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WO/2022/244794A1 |
This method for processing a semiconductor wafer comprises: a step in which a semiconductor wafer comprising a body section and a rim section having a protruding section with a greater thickness than the body section is prepared; a step ...
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WO/2022/234609A1 |
The invention concerns a tool for surface finishing containing a body (20) to which there is attached a surface finishing element (30) which in turn includes at least one abrasive member (31) equipped with a respective abrasive surface (...
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WO/2022/227276A1 |
An automatic coaxial positioning apparatus used for securing for sand roller outer circle machining, which comprises a tapered surface shaft sleeve (1), an elastic dual-head tapered tube (2), and a tapered head top tube (3); the tapered ...
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WO/2022/229387A1 |
The invention relates to a pneumatic actuator. According to one embodiment, the actuator has the following: a housing having a pressure chamber; a rod inserted into the pressure chamber of the housing from the outside; a rod seal which i...
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WO/2022/222280A1 |
A rotary ultrasonic grinding machine tool, comprising a rotary ultrasonic grinding spindle (1), an ultrasonic power transmission device (2), a spindle clamping and lifting device (3), and a part clamping and feeding device (4), wherein t...
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WO/2022/214666A1 |
A system (50) for handling a structural member (44) of a blade (10) of a wind turbine (2), comprising a member support (52) configured for supporting the structural member (44), the member support (52) being configured to be mounted to a...
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WO/2022/210721A1 |
The present invention provides a machining apparatus and a machining method that make it possible to perform machining on a to-be-machined object at a high machining rate, with a rigidity equivalent to that of a conventional apparatus. T...
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WO/2022/209081A1 |
The present invention reduces the time required for alignment work and comprises: a rotatable cutting table 2A, 2B that holds a sealed substrate W that has an alignment mark AM provided thereupon; a cutting mechanism 4 that cuts the seal...
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WO/2022/205548A1 |
The present invention provides a cylindrical grinding machine, comprising: a frame, a machine body, a working table, a Z-axis guide rail assembly, an X-axis guide rail assembly, a B-axis rotary assembly, and a grinding frame. The frame i...
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WO/2022/205542A1 |
A negative-pressure adsorption static-pressure supporting guide rail of a machining machine tool, comprising a guide rail groove (1), a guide rail body, and a static pressure supporting assembly. The guide rail groove (1) is fixedly form...
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WO/2022/201650A1 |
[Problem] To provide a processing system that can process a workpiece with good precision. [Solution] A processing system 1 is configured so as to comprise: a tilting device that can tilt a rotational axis 3a of a chuck 3 retaining a wor...
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WO/2022/201649A1 |
[Problem] To provide a processing apparatus that flattens a workpiece so as to have a desired thickness. [Solution] A processing apparatus 1 flattens a non-circular shape workpiece W with a grinding stone 21 and is provided with: a sucti...
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WO/2022/203881A1 |
Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The up...
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WO/2022/201701A1 |
The present invention simplifies the device configuration of a processing device having a blade replacement mechanism and reduces the footprint of the processing device, the present invention being provided with cutting tables 2A, 2B on ...
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WO/2022/201700A1 |
The present invention reduces footprint of a processing device, and comprises: a substrate accommodating unit 111 that accommodates an encapsulated substrate W; a cutting table 2A, 2B on which the encapsulated substrate W is processed by...
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WO/2022/201648A1 |
[Problem] To provide a workpiece holding device with which it is possible to precisely process a workpiece. [Solution] A holding unit 3 in a processing apparatus 1 is a workpiece holding device that rotatably holds a workpiece W being pr...
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WO/2022/193050A1 |
A transmission mechanism for toy production, comprising a toy transmission platform (1). A transmission rail side frame I (2) is fixedly mounted on the left side of the top of the toy transmission platform (1), a transmission rail side f...
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WO/2022/195493A1 |
A polishing and/or sanding head (9) comprises: a primary disc (10) which is axially hollow; a rotating shaft (12) which is rotatably received in the internal cavity of the primary disc (10) and designed in such a way as to receive a rota...
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WO/2022/057945A9 |
An engagement and release device having a range of motion, and an angle grinder having same. The engagement and release device comprises a first movable device (7), a displacement buffer assembly, and a second movable device (10). The di...
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WO/2022/195931A1 |
The present invention automatically replaces a holding plate for holding a workpiece and is provided with: a processing mechanism 4 that performs processing on a sealed board W; a plate reception part 24 that receives a holding plate M1 ...
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WO/2022/192344A1 |
A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polish...
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WO/2022/191229A1 |
The present invention provides a temporary fixing agent and a temporary fixing product comprising the temporary fixing agent. The present invention is a temporary fixing agent used to temporarily fix a member to be polished, wherein the ...
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WO/2022/187880A1 |
The invention relates to a device for machining panels, in particular a device for seaming glass panes, having a grinding head (4) which comprises a rotary drive and a grinding means (5) that can be rotatably driven thereby about a rotat...
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WO/2022/187259A1 |
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the pla...
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WO/2022/182513A1 |
A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially ...
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WO/2022/175630A1 |
The invention relates to a correction device (1) for machining a surface to be corrected (2A) of a part (2) rotating about a main central axis (X2) mounted to rotate on a frame (3), the device comprising a base (5) to be fixed on the fra...
