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JP6894805B2 |
In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a subs...
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JP2021094661A |
To suppress occurrence of irregularities that may cause crack with respect to a wafer having a circular recessed part and an annular protruding part formed by grinding.In a first circular recessed part formation step, control means forms...
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JP2021091075A |
To provide an apparatus capable of efficiently grinding a circular pipe outer diameter at low cost.A grinding apparatus for a circular pipe outer diameter comprises a transmission device, a grinding blade tool, a blade tool fixing device...
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JP6877800B1 |
To perform finish grinding of a round hole of a work, and to realize finish grinding of an inner surface of a round hole which cannot be performed by an inner surface grinding machine in a horizontal machining center. As a first step, a ...
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JP6878605B2 |
This processing device is provided with: a rotatable chuck (23) that holds a processing tool (24); a chuck plate (1) that holds an object to be processed (W); rotors (4, 5, 6, 12, 13) to which the chuck plate (1) is attached and which ha...
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JP2021074825A |
To provide a holding surface cleaning device, which can prevent processing waste ground out from a holding surface from re-adhering to the holding surface.A holding surface cleaning device 8, which cleans a holding surface 300 of a chuck...
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JP6872709B1 |
To provide a surface polishing jig capable of efficiently performing surface polishing even for an object to be polished having an insulating layer on the entire surface. A cylindrical insulator 12 is arranged inside a cylindrical electr...
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JP2021050777A |
To provide a device which is equipped with an actuator, and can simply and properly determine whether or not abnormality occurs in the actuator.A device is equipped with an actuator which includes a cylinder supplied with a fluid and a p...
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JP2021045832A |
To efficiently and accurately remove burrs generated on a card base material.A card processing device comprises: a rotary grinder for grinding an edge part of a card base material; a moving part for moving the rotary grinder perpendicula...
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JP6847970B2 |
The present disclosure relates to a cutting machine comprising a rotating cutting wheel for performing separating cuts in a workpiece, and also relates to a workpiece positioning device for such a cutting machine. The cutting machine com...
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JP2021041509A |
To provide a position measurement device that measures positions of a rotary grindstone and of a rotating work-piece in a non-contact manner.A position measurement device 10, which measures a position of a rotary grindstone 203, using a ...
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JP2021030421A |
To provide a polishing device with automatically speed-changeable matte.A polishing device includes a main body, a transmission space is provided in the main body, a transmission device is installed in the transmission space, a polishing...
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JP6831675B2 |
To provide a cutting device which can automatically perform positioning of a table in a longitudinal direction with high accuracy.A cutting device having: a cutting grindstone 30 which cuts a work-piece W; a table 10 which supports the w...
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JP3230529U |
To make it impossible to reuse a support shaft or the like due to galling of a screw portion in a fixed portion between a support shaft and a surface plate, and to loosen the support shaft from the surface plate during operation of an ap...
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JP2021010966A |
To freely move a brush for every shape of a workpiece for accurately performing deburring.A deburring device 10 of the disclosure is a deburring device 10 for removing burr B formed on a workpiece W which is formed of a ceramic molding b...
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JP6811885B1 |
To propose a surface texturing method which facilitates various processing on the surface of a work. When surface texture is applied to a work W, first, a rotation of the head 100 is performed between a head 100 of a machine tool and a t...
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JP2020192634A |
To provide a method for adjusting a height of a polishing head by which a down time of a polishing device can be reduced, and a cost required when replacing an abrasive pad can be reduced.According to this method, a reference height of a...
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JP6793767B2 |
To provide a wafer grinding device capable of smoothly and easily executing positioning of a grinding start position.A wafer grinding device comprises: an arm 11 which is extended in a horizontal direction H; lifting/lowering means 12 fo...
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JP6790574B2 |
The present invention provides a main spindle device. The main spindle device includes a grinding wheel spindle (54), a spindle supporting body (60), a grinding wheel motor (55M), and a small-diameterpulley (52) for transmitting a rotati...
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JP6784151B2 |
To provide a plate-like body processing method by which a dimension of a plate-like body after processing can be stabilized.According to this plate like-body processing method, cut processing, in which a table and a rotary grindstone are...
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JP6772876B2 |
To provide a rotation device which can stably transmit a rotation torque from a drive shaft to a driven shaft, and improve durability even in a situation in which, there is restriction to a clearance, and there is a slight declination be...
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JP6774242B2 |
To provide a spindle unit which inhibits processed waste from entering into a gap between a cover and a spindle shaft and scratching the spindle shaft.A spindle unit (42) includes: a spindle shaft (44) in which a mount (45), to which a g...
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JP6774077B1 |
To provide a rail grinding device capable of reducing a burden on an operator and performing high-precision finishing. A grinder support frame 6 for supporting a grinder 5 for grinding the surface of a rail 2 with a grindstone 4 and a gu...
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JP2020168674A |
To provide a simple and low cost polishing device with which a polishing state may be checked and monitored accurately from start to end of polishing, and to provide a polishing method.A polishing device includes: a drive part 3; a polis...
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JP2020157384A |
To measure a height of a table holding surface without damaging the table holding surface of a grinding device and grind a work-piece to be held into a desired thickness while measuring the thickness of the work-piece.A grinding device 1...
