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JP2021130187A |
PURPOSE: To provide practical means with high productivity as means that performs flat-processes of an end face of a small-diameter straight pin with high efficiency and with high accuracy in length and means that performs hemisphere-fac...
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JP6929206B2 |
To provide a polish device which can accurately detect a polishing end point of a peripheral edge part of a substrate.A polishing device includes: a holding stage 4 having a holding surface 4a which holds a substrate W; a polishing head ...
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JP6925017B2 |
Billets 3 are fed to billet carrying equipment 2 through billet loading equipment 28. With actuation of a first truing-up equipment the grinding apparatus of billets at both end faces 1, the billet placed on a tray 23 is trued-up to the ...
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JP6920849B2 |
A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishi...
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JP6914078B2 |
A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction pad 8 including: a pad main body 37 having a lower surface adhered to a stage 5 of a substr...
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JP6908496B2 |
A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate...
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JP6908464B2 |
A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substr...
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JP2021102258A |
To achieve constant flatness in rough grinding and finish grinding performed to an object to be ground (a ground object).A grinding mechanism includes: a table 2 which holds a plate-like ground object W; a table moving part 3 which linea...
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JP6896476B2 |
To eliminate wafer damage after performing wafer shape processing and damage of a wafer end face in a step of pressing a polishing tape against an edge portion of the wafer end face.In a wafer W thinned to a desired thickness by back gri...
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JP2021091030A |
To provide a substrate processing device capable of preventing contamination of a substrate attributed to adhesion of foreign matter by quickly removing foreign matter generated by polishing of a peripheral edge part of the substrate.A s...
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JP6882017B2 |
A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; ...
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JP6873782B2 |
To provide a polishing apparatus capable of obtaining a desired polishing result on the entire surface of a substrate such as a wafer.A polishing apparatus includes a substrate holding unit 10 for holding the substrate W, a polishing hea...
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JP2021510639A |
A method of grinding and / or polishing a defective portion (1) in the surface coating of a workpiece, in which a grinding or polishing disc held by a tool is rotated and / or a circular trajectory while applying pressure over the defect...
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JP6852034B2 |
A polishing device is provided with an expandable or contractible polishing body. The polishing device is further provided with a polishing mechanism that includes: a pressing force applying mechanism that applies a pressing force to the...
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JP6851068B2 |
An object of the utility model is to provide a grind and cut / grind complex machining device and grinder wherein, grinds and cuts / grind complex machining device and can carry out grinding of work piece through a processingequipment an...
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JP6850099B2 |
The present invention provides a method of manufacturing a semiconductor apparatus and a semiconductor manufacturing apparatus which enable the thickness of a semiconductor wafer to be uniform and canthin the semiconductor wafer while su...
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JP6852099B2 |
A polishing device includes shape following sections opposing a workpiece with a polishing body interposed between the shape following sections and the workpiece, and each including a displaceable shaft section. At least two of the shaft...
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JP6849506B2 |
To provide a substrate holding device which can improve a throughput of substrate treatment.A substrate holding device 3 includes a substrate holding part 4 which holds a substrate W by vacuum suction, a vacuum line L1 which communicates...
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JP6848636B2 |
To provide a technique allowing for suppression of processing time for cleaning a peripheral edge of a substrate using a polishing tape.A cleaning apparatus for a peripheral edge of a substrate is provided that comprises: a rotation mech...
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JP2021037585A |
To provide a polishing device capable of forming a depression with a right-angle cross-sectional shape on a substrate such as a wafer using a polishing tape.A polishing device comprises a polishing head 8 with a pressing member 5 for pre...
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JP6840617B2 |
The present invention relates to a polishing apparatus and a polishing method, for pressing a polishing tool against the peripheral edge part of a substrate and polishing the peripheral edge part. The polishing apparatus is provided with...
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JP6814267B2 |
To provide a high thermal conductive heat dissipation substrate which can use a substrate for electronics, and is flexible, smooth and light weight.There is provided a graphite sheet having thickness of 20 μm to 50 μm, arithmetic surfa...
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JP6794275B2 |
To provide a polishing method by which the whole surface of a substrate including an edge part can be flattened.According to this polishing method, any one of a chemical mechanical polishing process, in which the whole surface of a first...
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JP6791092B2 |
The present invention addresses the problem of providing a continuous grinding method for a metal strip and a continuous grinding production line for a metal strip, which are useful for preventing anignition accident during grinding work...
