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JP2024006699A |
The present invention provides a hub unit bearing and a method for manufacturing the hub unit bearing that can prevent grinding cracks and grinding back. [Solution] A hub unit bearing includes an inner ring member having an inner ring ra...
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JP2024001517A |
[Problem] In addition to reducing the time and cost required to create trueers and making the quality uniform, it is possible to improve the transfer rate of trueing, workability, and the accuracy of the grooves formed on trueing, and in...
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JP2023184380A |
PURPOSE: To provide a method and a device effective at a site for reducing downtime of a prober by performing the method in a short time with high efficiency without adversely affecting environment of a semiconductor manufacturing site a...
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JP7403897B1 |
An object of the present invention is to provide an optical fiber polishing holder capable of keeping the polishing length of an optical fiber constant and easily adjusting the polishing length, and an optical fiber polishing device to w...
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JP2023178927A |
To suppress cracking and chipping in a workpiece and accomplish polishing of high quality.A polishing tape is arranged so that tension is applied thereto, between a polishing tape supply pulley and a polishing tape winding pulley. Then, ...
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JP2023176843A |
To realize co-rubbing with high accuracy for many kinds of cylindrical members.A polishing device 100 for co-rubbing of cylindrical first member and second member has: a rotary table 109 on which the first member is placed, and which rot...
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JP2023551631A |
An apparatus (100) for processing a component carrier structure (102) for quality testing, the apparatus (100) comprising at least one test object (116) inside the component carrier structure (102) undergoing quality testing. ), a materi...
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JP7390230B2 |
A manufacturing method of an impeller, the manufacturing method includes: a step of forming an impeller shaped body in which a disc component part constituting a part of the disc, a blade component part constituting a part of the blade, ...
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JP7384079B2 |
A displacement driving unit and a rotation driving unit move a loading member supported by a loading member supporting mechanism after the loading member is placed in a workpiece withdrawn state from a workpiece set state and before the ...
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JP7373940B2 |
A wafer processing method includes preparing a holding table having a blade clearance portion formed therein so as to correspond to a notch of a wafer, holding the wafer by the holding table so as to make the notch of the wafer correspon...
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JP7365318B2 |
To correct a bite peculiar to polishing so-called "heso" that occurs in a work piece, and correct a position of a tool according to a contour error of the tool to process the work piece in a processing machine using a grindstone tool.A w...
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JP2023153670A |
To provide a cam grinder capable of coping with individual variation of a workpiece, and enhancing processing accuracy.A cam grinder 1 for grinding processed parts 41-44 of a workpiece 4 on the basis of profile data 302b into a non-circu...
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JP2023151593A |
To provide a polishing device and a polishing method which can reduce the time needed for polishing process to stabilize the quality of a seal surface, and to provide a machine component in which the quality of the seal surface is stabil...
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JP2023144719A |
To improve dimensional accuracy of grinding by increasing the positioning accuracy of a workpiece during grinding.A grinding apparatus includes: a grinding wheel supported so as to be rotatable about a central axis; and a support table h...
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JP2023124321A |
To provide a tire polishing device that can achieve a target polishing level with high accuracy.A tire polishing device 10 as one example of embodiments comprises a driving unit 15 that rotates a tire 1, and a polishing unit 20 that poli...
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JP2023124308A |
To provide a tire polishing device than can measure polishing amounts of a tire accurately.A tire polishing device 10 as one example of embodiments comprises a driving device 15 that rotates a tire 1, a polishing device 20 that polishes ...
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JP2023124820A |
To provide a substrate polishing apparatus that can reduce overall processing time when performing multiple types of polishing.A substrate polishing apparatus comprises a first polishing module, a second polishing module, and a third pol...
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JP7338078B1 |
A tip dresser capable of applying an appropriate current and voltage to a welded portion when resistance welding is performed. A rod-shaped member (10) having a constricted portion formed by constricting the longitudinal central portion ...
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JP2023537587A |
Abrasive tool kits, equipment and methods are provided for bearing roller finishing of bearing rollers. The equipment includes a main body, an external circulation system, a polishing tool kit, and a fixture of the polishing tool kit. Th...
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JP7331510B2 |
To provide a processing method which is low-cost and enables a service life of a tool to be lengthened.A processing method using a grindstone comprises: an arranging step in which a grindstone 20 is arranged at a processing initial posit...
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JP7329496B2 |
A sealing apparatus which is capable of preventing static leakage of a target to be sealed without increasing sliding resistance with respect to a shaft, and a surface processing method of a disk member of the sealing apparatus which is ...
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JP2023114462A |
To provide an eccentric oscillation type speed reducer capable of suppressing degradation of service life of an eccentric body to solve a problem on shortening the service life of the eccentric body due to a processing condition in a cas...
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JP2023104445A |
To prevent a DAF and a protective member from adhering in a mark (a groove) for replacing a notch or the like.A processing method of a wafer, for reducing a thickness into a finishing thickness by grinding the wafer in which a structure ...
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JP7306818B2 |
To provide a fine frog manufacturing method that can form fine frogs by forming multiple columns with pointed tips on a surface of a workpiece.A fine frog manufacturing method of the present invention is constituted of at least an aspect...
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JP7293501B2 |
A device for the external machining of a workpiece (4) having a geometrically undefined cutting edge comprises a shoe (1) which is configured to press a rotationally symmetric workpiece (4) against a driver (7), wherein the shoe (1) has ...
