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WO/2021/183763A1 |
Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing a CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) w...
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WO/2021/179515A1 |
Disclosed are a method and a device for milling and grinding a large-aperture aspheric surface by using a splicing method, and a polishing method. An aspheric surface is discretized into a series of annular belts with different radiuses,...
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WO/2021/171155A1 |
A fluid dispensing system for a robotic repair unit that includes a fluid container. The system also includes a fluid dispenser associated with a robotic repair unit. The system also contains a fluid coupler that connects the polish cont...
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WO/2021/169178A1 |
The present invention belongs to the field of machining technology, and in particular relates to an ultra-precision machining method and device for a quartz harmonic oscillator. Firstly, the outer surface of a quartz harmonic oscillator ...
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WO/2021/171132A1 |
A low viscosity polish kit for a robotic repair unit. The kit includes a sealed container containing a low viscosity polish. The sealed container has a coupling mechanism. The kit also includes a connector configured to couple to the cou...
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WO/2021/171154A1 |
A robotic repair unit (400) is presented that includes a removal tool (330, 425) coupled to the robotic repair unit (400). The removal tool (330, 425) is configured to remove fluid or debris from a worksurface (130). The repair unit (400...
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WO/2021/165560A1 |
The present invention refers to a device that is coupled to motorised tools of which the implement or consumable rotates, preferably tools of the portable or swivelling type, supplying fluids either to the surface on which the implement ...
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WO/2021/164674A1 |
A polishing liquid feeding system, comprising a polishing liquid preparation device (1), a washing liquid feeding device (2), and a filtering device (3), and further comprising a feeding pipeline (10) communicating the polishing liquid p...
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WO/2021/135452A1 |
A sub-aperture center liquid supply optical surface machining tool comprising an elastic coupling (1), a polishing disk (3) and a polishing pad (5), wherein two ends of the elastic coupling (1) are connected to the polishing disk (3) and...
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WO/2021/109693A1 |
A wax nozzle moisturizing apparatus for a polishing device during the polishing process of a silicon wafer. The apparatus comprises: an anti-coagulation pipeline (8) connected to an anti-coagulation liquid container and a fixing support ...
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WO/2021/108739A1 |
This in-line active and reverse calculating mass balance blending system can maintain a chemical at desired control points, such as with respect to concentration, temperature, and/or pressure, while the output flow rate is changing dynam...
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WO/2021/105876A1 |
A disc changing system for a robotic defect repair system is presented. The system has a first abrasive disc and a second abrasive disc. The first and second abrasive discs are coupled to a liner. The system includes an abrasive disc pla...
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WO/2021/099681A1 |
The present invention relates to a device for polishing a specimen (104, 204). The device comprises a polishing platen (101, 201) rotatable about an axis, a polishing pad (103, 203) attached to the polishing platen (101, 201), a specimen...
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WO/2021/084386A1 |
An abrasive solution for finishing a metal part is provided. The abrasive solution includes abrasive particles suspended in a solution. The abrasive particles are configured to abrade a surface of the metal part. The abrasive particles a...
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WO/2021/085762A1 |
The present invention provides a grinding system. The present invention provides a grinding system comprising a grinding unit which is provided with a grinding wheel unit with grains of various sizes, and which rotates the grinding wheel...
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WO/2021/080775A1 |
In one embodiment, a fluid delivery apparatus includes a vessel body having a first chamber and a second chamber disposed therein, a plurality of first delivery lines fluidly coupled to the first chamber, a dispense nozzle fluidly couple...
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WO/2021/036473A1 |
An abrasive flow treatment device employing a large slope, a circuitous path, and a complex single channel comprises a material discharging cylinder (8) and a fixture (7). A second piston (11) is slidably inserted in an inner cavity of t...
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WO/2021/030356A1 |
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of a heating fluid, a reservoir to hold a polishing liquid, and a dispenser having one or more apertures suspended o...
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WO/2021/030351A1 |
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of ...
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WO/2021/024899A1 |
Provided is a method for filtering a polishing-additive-containing liquid with which it is possible to implement a polishing composition that shows exceptional defect reduction performance while maintaining a practical filter life. The m...
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WO/2021/021119A1 |
Apparatus is described comprising a treatment chamber, a pump, a condenser and a secondary chamber. The treatment chamber comprises an interior into which an article to be treated can be disposed. The condenser, the pump and the secondar...
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WO/2021/008130A1 |
A magnetorheological finishing apparatus for an artificial knee joint tibial support. An upper grinding plate (1) of the apparatus is detachably fixed on a frame, an internal gear (4) is rotatably arranged on the frame, at least one plan...
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WO/2020/250878A1 |
To supply a sufficient amount of liquid to a substrate without use of a rotary joint in a face-up-type polishing device. The present application discloses, as one embodiment, a polishing head 200 for a polishing device 1000 that holds ...
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WO/2020/219006A1 |
Apparatus is described comprising a hermetically sealable treatment chamber, a pump and a disperser. The treatment chamber comprises an interior into which an article to be treated can be disposed. The pump is in fluidic communication wi...