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WO/2022/160450A1 |
A production apparatus for new energy automobile part machining. The production apparatus comprises a support frame (1), wherein a grinding mechanism is arranged above the support frame, the grinding mechanism comprises a rotary plate (2...
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WO/2022/160347A1 |
An assembly (100) comprises a parallel robot (101) and a servo spindle (102). The parallel robot (101) is adapted to be mounted onto an end flange (301) of a joint robot (30) and includes one or more axes. The servo spindle (102) is moun...
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WO/2022/156058A1 |
A workpiece disk overturning device and a double-station overturning polishing machine. The workpiece disk overturning device comprises: an overturning frame (402), which is arranged on a lifting mechanism (3), can overturn under the dri...
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WO/2022/153737A1 |
A spindle device (100, 100A, 100B, 100C, 100D, 100E) comprises a rotation shaft (10), a chuck table (20), a hydrostatic gas bearing (30), and a magnetic coupling (40). The rotation shaft has, in an axial direction that is a direction alo...
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WO/2022/148802A1 |
The invention relates to an apparatus (1) for processing surfaces, in particular floors, comprising a tool mechanism (4) having at least two tools (5a, 5b) movable relative to the tool mechanism (4), a tool motor (3) for driving the tool...
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WO/2022/147132A1 |
A mobile vehicle (10) mounted hydro demolition system comprising ultra-high pressurized water through a rotating nozzle water jet for cutting concrete, including a water supply, a vacuum blower (40), and a vacuum container that has offse...
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WO/2022/144189A1 |
The invention relates to a method for finely machining an axicon (L), which has a concave or convex conical surface (KF) with a cone axis (KA) and a cone angle (α), using geometrically undefined cutting edges in the form of bonded or lo...
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WO/2022/142698A1 |
A grinding area normal grinding force-based heavy load grinding wheel achieving self-adaptive cooling. The heavy load grinding wheel comprises a grinding wheel base body (1), grinding blocks (2), cooling spray bottles (3), spray bottle n...
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WO/2022/137894A1 |
A plate glass processing device 1 is provided with a servo mechanism 3 that moves a processing tool B in a direction for pressing the processing tool B against an end surface of plate glass A. The servo mechanism 3 is provided with a cor...
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WO/2022/126724A1 |
Disclosed in the present invention is a clamping apparatus and clamping device for an aluminum die casting during machining, comprising a clamp and a clamping head; a snap block is fixedly provided on one side surface of the clamping hea...
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WO/2022/129046A1 |
An apparatus for separating a first liner from a lens wafer includes: at least one air nozzle including a first open end facing an edge of the lens wafer and configured to eject a gas, the at least one air nozzle disposed proximal to a f...
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WO/2022/132310A1 |
A horizontal pre-clean module includes a chamber including a basin and a lid which collectively define a processing area, a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a substrate receivin...
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WO/2022/127999A1 |
The invention relates to a fluid distribution device (100, 100') for a polishing system, a polishing system and a method. More particularly, the invention relates to a fluid distribution device (100, 100') for a polishing system, in part...
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WO/2022/129233A2 |
The present invention relates to a scarfing machine, including a base a pair of platens adjustably positioned on the base. The pair of platens are configured as an upper platen and a lower platen such that the upper platen is fixed to th...
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WO/2022/130129A1 |
A sanding system is presented that includes a tool with a motor which, when actuated, drives movement of a drive shaft. The system also includes a backup pad coupled to the drive shaft. The backup pad is configured to receive an abrasive...
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WO/2022/126722A1 |
Disclosed is a polishing device used for hardware product machining and having a clamping function, comprising a rack. Polishing device bodies are fixedly connected to the top of the front end of the rack; a polishing wheel is fixedly co...
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WO/2022/128631A1 |
The invention relates to a receiving flange (101) having a fixed flange (110) which is designed to receive a tool body (130). A flange receiving area (111) is formed on the fixed flange (110) in order to connect to a spindle shaft. A cou...
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WO/2022/121012A1 |
The present invention relates to the technical field of semiconductor material processing, and in particular to a method for processing a large-size ultra-thin high-precision lithium niobate wafer. The method comprises the steps of slici...
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WO/2022/116132A1 |
The present invention relates to the technical field of polishing devices. Provided is an automatic polishing apparatus for a tablet computer. The present invention solves the problems in the art in which a polishing device for a tablet ...
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WO/2022/117568A1 |
Various embodiments relate to a machine tool, in particular for the robot-assisted machining of workpieces. The machine tool comprises a drive and a first shaft with a mounting point for a first tool and a second shaft with a mounting po...
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WO/2022/117310A1 |
The present invention relates to a method for protecting a user of a machine tool against the effects of a sudden imbalance, and a machine tool having a disc-shaped tool for carrying out the method. In the context of the invention, it is...
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WO/2022/113574A1 |
The present invention is a cutting device 100 that enables a target cutting object to be cut by a blade, said target cutting object having cutting lines, within mutually adjacent divided elements, that are set upon mutually different str...
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WO/2022/110393A1 |
Disclosed in the present invention is a grinding device for a medical scalpel cutting edge, comprising a grinding mechanism, a clamping mechanism, a loading mechanism and an unloading mechanism; the bottom of the clamping mechanism is ar...
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WO/2022/110340A1 |
The present invention relates to the field of grinding equipment. Disclosed is a grinding device for a high-temperature fast-opening spherical sealing shut-off valve, comprising a base frame, a drive device, and an angle iron frame and a...
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