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JP2023081458A |
To provide a film lapping processing device and a film lapping processing method that are capable of polishing a screw groove in a work of a screw shape with high accuracy.A film lapping processing device 100 is a film lapping processing...
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JP7285552B2 |
To provide a groove polishing body that can smoothly polish a groove surface of a groove formed on an object to be polished, without generating stripe-shape irregularities and can be easily prepared without needing special shaping-work s...
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JP2023075770A |
To provide a screw shaft polishing device that can evenly and accurately polish a male screw part of a screw shaft without causing any hindrance on polishing operation.A screw shaft polishing device 1 for polishing a male screw part 100b...
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JP7284535B1 |
The present invention reduces the work load of holding and releasing a polishing holder to and from an apparatus for polishing the end face of an optical fiber ferrule, which is repeated in each polishing process, by placing an offset ri...
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JP2023071253A |
To reduce a grinding amount of a wafer after a division original point formation.A processing method for processing a single crystal silicon wafer, in which a device is formed in each region that is formed so as to expose each specific c...
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JP7276027B2 |
An oscillating device includes: a driving source; an oscillating member which performs an oscillating motion; and a connecting mechanism which converts a rotational motion of the driving source into an oscillating motion and transmits th...
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JP2023063928A |
To provide a processing tool, a groove processing device, an elevator system and a groove processing method which can suppress the occurrence of clogging.A groove processing method according to the present disclosure comprises: an attach...
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JP2023061572A |
To provide a method for forming a reference mark, capable of easily forming a reference mark on a wafer without using a photoresist and a mask.A method for forming a reference mark includes: a processing device preparation step; a holdin...
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JP7264775B2 |
An embodiment of the invention of this application provides a polishing pad that eliminates a gap between an optical connector and a polishing film during polishing. A polishing pad of the embodiment is used by being placed between a pol...
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JP7263872B2 |
A method of producing a drill has a step of preparing a workpiece to be processed to produce a drill, and a step of forming a ground groove. The workpiece has a cutting blade, a chip discharge flute helically extending, and a rake surfac...
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JP7261088B2 |
To allow a life of a magnetic head to be extended and replacement frequency of the magnetic head to be reduced.A magnetic head polishing card 1 for maintaining a magnetic head is configured to comprise a magnetic stripe 2 on which data i...
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JP2023046599A |
To provide a film wrapping processing device which is capable of suitably polishing an entire range of a groove bottom of a screw for injection molding and improving work efficiency by automating complicated work when processing the scre...
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JP2023045378A |
To provide a slate polishing device capable of polishing a front layer of a wavy slate more accurately and also capable of suppressing scattering of dust generated in polishing.A polishing device includes: a brush member 22 that vertical...
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JP7241434B2 |
Carbon atoms of a single-crystal diamond and active abrasives are used to produce a chemical reaction to form carbides under a specific grinding condition of no higher than a graphitization temperature, and a hard abrasive is used to rem...
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JP2023033821A |
To provide a cam grinding data generation device for generating cam grinding data which enables highly accurately grinding of a cam ground surface.A smoothing processing unit 4 of a cam grinding data generation device 1 generates second ...
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JP2023029446A |
To provide a wafer grinding method and a wafer grinding device capable of thinning a wafer to a finished thickness.A wafer grinding method includes a rough grinding step of rough grinding the back surface of a wafer by rough grinding mea...
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JP7230575B2 |
To provide a tire polishing device and a polishing method, which can contribute to an improvement in productivity of tire.A tire polishing device 22 comprises: a rim part 24 for holding a tire 2; a rotary part 26 for rotating the rim par...
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JP3241044U |
The present invention provides a plastic bottle print peeling device that scrapes off print from the surface of the bottle to restore the bottle to its original color in order to recycle the plastic bottle. A support body 2 that presses ...
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JP7227270B2 |
The invention concerns a method and a grinding machine (4) for machining a workpiece (1) comprising a desired helical groove. The method comprises a step of grinding a calibration groove (12) on the surface (10) of the workpiece accordin...
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JP2023023263A |
To provide a cutting method of a substrate in which processing can be excellently done in step cut.A cutting method of substrate in which a substrate is cut along scheduled division lines by a cutting blade having a cutting blade on whic...
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JP2023506437A |
The machine tool comprises first and second rotary machine shafts (10, 16) which are parallel and mounted on the base in a fixed position relative to the base, and a linear machine carried by the first rotary machine shaft. An axis (8) a...
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JP2023019426A |
To provide a method for manufacturing an optical lens the shape accuracy of which is high, and the optical lens.Provided is a method for manufacturing an optical lens 10 which has a first optical plane 11a and a second optical plane 12a....
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JP7208691B1 |
[PROBLEMS] To improve maintainability and product life of an end face polishing device for an optical fiber ferrule by suppressing wear of a turntable and a thrust ring. Kind Code: A1 An apparatus for polishing an end face of an optical ...
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JP2023000305A |
To implement a DBG process without using a tape.A plate-like workpiece 20 in which lattice-like grooves 29 are formed on its surface 21 is held by suction using a suction surface 110 of a first jig chuck 100 having suction holes 111. Fur...
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JP2022551168A |
The present invention provides at least one dental tool (4) for finishing or prefinishing a dental restoration (5) at least completely along an equalizer (5a), with or without retaining stubs (5b). With respect to a method of machining a...
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