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WO/2020/214712A1 |
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polish...
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WO/2020/199193A1 |
Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system...
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WO/2020/203140A1 |
An abrasive supply device is provided with: a slurry supply passage 40 having a plurality of slurry drop holes 400; an upper surface plate 10 having a plurality of slurry supply holes 100; and a slurry guide unit 50 having a plurality of...
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WO/2020/199392A1 |
An internal meshing gear running-in test device and a test method therefor; a chuck device (4) comprises a chuck structure and a rotating structure; the chuck structure is used to fix a testing ring gear; the rotating structure comprises...
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WO/2020/177504A1 |
Disclosed are an electrostatic nozzle and a controllable jet minimal quantity lubrication grinding system. The electrostatic nozzle comprises a nozzle core (45), wherein an upper portion of the nozzle core (45) is connected to an upper n...
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WO/2020/156583A1 |
A device for recycling, separating and purifying oil mist during a minimum quantity lubricant grinding and machining process, comprising: a wind power separation mechanism and a filtering and recycling mechanism, wherein the wind separat...
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WO/2020/143260A1 |
A swing arm for polishing slurry delivery and a polishing device, comprising an arm element (1) provided with a polishing slurry delivery pipe (3) for polishing slurry delivery. A slurry landing-location adjustment block (7) is slidingly...
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WO/2020/145121A1 |
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...
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WO/2020/119779A1 |
Disclosed are a semiconductor wafer photoelectrochemical mechanical polishing processing device and a processing method therefor. A wafer (4) is adhered and fixed to a polishing head (3) by means of a conductive adhesive, and the wafer (...
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WO/2020/123332A1 |
The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing a...
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WO/2020/123203A1 |
A grinding wheel and methods of manufacturing the same. The grinding wheel includes a core region extending around a central axis and a grinding region circumferentially surrounding the core region. The grinding wheel also includes at le...
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WO/2020/117441A1 |
A chemical mechanical polishing composition for polishing a substrate having copper, barrier, and dielectric layers includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole...
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WO/2020/117438A1 |
A chemical mechanical polishing composition for polishing a substrate having a cobalt layer includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the p...
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WO/2020/117440A1 |
The invention provides a chemical mechanical polishing composition for polishing a silicon nitride containing substrate. The composition includes an aqueous carrier; cationic silica particles dispersed in the aqueous carrier, the cationi...
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WO/2020/117439A1 |
A chemical mechanical polishing composition for polishing a substrate includes a liquid carrier and cationic metal oxide abrasive particles dispersed in the liquid carrier. The cationic metal oxide abrasive particles have a surface modif...
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WO/2020/106904A1 |
A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional ro...
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WO/2020/091275A1 |
According to one embodiment of the present invention, provided is a device for removing scratches from plastic, comprising: a polishing part capable of maintaining a state in which an abrasive is applied to a surface, and rubbing against...
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WO/2020/048874A1 |
A polishing device held on a robot arm (1), having a support plate (9), a polishing disc (10) held thereon, a drive moving the support plate (9) in a plane, and a metering device (8) for feeding a polishing agent to the working side of t...
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WO/2020/022538A1 |
The present invention relates to a method for manufacturing a manifold insulator for a molten carbonate fuel cell, and a manifold insulator for a molten carbonate fuel cell, which is manufactured using same and has an intaglio part havin...
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WO/2020/013151A1 |
According to one embodiment for supplying an automated device that conveys a rectangular substrate, a substrate-conveying device is provided for conveying the rectangular substrate, the substrate-conveying device having: a plurality of c...
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WO/2019/246396A1 |
Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine are disclosed. An example system to dispense fluid for a grinder/polisher includes: a fluid dispenser having: a fluid reservoir to store a...
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WO/2019/239013A1 |
The disclosed solution comprises a method of abrading the surface of a workpiece. The method comprises providing a workpiece (3), an abrading apparatus (14) with a backing pad (10) configured to receive an abrading plate (2), an abrading...
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WO/2019/231323A1 |
The present invention relates to a floor treatment apparatus (1) and method for treating a floor. The apparatus comprises: • - a housing (10) comprising a top plate (11), and • - a drive system comprising: • - a transmission (21) a...
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WO/2019/220820A1 |
The present invention provides an ingot cutting method whereby a wire row is formed by a wire wound spirally between a plurality of wire guides and running in an axial direction, and, while a slurry is being supplied from a nozzle to a c...
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WO/2019/213729A1 |
A feed system, for feeding grinding bodies to a vertical mill (10), comprises a pumping unit (50) for sucking a propulsion liquid from a source (F) and for supplying said liquid under pressure into a discharge tube (51); an intake connec...
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WO/2019/199073A1 |
Polishing compositions according to various embodiments of the present disclosure comprise a fluorine-containing compound, a pH adjuster, an additive, and water, wherein the content of the fluorine-containing compound may be 0.01-20 wt% ...
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