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JP2020155429A |
To form cutting from the rear face of a wafer at the same position as cutting which has been already formed on the surface side of the wafer.According to an output of a photoelectronic sensor under a state where an optical path of spot l...
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JP6754638B2 |
To measure the distance between a holding surface and a mounting surface on a wheel mount while setting the height from the holding surface to the mounting surface in the same state as that at the time of grinding a plate-like work piece...
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JP6752367B2 |
A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate h...
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JP6748134B2 |
An objective of the present invention is to promote a reduction in a size of a work table apparatus of a counterweight member. According to the present invention, the work table apparatus comprises a pair of side weights (26, 28) arrange...
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JP2020124753A |
To attach a measuring tool on a mount of the tool even if grinding chips are stuck to a female screw in the tool for measuring the interval between a table holding surface and a mount attaching surface.A tool 9 measures the interval betw...
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JP2020121374A |
To obtain a high-accuracy cut depth with respect to a processed product even if a variation occurs in a height of a holding face of a chuck table.A cutter original position registration method comprises: a sheet holding step ST1 for hold...
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JP6736728B2 |
To provide a grinding processing device capable of shortening a grinding processing handling time by reducing the amount of movement of a grindstone for grinding a work.A grinding processing device 10 comprises a sensor 15 for measuring ...
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JP6734667B2 |
To recognize a wear amount of a grinding tool and eliminate useless operations in grinding.A grinding device 1 includes: a table 30; grinding means 7; means 5 which feeds the grinding means 7 for grinding; means 8 which dresses a grindin...
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JP6734670B2 |
To provide a grinding device that can reduce loads of a motor while preventing occurrence of backlash in grinding a wafer using the device.The grinding device comprises grinding means 7 and means 5 for grinding/feeding the grinding means...
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JP6736367B2 |
To prevent galling of a spindle shaft by configuring so that an exposed surface of the spindle shaft from a casing can be cleaned.A spindle unit includes: a spindle shaft (44) in which a mount (45) designed to receive a grinding wheel (4...
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JP6733022B2 |
To provide a groove machining device using a wire saw and a groove machining method using the same which can perform a step of forming a groove in one work-piece and a step of cutting a prescribed position in the work-piece, at the same ...
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JP6728203B2 |
A positioning of a spindle with micrometric forwarding control and tilting of its rotation axis includes a spindle shaft rotatingly supported inside rotatable supports, wherein the rotatable supports include two spherical elements having...
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JP2020104180A |
To provide a processing tool which can enter into a narrow space and properly maintain force that presses a tool to a polishing object.A processing tool has: an arm having a first end part and a second end part; a support member connecte...
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JP3226610U |
To provide a handy type sanding device which can be easily carried, improves the adhesion between a sanding surface and a sanding unit, and can prevent uneven wear of the sanding surface. A handy sanding device includes a power generatio...
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JP6718047B1 |
To provide a protective hub polishing machine for buffing in a finishing processing workplace. A base 10, a support plate 12, and a support wall 17 are included, and when the base is fixedly connected to the support plate and a handle wh...
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JP6714218B1 |
To disclose an equipment for removing rust on an outer wall of an environmental protection type pipe for construction. The equipment for removing rust from the outer wall of the environmental protection type pipe for construction of the ...
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JP2020517480A |
Methods and devices for finishing the edges of the glass sheet are described. Two grindstones attached to the spindle are used to finish the edges of the glass sheet so that the edges of the grindstone chamfer the edges of the glass shee...
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JP2020089930A |
To equalize an amount that each of a plurality of plate-like works is ground, when holding and creep-feed grinding the plate-works of different thicknesses.The height of a grinding stone 37 is determined for each of a plurality of plate-...
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JP6707357B2 |
To easily detect an error in a set grinding condition when setting.A grinding device comprises condition setting means 111 for setting a position from a holding surface 16a of a chuck table 16 of a grinding grindstone 173 of a grinding u...
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JP6705959B2 |
The invention discloses work piece processing equipment for machining. The work piece processing equipment comprises a rack and a first accommodating chamber, wherein the first accommodating chamber is arranged inside the rack; the openi...
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JP2020069604A |
To provide a motor built-in type spindle device that can improve waterproof performance and suppress damage of a bearing.In a motor built-in type spindle device 10, a flinger 40 is fixed to a front end part side of a rotating shaft 11 so...
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JP2020044618A |
To provide a grinding machine and a grinding method which can improve cycle time while maintaining accuracy of processing for a work-piece.The grinding machine comprises: a work-piece support device that rotates a work-piece around a sha...
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JP6668745B2 |
To reduce driving energy to linearly reciprocate a linear reciprocating body.A linear motion variable rigidity unit 1 has a linear motion-rotation conversion mechanism 10 having a screw shaft member 12 (linear motion input/output portion...
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JP2020032472A |
To provide a wire saw device which can be down-sized, and has an effect similar to an oscillation mechanism.There is provided a wire saw device 1 in which at least one wire 2 is stretched between plural guide rollers 7, 7, and which cuts...
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JP6656548B1 |
To provide a vane groove grinding device which can improve the durability of a grindstone, simplify the configuration of an apparatus for rotating the grindstone, and can be provided at low cost. An annular grindstone 1 formed in a ring ...
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