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JP6791097B2 |
The present invention addresses the problem of providing a belt-type grinding device for a metal belt and a belt-type grinding method for the metal belt, which are useful for preventing a fire accident in a grinding operation. This belt-...
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JP6786292B2 |
To provide a polishing device which can prevent a polishing tape from being shifted with respect to a pressing member when an edge part of a substrate is polished by swinging a polishing tape.A polishing device includes a substrate holdi...
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JP6781844B2 |
[Technical Problem] Provided is a belt-type grinding tool configured to be capable of cooling an endless grinding belt even more efficiently.[Solution to Problem] The belt-type grinding tool 10 includes a fan 36 disposed inside an outer ...
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JP6765201B2 |
To provide a polishing machine that is capable of polishing plural workpieces in a uniform manner, and giving them a smooth curved surface in a short time.A polishing machine 1 includes: a polishing device 10 that polishes by moving a po...
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JP6764708B2 |
To provide a connection part polishing device for trolley wires which allows even an unskilled worker to obtain smooth slide surfaces inclined according to a step between slide surfaces of two trolley wires pressed against each other.A d...
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JP2020104189A |
To provide a polishing method that can form an uneven part constituted of a smooth plane on an edge of a substrate such as a wafer and attain high throughput.The polishing method includes a step in which a dent is formed on an edge of a ...
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JP6715986B1 |
To provide a belt polishing tool which can be machine-mounted without causing a shape change on a surface to be polished. A main body, a shank connected to the main body, a power generating part, an endless polishing belt, and a polishin...
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JP2020517483A |
The present invention is a method of removing scratches on a treated, particularly finish-painted surface by grinding, after detection of the scratches, a flexible polishing sheet moves to the surface and presses against the machined scr...
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JP6706181B2 |
To provide a polishing method capable of consuming a polishing tape as much as possible, and capable of reducing the number of discarded substrates, by preventing occurrence of tape end error.A polishing method executes residual quantity...
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JP2020075299A |
To perform chamfering to rear end side (root side) of a peripheral end edge part of a wafer mounting surface in a vertical type wafer board comprising a wafer support part of a long-size shape, and to suppress occurrence of slip and so o...
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JP6676504B2 |
To provide a polishing method and a polishing device, which enable a base plate to be polished with a polishing tape, while sufficiently utilizing the polishing capability of the polishing tape.A base plate is rotated, and polished while...
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JP6673965B2 |
To provide a plate-like member polishing method and device, which carries a polishing tape for polishing a plate-like member on a surface-plate member, makes a tape transfer mechanism of a tape polishing mechanism transfer the polishing ...
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JP6672104B2 |
To provide a polishing device which can unfailingly prevent displacement of a polishing tool during polishing of a substrate such as a wafer and form a smooth vertical surface at an edge part of the substrate.A polishing device includes:...
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JP2020028928A |
To provide a processing method which makes it possible to increase a processing rate and form a smooth processed surface on a substrate.A processing method includes: forming a horizontal surface HS and a vertical surface VS on an edge pa...
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JP2020013918A |
To provide a polishing apparatus capable of accurately detecting a polishing end point of a peripheral portion of a substrate such as a wafer.A polishing apparatus includes a polishing head 34 that presses a polishing tool 42 against a p...
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JP6625461B2 |
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JP2019216207A |
To provide a substrate processing method that is able to prevent sticking of foreign matter to a substrate.A substrate processing method comprises: a substrate rotation step in which a substrate W is rotated while being held; a first liq...
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JP6614978B2 |
To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for ho...
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JP6594639B2 |
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JP6587135B2 |
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JP6586023B2 |
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JP6583701B2 |
Loopback rolls which can transfer and guide a polishing tape (T) along a perimeter of a pressure contact roll (R) is provided, the pressure contact roll having a tapered peripheral edge having a top edge and a pair of slant edge faces fo...
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JP2019155519A |
To provide a polishing device which can prevent a polishing tape from being displaced relative to a pressing member during polishing of an edge part of a substrate.A polishing device includes: a substrate holding part which holds and rot...
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JP2019155541A |
To simplify compared to a conventional constitution, a belt sanding machine which includes a polishing device capable of selectively pressing a polishing belt to a workpiece by a plurality of tread pressure heads.A rotary holder 30 is pi...
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JP6573381B2 |
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JP6574741B2 |
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