527A1 |
A ratchet wrench (10, 60, 100) consisting of a socket driver head (12, 62, 112) pivoting or fixed at one end, an elongated handle (26, 64, 126) in the middle, and a pivoting extension shaft (36, 74, 136) having an extended handle grip at...
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WO/2003/017338A2 |
A wafer chuck is provided, having a wafer chucking surface, and a plunger consisting either of a body that extends at least partially along the outer perimeter of the wafer chucking surface, or a plurality of pins positioned outside the ...
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WO/2003/009972A2 |
The present invention discloses a magnetic clamping device having at least one magnetic holding unit comprising a switchable magnet generating a magnetic clamping force at a workpiece and a sensing means, wherein said sensing means compr...
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WO2002081221B1 |
A magnetic holding (1) device and method of manufacturing same are disclosed. The device has a support structure (10) made of an iron alloy and has a substantially planer bearing surface with at least one magnetic (20) or magnetisable re...
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WO/2002/098575A1 |
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles that fire droplets having a deposited width when deposited on the su...
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WO/2002/098573A1 |
A microdeposition system (20) and method includes a head with a plurality of nozzles (230). A controller (22) generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory st...
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WO/2002/099850A2 |
A microdeposition apparatus (10) and method according to the invention includes an interchangeable microdeposition head (16) for depositing fluid manufacturing material on a substruate to form microstructures. The apparatus (10) includes...
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WO/2002/099849A2 |
A PMD system (300) according to the invention deposits a fluid manufacturing material on a substrate (350). The PMD system (300) includes a first and second microdeposition head (320), each mounted on a head support (310) and held above ...
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WO/2002/098574A1 |
A microdeposition apparatus and method according to the invention deposits a fluid manufacturing material on a substrate to form microstructures. The apparatus includes a microdeposition head mounted on a head support and held above a su...
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WO/2002/098576A1 |
A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition hea...
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WO/2002/099851A2 |
A temperature controllable vacuum chuck (10) includes a mounting bracket (12) , a porous plate (14) , a heating element (30) , and a temperature sensor (80) . The porous plate is mounted to the mounting bracket and is configured for secu...
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WO/2002/099848A2 |
A method for manufacturing structure on a printed circuit board substrate according to the invention includes positioning a printed circuit board substrate (38) in a machine (10) capable of performing piezoelectric deposition of a fluid ...
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